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Every Car Wash Electronic Repair Service by Industrial Repair Group is subjected to dynamic function testings to verify a successful repair and then backed by an Industrial Repair Group 18 Month Repair Warranty. Industrial Repair Group fully tests and replaces all high failure components such as ICs, PALs, EPROMs, GALs, and surface mounted components. Factory sealers and conformal coatings are re-applied as needed with each Car Wash Electronic Repair Service by Industrial Repair Group to restore your equipment back to its' OEM specs.

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At Industrial Repair Group, our goal is to offer the best repair in the industry and the most competitive quotes. Our wide selection of services and industry leading 18 month repair guarantee are sure to provide you with the perfect repair solution for all of your industrial needs. We specialize in industrial electronics, electric motor rebuilds, and complete customer satisfaction.

AC TECHNOLOGY INDRAMAT
ACCO BABCOCK INC INDRAMAT & STEGMANN
ACCO BRISTOL INELCO & HS ELECTRONIC
ACCU SORT INEX INC
ACME ELECTRIC & STANDARD POWER INC INLAND MOTOR
ACOPIAN ACRISONS INFRANOR
ACROMAG & MOORE PRODUCTS INGERSOLL RAND
ADEPT TECH INIVEN
ADTECH POWER INC INNOVATIVE TECHNOLOGY INC
ADVANCE BALLAST INTEL
ADVANCED MICRO CONTROLS INTERMEC
ADVANCED MOTION INTERNATIONAL POWER
AEROTECH & MOTOROLA INTROL DESIGN
AGASTAT IRCON
AGILENT ISHIDA
AGR ISI ROBOTICS
AIRCO ISSC
ALLEN BRADLEY ISSC & SCI
AMBITECH IND JOHNSON CONTROLS & YOKOGAWA
AMETEK KTRON
AMGRAPH KTRON & KB ELECTRONICS
AMICON KB ELECTRONICS
AMPROBE KB ELECTRONICS & RIMA
ANAHEIM AUTOMATION KEARNEY & TRECKER
ANALOGIC KEB COMBIVERT
ANDOVER CONTROLSANILAM & SEQUENTIAL INFO SYS KEB COMBIVERT & TOSHIBA
ANORAD KEITHLEY & HOLADAY
ANRITSU KEPCO
AO SMITH & MAGNETEK KEYENCE CORP
APC KIKUSUI
APPLIED AUTOMATION KME INSTACOLOR
APPLIED MATERIAL KNIEL
APPLIED MICORSYSTEMS KOEHLER COMPANY
APV AUTOMATION KONE
APW MCLEAN KONSBERG
ARBURG KRAUSS MAFFEI
ARCAIR KRISTEL CORPORATION
ARCOM LABOD ELECTRONICS
ARGUS LAMBDA
AROS ELECTRONICS LAMBDA & QUALIDYNE CORP
ARPECO LANTECH
ARTESYN TECHNOLOGIES LEESON ELECTRIC CO
ASCO & ITT LEESONA & ELECTRIC REGULATOR
ASEA BROWN BOVERI & STROMBERG LEINE & LINDE
ASHE CONTROLS LENORD & BAUER
ASI CONTROLS LENZE
ASI KEYSTONE & ANALOGIC LEROY SOMER
ASR SERVOTRON LESTER ELECTRIC
ASSOCIATED RESEARCH LEUZE
ASTROSYSTEMS LH RESEARCH
ATC LINCOLN ELECTRIC
ATHENA LITTON
ATLAS LOVE CONTROLS
ATLA COPCO LOVEHOY & BOSTON
AUTOCON TECHNOLGIES INC LOYOLA
AUTOMATED PACKAGING LUST ELECTRONICS
AUTOMATION DIRECT MAGNETEK
AUTOMATION INTELLIGENCE MAGNETEK & GEMCO ELECTRIC
AUTOMATIX MAN ROLAND
AVERY MAPLE SYSTEMS
AVG AUTOMATION MARKEM
AYDON CONTROLS MARQUIP
B & K MARSCH
B & R MAHTSUSHITA ELECTRIC & FANUC
BABCOCK & ASEA BROWN BOVERI MAZAK
BAKER PERKINS MCC ELECTRONICS
BALANCE ENGINEERING MEMOTEC
BALDOR & ASR SERVOTRON MERRICK SCALE
BALWIN & BEI INDUSTRIAL ENCODER METRA INSTRUMENTS
BALL ELECTRONIC METTLER TOLEDO
BALUFF MHI CORRUGATING MACHINERY
BALOGH MIBUDENKI
BANNER ENGINEERING MICRO MEMORY
BARBER COLMAN MICRO MOTION
BARBER COLMAN MICROSWITCH
BARDAC MICROSWITCH & HONEYWELL
BARKSDALE MIKI PULLEY & BOSTON
BARR MULLIN MILLER ELECTRIC
BASLER ELECTRIC & WESTINGHOUSE MILLER ELECTRIC & LINCOLN ELECTRIC
BAUMULLER MINARIK ELECTRIC CO
BEI INDUSTRIAL ENCODER MINARIK ELECTRIC CO & LEESON ELECTRIC CO
BENDIX DYNAPATH MITUSUBISHI
DENDIX SHEFFIELD MOELLER ELECTRIC
BENSHAW MOOG
BENTLEY NEVADA MONTWILL& SCHAFER
BERGER LAHR MOTOROLA
BEST POWER MOTORLA SEMICONDUCTOR
BIKOR CORP MOTORTRONICS
BK PRECISION MSA
BOBST MTS SYSTEMS CO
BOGEN COMMUNICATION MULLER MARTINI & GRAPHA ELECTRONIC
BOMAC MURR ELEKTRONIK
BORG WARNER & DANFOSS NACHI
BOSCH NATIONAL CONTROLS
BOSCHERT & ARTESYN TECHNOLOGIES NEMATRON CORP
BOSTON NEWPORT
BRANSON NEXT
BRIDGEPORT NIKKI DENSO
BURTON & EMERSON NIOBRARA R&D CORP
BUTLER AUTOMATIC NJE CORPORATION
CAROTRON NORDSON
CE INVALCO NORDSON & DANAHER CONTROLS
CHROMALOX NORTH AMERICAN MFG
CINCINNATI MILACRON & ADVANTAGE ELECTRONICS NORTHERN TELECOM
CLEAVELAND MOTION CONTROL NOVA
CONDOR NSD
CONRAC NUM
CONTRAVES NUMERIK
CONTREX OLEC
CONTROL CONCEPTS OKUMA
CONTROL TECHNOLGY INC OMEGA ENGINEERING
COSEL OMRON
COUTANT & LAMBDA OPTO 22
CROMPTON ORIENTAL MOTOR
CROWN ORMEC
CUSTOM SERVO OSG TAP & DIEP&H HARNISCHFEGER
CYBEREX PACKAGE CONTROLS
DANAHER CONTROLS PANALARM
DANAHER MOTION PARKER
DANFOSS & DART CONTROLS PAYNE ENGINEERING & BURTON
DART CONTROLS PEPPERL & FUCHS
DATA ACQUISITION SYS PJILLIPS & PHILLIPS PMA
DAYKIN PHOENIX CONTACT
DAYTRONIC PILZ
DEC PINNACLE SYSTEMS
DELTA PIONEER MAGNETICS
DELTA ELECTRONICS PLANAR SYSTEMS
DELTRON & POWER MATE POLYCOM
DEUTRONIC POLYSPEDE
DIGITEC POWER CONTROL SYSTEM
DISC INSTURMENTS & DANAHER CONTROLS POWER CONVERSION
DISPLAY TECH POWER ELECTRONICS
DOERR POWER GENERAL & WESTINGHOUSE
DOMINO PRINTING POWER MATE
DREXELBROOK POWER ONE
DRIVE CONTROL SYSTEMS POWER PROP
DUNKERMOTOREN POWER SOURCE
DYNAGE & BROWN & SHARPE POWER SWITCH CORP
DYNAMICS RESEARCH POWER SYSTEMS INC
DYNAPOWER & DANAHER CONTROLS POWER VOLT
DYNAPRO & FLUKE POWERTEC INDUSTIRAL MOTORS INC
DYNISCO PULS
EATON CORPORATION PYRAMID
EATON CORPORATION & DANAHER CONTROLS QEST
ECCI QUINDAR ELECTRONICS
EG&G RADIO ENERGIE
ELCIS RAMSEY TECHNOLOGY
ELCO RED LION CONTROLS & SABINA ELECTRIC
ELECTRIC REGULATOR RELIANCE ELECTRIC
ELECTRO CAM RENCO CORP
ELECTRO CRAFT & RELIANCE ELECTRIC ROBICON
ELECTROHOME ROSEMOUNT & WESTINGHOUSE
ELECTROL RTA PAVIA
ELECTROMOTIVE SABINA ELECTRIC
ELECTROSTATICS INC SAFTRONICS
ELGE SANYO
ELO TOUCH SYSTEMS SCHROFF & STYRKONSULT AB
ELPAC & CINCINNATI MILACRON SCI & ISSC
ELSTON ELECTRONICS SELTI
ELWOOD CORPORATION SEMCO
EMS INC SEQUENTIAL INFO SYS
ENCODER PRODUCTS SEW EURODRIVE & TOSHIBA
ETA SHINDENGEN
EUROTHERM CONTROLS SICK OPTIC ELECTRONIC
EXOR SIEMENS
FANUC SIEMENS MOORE
FANUC & GENERAL ELECTRIC SIERRACIN POWER SYSTEMS
FENWAL SIGMA INSTRUMENTS INC
FIFE CORP SMC & CONAIRSOCAPEL
FIREYE & ITT SOLA ELECTRIC
FIRING CIRCUITS SOLITECH
FISCHER & PORTER SONY
FISHER CONTROLS SORENSEN
FLUKE STANDARD POWER INC
FORNEY STATIC CONTROL SYSTEMS
FOXBORO STEGMANN & INDRAMAT
FOXBORO & BALSBAUGH SUMITOMO MACHINERY INC & TOSHIBA
FUJI ELECTRIC SUMTAK CORP
FUTEC SUNX LTD
GAI & ASEA BROWN BOVERI SUPERIOR ELECTRIC
GALIL MOTION CONTROLS SWEO ENGINEERING & ROCHESTER INSTRUMENT SYSTEMS
GD CALIFORNIA INC T&R ELECTRIC & SYRON ENGINEERING
GEM80 TAMAGAWA & RELIANCE ELECTRIC
GENERAL ELECTRIC TAPESWITCH
GENERAL ELECTRIC & FANUC TB WOODS & FUJI ELECTRIC
GIDDINGS & LEWIS TDK
GLENTEK TECNO ELETTRONICA
GOLDSTAR TECTROL
GORING KERR TEIJIN SEIKI
GOSSEN TEKEL
GRAHAM TODD PRODUCTS CORP
GRAINGER TOEI ELECTRIC
GRAPHA ELECTRONIC TOSHIBA
GREAT LAKES INSTRUMENTS TOTKU ELECTRIC & GENERAL ELECTRIC
GROUPE SCHNEIDER TRACO ENGINEERING
HAAS UNICO
HAMMOND UNIPOWER
HATHAWAY VAREC
HAYSEEN VECTOR VID
HEIDELBERG VERO ELECTRONICS & TELEMOTIVE
HEIDENHAIN CORP VIDEO JET
HIRATA VIEW TRONIX
HITACHI & FANUC VIVID
HITRON ELECTRONICS VOLGEN & POWER SOURCE
HOBART BROTHERS CO WARNER ELECTRIC & EMERSON
HOHER AUTOMATION WESTAMP INC & WESTINGHOUSE
HONEYWELL WESTINGHOUSE
HONEYWELL & NEMATRON CORP WHEDCO
HORNER ELECTRIC WIRE ELECTRIC
HUBBELL & FEMCO XENTEK INC
HUBNER & AMICON XYCOM & WARNER ELECTRIC
HURCO MFG CO YASKAWA ELECTRIC
IEE ZENITH
IMMERSION CORPORATION ZYCRON

How Circuit Boards Work

Thank you for choosing Industrial Repair Group. If you would like a printable version of How Circuit Boards Operate, please follow this link: IRG-Circuit-Boards

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Part of a 1983 Sinclair ZX Spectrum computer board; a populated PCB, showing the conductive traces, vias (the through-hole paths to the other surface), and some mounted electrical components

A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, tracks or signal traces etched from copper sheets laminated onto a non-conductive substrate. It is also referred to as printed wiring board (PWB) or etched wiring board. A PCB populated with electronic components is a printed circuit assembly (PCA), also known as a printed circuit board assembly (PCBA). Printed circuit boards are used in virtually all but the simplest commercially-produced electronic devices.

PCBs are inexpensive, and can be highly reliable. They require much more layout effort and higher initial cost than either wire wrap or point-to-point construction, but are much cheaper and faster for high-volume production; the production and soldering of PCBs can be done by totally automated equipment. Much of the electronics industry’s PCB design, assembly, and quality control needs are set by standards that are published by the IPC organization.

History

The inventor of the printed circuit was the Austrian engineer Paul Eisler who, while working in England, made one circa 1936 as part of a radio set. Around 1943 the USA began to use the technology on a large scale to make rugged radios for use in World War II. After the war, in 1948, the USA released the invention for commercial use. Printed circuits did not become commonplace in consumer electronics until the mid-1950s, after the Auto-Sembly process was developed by the United States Army.

Before printed circuits (and for a while after their invention), point-to-point construction was used. For prototypes, or small production runs, wire wrap or turret board can be more efficient. Predating the printed circuit invention, and similar in spirit, was John Sargrove’s 1936-1947 Electronic Circuit Making Equipment (ECME) which sprayed metal onto a Bakelite plastic board. The ECME could produce 3 radios per minute.

During World War II, the development of the anti-aircraft proximity fuse required an electronic circuit that could withstand being fired from a gun, and could be produced in quantity. The Centralab Division of Globe Union submitted a proposal which met the requirements: a ceramic plate would be screenprinted with metallic paint for conductors and carbon material for resistors, with ceramic disc capacitors and subminiature vacuum tubes soldered in place.[1]

Originally, every electronic component had wire leads, and the PCB had holes drilled for each wire of each component. The components’ leads were then passed through the holes and soldered to the PCB trace. This method of assembly is called through-hole construction. In 1949, Moe Abramson and Stanislaus F. Danko of the United States Army Signal Corps developed the Auto-Sembly process in which component leads were inserted into a copper foil interconnection pattern and dip soldered. With the development of board lamination and etching techniques, this concept evolved into the standard printed circuit board fabrication process in use today. Soldering could be done automatically by passing the board over a ripple, or wave, of molten solder in a wave-soldering machine. However, the wires and holes are wasteful since drilling holes is expensive and the protruding wires are merely cut off.

In recent years, the use of surface mount parts has gained popularity as the demand for smaller electronics packaging and greater functionality has grown.

Manufacturing

Materials

 

A PCB as a design on a computer (left) and realized as a board assembly populated with components (right). The board is double sided, with through-hole plating, green solder resist, and white silkscreen printing. Both surface mount and through-hole components have been used.

 

A PCB in a computer mouse. The Component Side (left) and the printed side (right).

 

The Component Side of a PCB in a computer mouse; some examples for common components and their reference designations on the silk screen.

Conducting layers are typically made of thin copper foil. Insulating layers dielectric are typically laminated together with epoxy resin prepreg. The board is typically coated with a solder mask that is green in color. Other colors that are normally available are blue, black, white and red. There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known prepreg materials used in the PCB industry are FR-2 (Phenolic cotton paper), FR-3 (Cotton paper and epoxy), FR-4 (Woven glass and epoxy), FR-5 (Woven glass and epoxy), FR-6 (Matte glass and polyester), G-10 (Woven glass and epoxy), CEM-1 (Cotton paper and epoxy), CEM-2 (Cotton paper and epoxy), CEM-3 (Woven glass and epoxy), CEM-4 (Woven glass and epoxy), CEM-5 (Woven glass and polyester). Thermal expansion is an important consideration especially with BGA and naked die technologies, and glass fiber offers the best dimensional stability.

FR-4 is by far the most common material used today. The board with copper on it is called “copper-clad laminate”.

Copper foil thickness can be specified in ounces per square foot or micrometres. One ounce per square foot is 1.344 mils or 34 micrometres.

Patterning (etching)

The vast majority of printed circuit boards are made by bonding a layer of copper over the entire substrate, sometimes on both sides, (creating a “blank PCB”) then removing unwanted copper after applying a temporary mask (e.g. by etching), leaving only the desired copper traces. A few PCBs are made by adding traces to the bare substrate (or a substrate with a very thin layer of copper) usually by a complex process of multiple electroplating steps. The PCB manufacturing method primarily depends on whether it is for production volume or sample/prototype quantities.

Commercial (production quantities, usually PTH)

  • silk screen printing -the main commercial method.
  • Photographic methods. Used when fine linewidths are required.

Hobbyist/prototype (small quantities, usually not PTH)

  • Laser-printed resist: Laser-print onto paper (or wax paper), heat-transfer with an iron or modified laminator onto bare laminate, then etch.
  • Print onto transparent film and use as photomask along with photo-sensitized boards. (i.e. pre-sensitized boards), Then etch. (Alternatively, use a film photoplotter).
  • Laser resist ablation: Spray black paint onto copper clad laminate, place into CNC laser plotter. The laser raster-scans the PCB and ablates (vaporizes) the paint where no resist is wanted. Etch. (Note: laser copper ablation is rarely used and is considered experimental.)
  • Use a CNC-mill with a spade-shaped (i.e. 45-degree) cutter or miniature end-mill to route away the undesired copper, leaving only the traces.

There are three common “subtractive” methods (methods that remove copper) used for the production of printed circuit boards:

  1. Silk screen printing uses etch-resistant inks to protect the copper foil. Subsequent etching removes the unwanted copper. Alternatively, the ink may be conductive, printed on a blank (non-conductive) board. The latter technique is also used in the manufacture of hybrid circuits.
  2. Photoengraving uses a photomask and developer to selectively remove a photoresist coating. The remaining photoresist protects the copper foil. Subsequent etching removes the unwanted copper. The photomask is usually prepared with a photoplotter from data produced by a technician using CAM, or computer-aided manufacturing software. Laser-printed transparencies are typically employed for phototools; however, direct laser imaging techniques are being employed to replace phototools for high-resolution requirements.
  3. PCB milling uses a two or three-axis mechanical milling system to mill away the copper foil from the substrate. A PCB milling machine (referred to as a ‘PCB Prototyper’) operates in a similar way to a plotter, receiving commands from the host software that control the position of the milling head in the x, y, and (if relevant) z axis. Data to drive the Prototyper is extracted from files generated in PCB design software and stored in HPGL or Gerber file format.

“Additive” processes also exist. The most common is the “semi-additive” process. In this version, the unpatterned board has a thin layer of copper already on it. A reverse mask is then applied. (Unlike a subtractive process mask, this mask exposes those parts of the substrate that will eventually become the traces.) Additional copper is then plated onto the board in the unmasked areas; copper may be plated to any desired weight. Tin-lead or other surface platings are then applied. The mask is stripped away and a brief etching step removes the now-exposed original copper laminate from the board, isolating the individual traces. Some boards with plated through holes but still single sided were made with a process like this. General Electric made consumer radio sets in the late 1960s using boards like these.

The additive process is commonly used for multi-layer boards as it facilitates the plating-through of the holes (to produce conductive vias) in the circuit board.

  • PCB copper electroplating machine for adding copper to the in-process PCB

  • PCB’s in process of adding copper via electroplating

The dimensions of the copper conductors of the printed circuit board is related to the amount of current the conductor must carry. Each trace consists of a flat, narrow part of the copper foil that remains after etching. Signal traces are usually narrower than power or ground traces because their current carrying requirements are usually much less. In a multi-layer board one entire layer may be mostly solid copper to act as a ground plane for shielding and power return. For printed circuit boards that contain microwave circuits, transmission lines can be laid out in the form of stripline and microstrip with carefully-controlled dimensions to assure a consistent impedance. In radio-frequency circuits the inductance and capacitance of the printed circuit board conductors can be used as a delibrate part of the circuit design, obviating the need for additional discrete components.

Etching

Chemical etching is done with ferric chloride, ammonium persulfate, or sometimes hydrochloric acid. For PTH (plated-through holes), additional steps of electroless deposition are done after the holes are drilled, then copper is electroplated to build up the thickness, the boards are screened, and plated with tin/lead. The tin/lead becomes the resist leaving the bare copper to be etched away.

Lamination

Some PCBs have trace layers inside the PCB and are called multi-layer PCBs. These are formed by bonding together separately etched thin boards.

Drilling

Holes through a PCB are typically drilled with tiny drill bits made of solid tungsten carbide. The drilling is performed by automated drilling machines with placement controlled by a drill tape or drill file. These computer-generated files are also called numerically controlled drill (NCD) files or “Excellon files”. The drill file describes the location and size of each drilled hole. These holes are often filled with annular rings (hollow rivets) to create vias. Vias allow the electrical and thermal connection of conductors on opposite sides of the PCB.

Most common laminate is epoxy filled fiberglass. Drill bit wear is partly due to embedded glass, which is harder than steel. High drill speed necessary for cost effective drilling of hundreds of holes per board causes very high temperatures at the drill bit tip, and high temperatures (400-700 degrees) soften steel and decompose (oxidize) laminate filler. Copper is softer than epoxy and interior conductors may suffer damage during drilling.

When very small vias are required, drilling with mechanical bits is costly because of high rates of wear and breakage. In this case, the vias may be evaporated by lasers. Laser-drilled vias typically have an inferior surface finish inside the hole. These holes are called micro vias.

It is also possible with controlled-depth drilling, laser drilling, or by pre-drilling the individual sheets of the PCB before lamination, to produce holes that connect only some of the copper layers, rather than passing through the entire board. These holes are called blind vias when they connect an internal copper layer to an outer layer, or buried vias when they connect two or more internal copper layers and no outer layers.

The walls of the holes, for boards with 2 or more layers, are made conductive then plated with copper to form plated-through holes that electrically connect the conducting layers of the PCB. For multilayer boards, those with 4 layers or more, drilling typically produces a smear of the high temperature decomposition products of bonding agent in the laminate system. Before the holes can be plated through, this smear must be removed by a chemical de-smear process, or by plasma-etch. Removing (etching back) the smear also reveals the interior conductors as well.

Exposed conductor plating and coating

PCBs[2] are plated with solder, tin, or gold over nickel as a resist for etching away the unneeded underlying copper.[3]

After PCBs are etched and then rinsed with water, the soldermask is applied, and then any exposed copper is coated with solder, nickel/gold, or some other anti-corrosion coating.[4][5]

Matte solder is usually fused to provide a better bonding surface or stripped to bare copper. Treatments, such as benzimidazolethiol, prevent surface oxidation of bare copper. The places to which components will be mounted are typically plated, because untreated bare copper oxidizes quickly, and therefore is not readily solderable. Traditionally, any exposed copper was coated with solder by hot air solder levelling (HASL). The HASL finish prevents oxidation from the underlying copper, thereby guaranteeing a solderable surface.[6] This solder was a tin-lead alloy, however new solder compounds are now used to achieve compliance with the RoHS directive in the EU and US, which restricts the use of lead. One of these lead-free compounds is SN100CL, made up of 99.3% tin, 0.7% copper, 0.05% nickel, and a nominal of 60ppm germanium.

It is important to use solder compatible with both the PCB and the parts used. An example is Ball Grid Array (BGA) using tin-lead solder balls for connections losing their balls on bare copper traces or using lead-free solder paste.

Other platings used are OSP (organic surface protectant), immersion silver (IAg), immersion tin, electroless nickel with immersion gold coating (ENIG), and direct gold plating (over nickel). Edge connectors, placed along one edge of some boards, are often nickel plated then gold plated. Another coating consideration is rapid diffusion of coating metal into Tin solder. Tin forms intermetallics such as Cu5Sn6 and Ag3Cu that dissolve into the Tin liquidus or solidus(@50C), stripping surface coating and/or leaving voids.

Electrochemical migration (ECM) is the growth of conductive metal filaments on or in a printed circuit board (PCB) under the influence of a DC voltage bias.[7][8] Silver, zinc, and aluminum are known to grow whiskers under the influence of an electric field. Silver also grows conducting surface paths in the presence of halide and other ions, making it a poor choice for electronics use. Tin will grow “whiskers” due to tension in the plated surface. Tin-Lead or Solder plating also grows whiskers, only reduced by the percentage Tin replaced. Reflow to melt solder or tin plate to relieve surface stress lowers whisker incidence. Another coating issue is tin pest, the transformation of tin to a powdery allotrope at low temperature.[9]

Solder resist

Areas that should not be soldered may be covered with a polymer solder resist (solder mask) coating. The solder resist prevents solder from bridging between conductors and creating short circuits. Solder resist also provides some protection from the environment. Solder resist is typically 20-30 micrometres thick.

Screen printing

Line art and text may be printed onto the outer surfaces of a PCB by screen printing. When space permits, the screen print text can indicate component designators, switch setting requirements, test points, and other features helpful in assembling, testing, and servicing the circuit board.

Screen print is also known as the silk screen, or, in one sided PCBs, the red print.

Lately some digital printing solutions have been developed to substitute the traditional screen printing process. This technology allows printing variable data onto the PCB, including serialization and barcode information for traceability purposes.

Test

Unpopulated boards may be subjected to a bare-board test where each circuit connection (as defined in a netlist) is verified as correct on the finished board. For high-volume production, a Bed of nails tester, a fixture or a Rigid needle adapter is used to make contact with copper lands or holes on one or both sides of the board to facilitate testing. A computer will instruct the electrical test unit to apply a small voltage to each contact point on the bed-of-nails as required, and verify that such voltage appears at other appropriate contact points. A “short” on a board would be a connection where there should not be one; an “open” is between two points that should be connected but are not. For small- or medium-volume boards, flying probe and flying-grid testers use moving test heads to make contact with the copper/silver/gold/solder lands or holes to verify the electrical connectivity of the board under test.

Printed circuit assembly

After the printed circuit board (PCB) is completed, electronic components must be attached to form a functional printed circuit assembly,[10][11] or PCA (sometimes called a “printed circuit board assembly” PCBA). In through-hole construction, component leads are inserted in holes. In surface-mount construction, the components are placed on pads or lands on the outer surfaces of the PCB. In both kinds of construction, component leads are electrically and mechanically fixed to the board with a molten metal solder.

There are a variety of soldering techniques used to attach components to a PCB. High volume production is usually done with machine placement and bulk wave soldering or reflow ovens, but skilled technicians are able to solder very tiny parts (for instance 0201 packages which are 0.02 in. by 0.01 in.)[12] by hand under a microscope, using tweezers and a fine tip soldering iron for small volume prototypes. Some parts are impossible to solder by hand, such as ball grid array (BGA) packages.

Often, through-hole and surface-mount construction must be combined in a single assembly because some required components are available only in surface-mount packages, while others are available only in through-hole packages. Another reason to use both methods is that through-hole mounting can provide needed strength for components likely to endure physical stress, while components that are expected to go untouched will take up less space using surface-mount techniques.

After the board has been populated it may be tested in a variety of ways:

  • While the power is off, visual inspection, automated optical inspection. JEDEC guidelines for PCB component placement, soldering, and inspection are commonly used to maintain quality control in this stage of PCB manufacturing.
  • While the power is off, analog signature analysis, power-off testing.
  • While the power is on, in-circuit test, where physical measurements (i.e. voltage, frequency) can be done.
  • While the power is on, functional test, just checking if the PCB does what it had been designed for.

To facilitate these tests, PCBs may be designed with extra pads to make temporary connections. Sometimes these pads must be isolated with resistors. The in-circuit test may also exercise boundary scan test features of some components. In-circuit test systems may also be used to program nonvolatile memory components on the board.

In boundary scan testing, test circuits integrated into various ICs on the board form temporary connections between the PCB traces to test that the ICs are mounted correctly. Boundary scan testing requires that all the ICs to be tested use a standard test configuration procedure, the most common one being the Joint Test Action Group (JTAG) standard. The JTAG test architecture provides a means to test interconnects between integrated circuits on a board without using physical test probes. JTAG tool vendors provide various types of stimulus and sophisticated algorithms, not only to detect the failing nets, but also to isolate the faults to specific nets, devices, and pins.[13]

When boards fail the test, technicians may desolder and replace failed components, a task known as rework.

Protection and packaging

PCBs intended for extreme environments often have a conformal coating, which is applied by dipping or spraying after the components have been soldered. The coat prevents corrosion and leakage currents or shorting due to condensation. The earliest conformal coats were wax; modern conformal coats are usually dips of dilute solutions of silicone rubber, polyurethane, acrylic, or epoxy. Another technique for applying a conformal coating is for plastic to be sputtered onto the PCB in a vacuum chamber. The chief disadvantage of conformal coatings is that servicing of the board is rendered extremely difficult.[14]

Many assembled PCBs are static sensitive, and therefore must be placed in antistatic bags during transport. When handling these boards, the user must be grounded (earthed). Improper handling techniques might transmit an accumulated static charge through the board, damaging or destroying components. Even bare boards are sometimes static sensitive. Traces have become so fine that it’s quite possible to blow an etch off the board (or change its characteristics) with a static charge. This is especially true on non-traditional PCBs such as MCMs and microwave PCBs.

Design

  • Schematic capture or schematic entry is done through an EDA tool.
  • Card dimensions and template are decided based on required circuitry and case of the PCB. Determine the fixed components and heat sinks if required.
  • Deciding stack layers of the PCB. 4 to 12 layers or more depending on design complexity. Ground plane and Power plane are decided. Signal planes where signals are routed are in top layer as well as internal layers.[15]
  • Line impedance determination using dielectric layer thickness, routing copper thickness and trace-width. Trace separation also taken into account in case of differential signals. Microstrip, stripline or dual stripline can be used to route signals.
  • Placement of the components. Thermal considerations and geometry are taken into account. Vias and lands are marked.
  • Routing the signal trace. For optimal EMI performance high frequency signals are routed in internal layers between power or ground planes as power plane behaves as ground for AC.
  • Gerber file generation for manufacturing.

Safety certification (US)

Safety Standard UL 796 covers component safety requirements for printed wiring boards for use as components in devices or appliances. Testing analyzes characteristics such as flammability, maximum operating temperature, electrical tracking, heat deflection, and direct support of live electrical parts.

“Cordwood” construction

 

A cordwood module.

Cordwood construction can save significant space and was often used with wire-ended components in applications where space was at a premium (such as missile guidance and telemetry systems) and in high-speed computers, where short traces were important. In “cordwood” construction, axial-leaded components were mounted between two parallel planes. The components were either soldered together with jumper wire, or they were connected to other components by thin nickel ribbon welded at right angles onto the component leads. To avoid shorting together different interconnection layers, thin insulating cards were placed between them. Perforations or holes in the cards allowed component leads to project through to the next interconnection layer. One disadvantage of this system was that special nickel leaded components had to be used to allow the interconnecting welds to be made. Some versions of cordwood construction used single sided PCBs as the interconnection method (as pictured). This meant that normal leaded components could be used. Another disadvantage of this system is that components located in the interior are difficult to replace.

Before the advent of integrated circuits, this method allowed the highest possible component packing density; because of this, it was used by a number of computer vendors including Control Data Corporation. The cordwood method of construction now appears to have fallen into disuse, probably because high packing densities can be more easily achieved using surface mount techniques and integrated circuits.

Multiwire boards

Multiwire is a patented technique of interconnection which uses machine-routed insulated wires embedded in a non-conducting matrix (often plastic resin). It was used during the 1980s and 1990s. (Kollmorgen Technologies Corp., U.S. Patent 4,175,816) Multiwire is still available in 2010 through Hitachi. There are other competitive discrete wiring technologies that have been developed (Jumatech [2]).

Since it was quite easy to stack interconnections (wires) inside the embedding matrix, the approach allowed designers to forget completely about the routing of wires (usually a time-consuming operation of PCB design): Anywhere the designer needs a connection, the machine will draw a wire in straight line from one location/pin to another. This led to very short design times (no complex algorithms to use even for high density designs) as well as reduced crosstalk (which is worse when wires run parallel to each other—which almost never happens in Multiwire), though the cost is too high to compete with cheaper PCB technologies when large quantities are needed.

Surface-mount technology

Main article: Surface-mount technology
 

Surface mount components, including resistors, transistors and an integrated circuit

Surface-mount technology emerged in the 1960s, gained momentum in the early 1980s and became widely used by the mid 1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly on to the PCB surface. Components became much smaller and component placement on both sides of the board became more common than with through-hole mounting, allowing much higher circuit densities. Surface mounting lends itself well to a high degree of automation, reducing labour costs and greatly increasing production and quality rates. Carrier Tapes provide a stable and protective environment for Surface mount devices (SMDs) which can be one-quarter to one-tenth of the size and weight, and passive components can be one-half to one-quarter of the cost of corresponding through-hole parts. However, integrated circuits are often priced the same regardless of the package type, because the chip itself is the most expensive part. As of 2006, some wire-ended components, such as small-signal switch diodes, e.g. 1N4148, are actually significantly cheaper than corresponding SMD versions.

See also

Nuvola apps ksim.png Electronics portal
 

Schematic Capture. (KiCAD)

 

PCB layout. (KiCAD)

 

3D View. (KiCAD)

  • Breadboard
  • C.I.D.+
  • Design for manufacturability (PCB)
  • Electronic packaging
  • Electronic waste
  • Multi-Chip Module
  • Occam Process – another process for the manufacturing of PCBs
PCB Materials
  • Conductive ink
  • Heavy copper
  • Laminate materials:
    • BT-Epoxy
    • Composite epoxy material, CEM-1,5
    • Cyanate Ester
    • FR-2
    • FR-4, the most common PCB material
    • Polyimide
    • PTFE, Polytetrafluoroethylene (Teflon)
PCB layout software
  • List of EDA companies
  • Comparison of EDA software

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Category : AC, DC, VFD, Servo Drives | Analog Circuit Board Repair | Electronic repair service | Electronic Repair Services | Industrial Controls Repair | Industrial Repair Group | Industrial Repair Service | Blog
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Industrial Repair Group delivers fast and reliable Wascomat Inverter Drive Repair (Laundry VFD Repair Service) Service. We understand that damaged equipment can wreak havoc on your bottom line. We pride ourselves by delivering guaranteed repairs and fast turn around times when you need it most. We do this by partnering with you on each and every repair.

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HUBNER & AMICON XYCOM & WARNER ELECTRIC
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How Variable Freq. Drives Work

Thank you for choosing Industrial Repair Group. If you would like a printable version of How Variable Frequency Drives Operate, please follow this link: IRG-Variable-Frequency-Drive

How Variable-Frequency Drives Operate

A variable-frequency drive (VFD) is a system for controlling the rotational speed of an alternating current (AC) electric motor by controlling the frequency of the electrical power supplied to the motor.[1][2][3] A variable frequency drive is a specific type of adjustable-speed drive. Variable-frequency drives are also known as adjustable-frequency drives (AFD), variable-speed drives (VSD), AC drives, microdrives or inverter drives. Since the voltage is varied along with frequency, these are sometimes also called VVVF (variable voltage variable frequency) drives.

Variable-frequency drives are widely used. In ventilation systems for large buildings, variable-frequency motors on fans save energy by allowing the volume of air moved to match the system demand. They are also used on pumps, elevator, conveyor and machine tool drives.

VFD types

All VFDs use their output devices (IGBTs, transistors, thyristors) only as switches, turning them only on or off. Using a linear device such as a transistor in its linear mode is impractical for a VFD drive, since the power dissipated in the drive devices would be about as much as the power delivered to the load.

Drives can be classified as:

  • Constant voltage
  • Constant current
  • Cycloconverter

In a constant voltage converter, the intermediate DC link voltage remains approximately constant during each output cycle. In constant current drives, a large inductor is placed between the input rectifier and the output bridge, so the current delivered is nearly constant. A cycloconverter has no input rectifier or DC link and instead connects each output terminal to the appropriate input phase.

The most common type of packaged VF drive is the constant-voltage type, using pulse width modulation to control both the frequency and effective voltage applied to the motor load.

VFD system description

VFD system

A variable frequency drive system generally consists of an AC motor, a controller and an operator interface.[4][5]

VFD motor

The motor used in a VFD system is usually a three-phase induction motor. Some types of single-phase motors can be used, but three-phase motors are usually preferred. Various types of synchronous motors offer advantages in some situations, but induction motors are suitable for most purposes and are generally the most economical choice. Motors that are designed for fixed-speed operation are often used. Certain enhancements to the standard motor designs offer higher reliability and better VFD performance, such as MG-31 rated motors.[6]

VFD controller

Variable frequency drive controllers are solid state electronic power conversion devices. The usual design first converts AC input power to DC intermediate power using a rectifier or converter bridge. The rectifier is usually a three-phase, full-wave-diode bridge. The DC intermediate power is then converted to quasi-sinusoidal AC power using an inverter switching circuit. The inverter circuit is probably the most important section of the VFD, changing DC energy into three channels of AC energy that can be used by an AC motor. These units provide improved power factor, less harmonic distortion, and low sensitivity to the incoming phase sequencing than older phase controlled converter VFD’s. Since incoming power is converted to DC, many units will accept single-phase as well as three-phase input power (acting as a phase converter as well as a speed controller); however the unit must be derated when using single phase input as only part of the rectifier bridge is carrying the connected load.[7]

As new types of semiconductor switches have been introduced, these have promptly been applied to inverter circuits at all voltage and current ratings for which suitable devices are available. Introduced in the 1980s, the insulated-gate bipolar transistor (IGBT) became the device used in most VFD inverter circuits in the first decade of the 21st century.[8][9][10]

AC motor characteristics require the applied voltage to be proportionally adjusted whenever the frequency is changed in order to deliver the rated torque. For example, if a motor is designed to operate at 460 volts at 60 Hz, the applied voltage must be reduced to 230 volts when the frequency is reduced to 30 Hz. Thus the ratio of volts per hertz must be regulated to a constant value (460/60 = 7.67 V/Hz in this case). For optimum performance, some further voltage adjustment may be necessary especially at low speeds, but constant volts per hertz is the general rule. This ratio can be changed in order to change the torque delivered by the motor.[11]

In addition to this simple volts per hertz control more advanced control methods such as vector control and direct torque control (DTC) exist. These methods adjust the motor voltage in such a way that the magnetic flux and mechanical torque of the motor can be precisely controlled.

The usual method used to achieve variable motor voltage is pulse-width modulation (PWM). With PWM voltage control, the inverter switches are used to construct a quasi-sinusoidal output waveform by a series of narrow voltage pulses with pseudosinusoidal varying pulse durations.[8][12]

Operation of the motors above rated name plate speed (base speed) is possible, but is limited to conditions that do not require more power than nameplate rating of the motor. This is sometimes called “field weakening” and, for AC motors, means operating at less than rated volts/hertz and above rated name plate speed. Permanent magnet synchronous motors have quite limited field weakening speed range due to the constant magnet flux linkage. Wound rotor synchronous motors and induction motors have much wider speed range. For example, a 100 hp, 460 V, 60 Hz, 1775 RPM (4 pole) induction motor supplied with 460 V, 75 Hz (6.134 V/Hz), would be limited to 60/75 = 80% torque at 125% speed (2218.75 RPM) = 100% power.[13] At higher speeds the induction motor torque has to be limited further due to the lowering of the breakaway torque of the motor. Thus rated power can be typically produced only up to 130…150 % of the rated name plate speed. Wound rotor synchronous motors can be run even higher speeds. In rolling mill drives often 200…300 % of the base speed is used. Naturally the mechanical strength of the rotor and lifetime of the bearings is also limiting the maximum speed of the motor. It is recommended to consult the motor manufacturer if more than 150 % speed is required by the application.

PWM VFD Output Voltage Waveform

An embedded microprocessor governs the overall operation of the VFD controller. The main microprocessor programming is in firmware that is inaccessible to the VFD user. However, some degree of configuration programming and parameter adjustment is usually provided so that the user can customize the VFD controller to suit specific motor and driven equipment requirements.[8]

VFD operator interface

The operator interface provides a means for an operator to start and stop the motor and adjust the operating speed. Additional operator control functions might include reversing and switching between manual speed adjustment and automatic control from an external process control signal. The operator interface often includes an alphanumeric display and/or indication lights and meters to provide information about the operation of the drive. An operator interface keypad and display unit is often provided on the front of the VFD controller as shown in the photograph above. The keypad display can often be cable-connected and mounted a short distance from the VFD controller. Most are also provided with input and output (I/O) terminals for connecting pushbuttons, switches and other operator interface devices or control signals. A serial communications port is also often available to allow the VFD to be configured, adjusted, monitored and controlled using a computer.[8][14][15]

VFD operation

When an induction motor is connected to a full voltage supply, it draws several times (up to about 6 times) its rated current. As the load accelerates, the available torque usually drops a little and then rises to a peak while the current remains very high until the motor approaches full speed.

By contrast, when a VFD starts a motor, it initially applies a low frequency and voltage to the motor. The starting frequency is typically 2 Hz or less. Thus starting at such a low frequency avoids the high inrush current that occurs when a motor is started by simply applying the utility (mains) voltage by turning on a switch. After the start of the VFD, the applied frequency and voltage are increased at a controlled rate or ramped up to accelerate the load without drawing excessive current. This starting method typically allows a motor to develop 150% of its rated torque while the VFD is drawing less than 50% of its rated current from the mains in the low speed range. A VFD can be adjusted to produce a steady 150% starting torque from standstill right up to full speed.[16] Note, however, that cooling of the motor is usually not good in the low speed range. Thus running at low speeds even with rated torque for long periods is not possible due to overheating of the motor. If continuous operation with high torque is required in low speeds an external fan is usually needed. The manufacturer of the motor and/or the VFD should specify the cooling requirements for this mode of operation.

In principle, the current on the motor side is in direct proportion of the torque that is generated and the voltage on the motor is in direct proportion of the actual speed, while on the network side, the voltage is constant, thus the current on line side is in direct proportion of the power drawn by the motor, that is U.I or C.N where C is torque and N the speed of the motor (we shall consider losses as well, neglected in this explanation).

(1) n stands for network (grid) and m for motor

(2) C stands for torque [Nm], U for voltage [V], I for current [A], and N for speed [rad/s]

We neglect losses for the moment :

Un.In = Um.Im (same power drawn from network and from motor)

Um.Im = Cm.Nm (motor mechanical power = motor electrical power)

Given Un is a constant (network voltage) we conclude : In = Cm.Nm/Un That is “line current (network) is in direct proportion of motor power”.

With a VFD, the stopping sequence is just the opposite as the starting sequence. The frequency and voltage applied to the motor are ramped down at a controlled rate. When the frequency approaches zero, the motor is shut off. A small amount of braking torque is available to help decelerate the load a little faster than it would stop if the motor were simply switched off and allowed to coast. Additional braking torque can be obtained by adding a braking circuit (resistor controlled by a transistor) to dissipate the braking energy. With 4-quadrants rectifiers (active-front-end), the VFD is able to brake the load by applying a reverse torque and reverting the energy back to the network.

Power line harmonics

While PWM allows for nearly sinusoidal currents to be applied to a motor load, the diode rectifier of the VFD takes roughly square-wave current pulses out of the AC grid, creating harmonic distortion in the power line voltage. When the VFD load size is small and the available utility power is large, the effects of VFD systems slicing small chunks out of AC grid generally go unnoticed. Further, in low voltage networks the harmonics caused by single phase equipment such as computers and TVs are such that they are partially cancelled by three-phase diode bridge harmonics.

However, when either a large number of low-current VFDs, or just a few very large-load VFDs are used, they can have a cumulative negative impact on the AC voltages available to other utility customers in the same grid.

When the utility voltage becomes misshapen and distorted the losses in other loads such as normal AC motors are increased. This may in the worst case lead to overheating and shorter operation life. Also substation transformers and compensation capacitors are affected, the latter especially if resonances are aroused by the harmonics.

In order to limit the voltage distortion the owner of the VFDs may be required to install filtering equipment to smooth out the irregular waveform. Alternately, the utility may choose to install filtering equipment of its own at substations affected by the large amount of VFD equipment being used. In high power installations decrease of the harmonics can be obtained by supplying the VSDs from transformers that have different phase shift.[17]

Further, it is possible to use instead of the diode rectifier a similar transistor circuit that is used to control the motor. This kind of rectifier is called active infeed converter in IEC standards. However, manufacturers call it by several names such as active rectifier, ISU (IGBT Supply Unit), AFE (Active Front End) or four quadrant rectifier. With PWM control of the transistors and filter inductors in the supply lines the AC current can be made nearly sinusoidal. Even better attenuation of the harmonics can be obtained by using an LCL (inductor-capacitor-inductor) filter instead of single three-phase filter inductor.

Additional advantage of the active infeed converter over the diode bridge is its ability to feed back the energy from the DC side to the AC grid. Thus no braking resistor is needed and the efficiency of the drive is improved if the drive is frequently required to brake the motor.

Application considerations

The output voltage of a PWM VFD consists of a train of pulses switched at the carrier frequency. Because of the rapid rise time of these pulses, transmission line effects of the cable between the drive and motor must be considered. Since the transmission-line impedance of the cable and motor are different, pulses tend to reflect back from the motor terminals into the cable. The resulting voltages can produce up to twice the rated line voltage for long cable runs, putting high stress on the cable and motor winding and eventual insulation failure. Increasing the cable or motor size/type for long runs and 480v or 600v motors will help offset the stresses imposed upon the equipment due to the VFD (modern 230v single phase motors not effected). At 460 V, the maximum recommended cable distances between VFDs and motors can vary by a factor of 2.5:1. The longer cables distances are allowed at the lower Carrier Switching Frequencies (CSF) of 2.5 kHz. The lower CSF can produce audible noise at the motors. For applications requiring long motor cables VSD manufacturers usually offer du/dt filters that decrease the steepness of the pulses. For very long cables or old motors with insufficient winding insulation more efficient sinus filter is recommended. Expect the older motor’s life to shorten. Purchase VFD rated motors for the application.

Further, the rapid rise time of the pulses may cause trouble with the motor bearings. The stray capacitance of the windings provide paths for high frequency currents that close through the bearings. If the voltage between the shaft and the shield of the motor exceeds few volts the stored charge is discharged as a small spark. Repeated sparking causes erosion in the bearing surface that can be seen as fluting pattern. In order to prevent sparking the motor cable should provide a low impedance return path from the motor frame back to the inverter. Thus it is essential to use a cable designed to be used with VSDs.[18]

In big motors a slip ring with brush can be used to provide a bypass path for the bearing currents. Alternatively isolated bearings can be used.

The 2.5 kHz and 5 kHz CSFs cause fewer motor bearing problems than the 20 kHz CSFs.[19] Shorter cables are recommended at the higher CSF of 20 kHz. The minimum CSF for synchronize tracking of multiple conveyors is 8 kHz.

The high frequency current ripple in the motor cables may also cause interference with other cabling in the building. This is another reason to use a motor cable designed for VSDs that has a symmetrical three-phase structure and good shielding. Further, it is highly recommended to route the motor cables as far away from signal cables as possible.[20]

Available VFD power ratings

Variable frequency drives are available with voltage and current ratings to match the majority of 3-phase motors that are manufactured for operation from utility (mains) power. VFD controllers designed to operate at 111 V to 690 V are often classified as low voltage units. Low voltage units are typically designed for use with motors rated to deliver 0.2 kW or 1/4 horsepower (hp) up to several megawatts. For example, the largest ABB ACS800 single drives are rated for 5.6 MW[21] . Medium voltage VFD controllers are designed to operate at 2,400/4,162 V (60 Hz), 3,000 V (50 Hz) or up to 10 kV. In some applications a step up transformer is placed between a low voltage drive and a medium voltage load. Medium voltage units are typically designed for use with motors rated to deliver 375 kW or 500 hp and above. Medium voltage drives rated above 7 kV and 5,000 or 10,000 hp should probably be considered to be one-of-a-kind (one-off) designs.[22]

Medium voltage drives are generally rated amongst the following voltages : 2,3 KV – 3,3 Kv – 4 Kv – 6 Kv – 11 Kv

The in-between voltages are generally possible as well. The power of MV drives is generally in the range of 0,3 to 100 MW however involving a range a several different type of drives with different technologies.

Dynamic braking

Using the motor as a generator to absorb energy from the system is called dynamic braking. Dynamic braking stops the system more quickly than coasting. Since dynamic braking requires relative motion of the motor’s parts, it becomes less effective at low speed and cannot be used to hold a load at a stopped position. During normal braking of an electric motor the electrical energy produced by the motor is dissipated as heat inside of the rotor, which increases the likelihood of damage and eventual failure. Therefore, some systems transfer this energy to an outside bank of resistors. Cooling fans may be used to protect the resistors from damage. Modern systems have thermal monitoring, so if the temperature of the bank becomes excessive, it will be switched off.[23]

Regenerative variable-frequency drives

Regenerative AC drives have the capacity to recover the braking energy of an overhauling load and return it to the power system.[24]

Line regenerative variable frequency drives, showing capacitors(top cylinders)and inductors attached which filter the regenerated power.

[2][3][24][25][26][27]

Cycloconverters and current-source inverters inherently allow return of energy from the load to the line; voltage-source inverters require an additional converter to return energy to the supply.[28]

Regeneration is only useful in variable-frequency drives where the value of the recovered energy is large compared to the extra cost of a regenerative system,[28] and if the system requires frequent braking and starting. An example would be use in conveyor belt during manufacturing where it should stop for every few minutes, so that the parts can be assembled correctly and moves on. Another example is a crane, where the hoist motor stops and reverses frequently, and braking is required to slow the load during lowering. Regenerative variable-frequency drives are widely used where speed control of overhauling loads is required.

Brushless DC motor drives

Much of the same logic contained in large, powerful VFDs is also embedded in small brushless DC motors such as those commonly used in computer fans. In this case, the chopper usually converts a low DC voltage (such as 12 volts) to the three-phase current used to drive the electromagnets that turn the permanent magnet rotor.

See also

  • Regenerative variable-Frequency drives
  • Direct torque control
  • Frequency changer
  • Space Vector Modulation
  • Variable speed air compressor
  • Vector control (motor)
Category : AC, DC, VFD, Servo Drives | Electronic repair service | Electronic Repair Services | Industrial Repair Service | VFD Drive Repair | VFD Drives | Blog
4
Jan

Industrial Repair Group delivers fast and reliable VFD and Inverter Drive Repair Service. We understand that damaged equipment can wreak havoc on your bottom line. We pride ourselves by delivering guaranteed repairs and fast turn around times when you need it most. We do this by partnering with you on each and every repair.

Please don’t hesitate to call Industrial Repair Group and speak with one of our electronic repair specialist about your VFD and Inverter Drive Repair . We are here to help!

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Category : AC Drive Repair | AC, DC, VFD, Servo Drives | Dexter VFD Repair | Electronic Repair Services | Inverter Drive Repair | VFD Drive Repair | VFD Drives | Blog
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Jul

Service

Industrial Repair Group delivers fast and reliable Fuji Electric – Micrex PLC F Series / H Series / SX Series Service. We understand that damaged equipment can wreak havoc on your bottom line. We pride ourselves by delivering guaranteed repairs and fast turn around times when you need it most. We do this by partnering with you on each and every repair.

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Simplified Micrex Models List

At Industrial Repair Group, our goal is to offer the best repair in the industry and the most competitive quotes. Our wide selection of services and industry leading 18 month repair guarantee are sure to provide you with the perfect repair solution for all of your industrial needs. We specialize in industrial electronics, electric motor rebuilds, and complete customer satisfaction.

If you don’t see your Fuji Electric Micrex PLC F Series / H Series / SX Series model listed below, please give us a quick call as your Fuji model is more than likely supported by Industrial Repair Group but has not made it into our online database.

* MICREX-F80H/120H Series
Name Type
Processor module FPU080H-A10
FPU080H-G02
FPU080H-G10
FPU080H-A10N
FPU080H-G02N
FPU080H-G10N
FPU120H-A10
FPU120H-G02
FPU120H-G10
FPU120H-A10N
FPU120H-G02N
FPU120H-G10N
Base unit FSB084H
FSB086H
FSB088H
FSB110H
FSB080H
FSB080H-S
FSB124H
FSB126H
FSB128H
FSB120H
FSB156S-2
FSB154S-4
* FTL, FDL module
Name Type
FTL010H-A10
FTL010H-G02
FTL T-link FTL010H-G10
Interface module FTL010H-A10N
FTL010H-G02N
FTL010H-G10N
FDL120A-A10
FDL120A-G02
FDL FDL120A-G10
Expansion module FDL120A-A10N
FDL120A-G02N
FDL120A-G10N
Expansion cable FLC120AR2
FLC120AR6
FLC120A1
FLC120A2
FLC120A5
FLC120A10
FLC120A15
FLC120A20
* Digital I/O module
Mame Type
FTU122C
FTU113B
FTU123C
FTU126A
FTU133B
FTU136C
FTU143B
Digital input module FTU150B
(DI) FTU155C
FTU160B
FTU165C
FTU121C
FTU110B
FTU120C
FTU125A
FTU130B
FTU135C
FTU140B
Name Type
FTU216B
FTU260B
FTU263B
FTU266B
FTU221C
FTU222A
FTU210B
Digital output module FTU211B
(DO) FTU215B
FTU216B
FTU223B
FTU226B
FTU233B
FTU240B
FTU245B
FTU250B
FTU257B
FTU262B
FTU267B
Digital output module FTU212B
(DO) FTU213B
with fuse FTU224B
FTU251B
FTU258B
Digital FTU611C
Input / Output
module FTU612A
(DI / DO)
Digital dynamic FTU621B
I/O module (DI/DO)
Terminal relay 16 pts RS16-DE04
* Analog I/O module
Name Type
Analog input module FTU340A
(A/I) FTU341A
FTU342A
FTU343A
FTU344A
Analog output module FTU440A
(A/O) FTU441A
FTU442A
FTU443A
* Function modules
Name Description
High speed FTU500A
counter module FTU502A
Interrupt module FTU520A
Analog timer module FTU610B
FFU120B
RS-232C/RS-485
interface module
T-link slave module FTL650B
Dummy module FTU910A
Remoto Terminal FTM021B
master module FTM101B
Auxiliary power FPS110A-A10
suply module FPS110A-G02
(for I/O signal & load) FPS110A-G10
* I/O capsule
Name Type
FTK113A-C10
FTK123B-C10
FTK133A-C10
FTK143A-C10
Input capsule (DI) FTK150A-C10
FTK160A-C10
FTK110A-C10
FTK120B-C10
FTK130A-C10
FTK140A-C10
FTK261A-C10
FTK260A-C10
FTK210A-C10
FTK211A-C10
FTK220B-C10
Output capsule (DO) FTK215A-C10
FTK216A-C10
FTK225B-C10
FTK240A-C10
FTK245A-C10
FTK250A-C10
Name Type
FTK611B-C10
FTK656AC-10
I/O capsule (DI/DO)
FTK666A-C10
FTK616A-C10
I/O terminal input FTT1604-G02
FTT3204-G02
I/O terminal input FTT16RO-G02
FTT32RO-G02
FTT16TO-G02
FTT32TO-G02
I/O terminal in/output FTT16T4-G02
FTT32T4-G02
I/O free capsule FTK16NX-C10
FTK32NX-C10
FTL300A-C10
FTK310A-C10
FTK320A-C10
FTK311A-C10
Analog input capsule FTK321A-C10
(AI) FTK312A-C10
FTK322A-C10
FTK313A-C10
FTK323A-C10
FTK324A-C10
FTK410A-C10
FTK420A-C10
FTK401A-C10
FTK411A-C10
Analog output capsule FTK421A-C10
(SO) FTK412A-C10
FTK422A-C10
FTK413A-C10
FTK423A-C10
FTK414A-C10
FTK400A-C10
Name Type
Thermocouple GTK350C-C10
input capsule GTK351C-C10
GTK353C-C10
GTK354C-C10
GTK356C-C10
GTK357C-C10
JPt100Ω FTK370 C-C10
resistance bulb FTK371 C-C10
input capsule FTK372 C-C10
FTK373 C-C10
FTK374 C-C10
FTK375 C-C10
FTK376 C-C10
FTK377 C-C10
Pt100Ω FTK370D-C10
resistance bulb FTK371D-C10
input capsule FTK372D-C10
FTK373D-C10
FTK374D-C10
FTK375D-C10
FTK376D-C10
FTK377D-C10
Name Type
High-speed counter FTK500A-C10
capsule FTK510A-C10
FTK512A-C10
Positioning control FGC100A-A10
capsule FGD010A-A10
RS-232C interface FFK100A-C10
capsule FMC310A
FMC311A
FMC312A
FFK120A-C10
FLC201A-T30
FLC202A-T30
FLC203A-T30
T-link converter FRC100A-G02
T-link repeater FRC200A-C10
P-link repeater FRP200A-C10
Optical converter FNC100C-C10
FNC100C-A20
FNC200B-C10
FNC200B-A20
PID control capsule FPD100A-A10
Program loader FTC020T
receptacle
Program D10S FLD501S-A10
loader D20 FLD520A-A10
LITE(D25) FLT-SES-A10
LITE(D25) FLT-SES-A20
Simulation switch FTX100A-S16
Memory backup battery FBT010A
Optical fiber cable FHC100A-F000
FHC100A-F0R5
FHC100A-F110
FHC120A-F000
FHC120A-F005
FHC120A-F010
FHC120A-F050
FHC120A-F100
FHC120A-F200
FHC120A-F300
FHC120A-F600
FHC120B-F000
FHC120B-F200
FHC120B-F300
FHC120B-F600
Memory FMC032B
FMC034S
FMC036B
FMC334A
[MF S 시리즈 ]
No 품 명
1 FPU 120S-A10
2 FPU 140S-A10
3 FPU 150S-A10
4 FPU 152S-A10
5 FPU 154S-A10
6 FPC 120T
7 FPC 220P
8 FPC 420P
[MF H 시리즈 ]
No 품 명
1 FPU 080H-A10
2 FSB 084H
3 FSB 086H
4 FSB 088H
5 FSB 110H
6 FSB 124H
7 FSB 126H
8 FSB 128H
9 FSB 156S-2
10 FSB 154S-4
11 FSB 120H
12 FSB 908H
13 FSB 912H
14 FTL 010H-A10
15 FDL 120A-A10
16 FLC 120AR2
17 FLC 120AR6
18 FLC 120A1
19 FLC 120A2
20 FLC 120A5
21 FLC 120A10
22 FLC 120A15
23 FLC 120A20
[MF 모듈 ]
No 품 명
1 FTU 122C
2 FTU 113B
3 FTU 123B
4 FTU 126A
5 FTU 133B
6 FTU 136C
7 FTU 143B
8 FTU 150B
9 FTU 155B
10 FTU 160B
11 FTU 165B
12 FTU 121C
13 FTU 110B
14 FTU 120C
15 FTU 125A
16 FTU 130B
17 FTU 135C
18 FTU 140B
19 FTU 261B
20 FTU 260B
21 FTU 263B
22 FTU 266B
23 FTU 221C
24 FTU 222A
25 FTU 210B
26 FTU 211B
27 FTU 215B
28 FTU 216B
29 FTU 223B
30 FTU 226B
31 FTU 233B
32 FTU 240B
33 FTU 245B
34 FTU 250B
35 FTU 257B
36 FTU 611C
37 FTU 612A
38 FTU 621A
[MF 캡슐 ]
No 품 명
1 FTK 113A-C10
2 FTK 123B-C10
3 FTK 133A-C10
4 FTK 143A-C10
5 FTK 150A-C10
6 FTK 160A-C10
7 FTK 110A-C10
8 FTK 120B-C10
9 FTK 130A-C10
10 FTK 140A-C10
11 FTK 260A-C10
12 FTK 261A-C10
13 FTK 210A-C10
14 FTK 211A-C10
15 FTK 215A-C10
16 FTK 216A-C10
17 FTK 220B-C10
18 FTK 225B-C10
19 FTK 240A-C10
20 FTK 245A-C10
21 FTK 250A-C10
22 FTK 611B-C10
23 FTK 656A-C10
24 FTK 666A-C10
25 FTK 616A-C10
26 FTK 633A-G02
27 FTK 634A-G02
28 FTK 16NX-C10
29 FTU 340A
30 FTU 341A
31 FTU 342A
32 FTU 343A
33 FTU 344A
34 FTU 440A
35 FTU 441A
36 FTU 442A
37 FTU 443A
38 FTK 320A-C10
39 FTK 311A-C10
No 품 명
40 FTK 321A-C10
41 FTK 312A-C10
42 FTK 322A-C10
43 FTK 313A-C10
44 FTK 323A-C10
45 FTK 300A-C10
46 FTK 310A-C10
47 FTK 410A-C10
48 FTK 420A-C10
49 FTK 401A-C10
50 FTK 411A-C10
51 FTK 421A-C10
52 FTK 412A-C10
53 FTK 422A-C10
54 FTK 413A-C10
55 FTK 423A-C10
56 FTK 414A-C10
57 FTK 400A-C10
58 FTK 350A-()10
59 FTK 351A-()10
60 FTK 353A-()10
61 FTK 354A-()10
62 FTK 356A-()10
63 FTK 357A-()10
64 FTK 370B-()10
65 FTK 371B-()10
66 FTK 372B-()10
67 FTK 373B-()10
68 FTK 374B-()10
69 FTK 375B-()10
70 FTK 376B-()10
71 FTK 377B-()10
72 FTU 500A
73 FTU 502A
74 FTU 520A
75 FTK 500A-C10
76 FTK 510A-C10
77 FTK 512A-C10
78 FTU 610B
79 FTU 910A
80 FFU 080A-3H
81 FFU 120B
82 FFU 170B
83 CNVAD020-01
84 CNVAD090-01
No 품 명
85 FGU 120B
86 FGU 130B
87 FGD 012A
88 FTL 651B
89 FTM 100B
90 FTM 021B
91 FTM 101B
92 FFK 120A-C10
93 FGC 100A-A10
94 FGD 010A-A10
95 FPD 100A-A10
96 FRC 200A-C10
97 FRP 200A-C10
98 FNC 100B-C10
99 FNC 100C-A20
100 FNC 200B-C10
101 FNC 200B-A20
102 FHC 100A-F000
103 FHC 100A-F0R5
104 FHC 100A-F001
105 FHC 120A-F000
106 FHC 120A-F005
107 FHC 120A-F010
108 FHC 120A-F050
109 FHC 120A-F100
110 FHC 120A-F200
111 FHC 120A-F400
112 FHC 120A-F600
113 FHC 120B-F000
114 FHC 120B-F100
115 FHC 120B-F200
116 FHC 120B-F300
117 FHC 120B-F600
118 FDL 510S-A10
119 FDL 520S-A10
120 FBT 030A
121 FLC 020A
122 FCS 010A
123 FCS 020A
124 FBT 010A
125 FTC 020T
126 FTC 120T
No 품 명
127 FTC 120P
128 FLT-ASFK
129 FLT-FDIAT3E
130 NL4N-WNSE3
131 FRT 100A
132 FRT 200A
133 FMC 032B
134 FMC 034S
135 FMC 334A
136 FMC 036A
137 FTT1604-G02
138 FTT3204-G02
139 FTT16RO-G02
140 FTT32RO-G02
141 FTT16TO-G02
142 FTT32TO-G02
143 FTT16T4-G02
144 FTT32T4-G02


How I/O Modules Work

Thank you for choosing Industrial Repair Group. If you would like a printable version of How I/O Modules Work Operate, please follow this link: IRG-I/O-Module

[/REMIX]

Example of a PCI Digital I/O Expansion Card.

The expansion card (also expansion board, adapter card or accessory card) in computing is a printed circuit board that can be inserted into an expansion slot of a computer motherboard to add functionality to a computer system.

One edge of the expansion card holds the contacts (the edge connector) that fit exactly into the slot. They establish the electrical contact between the electronics (mostly integrated circuits) on the card and on the motherboard.

Connectors mounted on the bracket allow the connection of external devices to the card. Depending on the form factor of the motherboard and case, around one to seven expansion cards can be added to a computer system. In the case of a backplane system, up to 19 expansion cards can be installed. There are also other factors involved in expansion card capacity. For example, most graphics cards on the market as of 2010 are dual slot graphics cards, using the second slot as a place to put an active heat sink with a fan.

Some cards are “low-profile” cards, meaning that they are shorter than standard cards and will fit in a lower height computer chassis. (There is a “low profile PCI card” standard[1] that specifies a much smaller bracket and board area). The group of expansion cards that are used for external connectivity, such as a network, SAN or modem card, are commonly referred to as input/output cards (or I/O cards).

The primary purpose of an expansion card is to provide or expand on features not offered by the motherboard. For example, the original IBM PC did not provide graphics or hard drive capability as the technology for providing that on the motherboard did not exist. In that case, a graphics expansion card and an ST-506 hard disk controller card provided graphics capability and hard drive interface respectively.

In the case of expansion of on-board capability, a motherboard may provide a single serial RS232 port or Ethernet port. An expansion card can be installed to offer multiple RS232 ports or multiple and higher bandwidth Ethernet ports. In this case, the motherboard provides basic functionality but the expansion card offers additional or enhanced ports.

History

The first microcomputer to feature a slot-type expansion card bus was the Altair 8800, developed 1974-1975. Initially, implementations of this bus were proprietary (such as the Apple II and Macintosh), but by 1982 manufacturers of Intel 8080/Zilog Z80-based computers running CP/M had settled around the S-100 standard. IBM introduced the XT bus, with the first IBM PC in 1981; it was then called the PC bus, as the IBM XT, using the same bus (with slight exception,) was not to be introduced until 1983. XT (a.k.a. 8-bit ISA) was replaced with ISA (a.k.a. 16-bit ISA), originally known as AT bus, in 1984. IBM’s MCA bus, developed for the PS/2 in 1987, was a competitor to ISA, also their design, but fell out of favor due to the ISA’s industry-wide acceptance and IBM’s closed licensing of MCA. EISA, the 32-bit extended version of ISA championed by Compaq, was used on some PC motherboards until 1997, when Microsoft declared it a “legacy” subsystem in the PC 97 industry white-paper. Proprietary local buses (q.v. Compaq) and then the VESA Local Bus Standard, were late 1980s expansion buses that were tied but not exclusive[2][3][4] to the 80386 and 80486 CPU bus. The PC104 bus is an embedded bus that copies the ISA bus.

Intel launched their PCI bus chipsets along with the P5-based Pentium CPUs in 1993. The PCI bus was introduced in 1991 as replacement for ISA. The standard (now at version 3.0) is found on PC motherboards to this day. The PCI standard supports Bridging, as many as ten daisy chained PCI buses have been tested. Cardbus, using the PCMCIA connector, is a PCI format that attaches peripherals to the Host PCI Bus via PCI to PCI Bridge. Cardbus is being supplanted by ExpressCard format. Intel introduced the AGP bus in 1997 as a dedicated video acceleration solution. AGP devices are logically attached to the PCI bus over a PCI-to-PCI bridge. Though termed a bus, AGP usually supports only a single card at a time (Legacy BIOS support issues). From 2005 PCI-Express has been replacing both PCI and AGP. This standard, approved [by who?] in 2004, implements the logical PCI protocol over a serial communication interface. PC104-Plus, Mini PCI, or PCI-104 are often added for expansion on small form factor boards such as Micro ITX.

The USB format has become a de facto expansion bus standard especially for laptop computers. All the functions of add-in card slots can currently be duplicated by USB, including Video [5][6], networking, storage and audio. USB 2.0 is currently part of the ExpressCard interface and USB 3.0 is part of the ExpressCard 2.0 standard.

FireWire or IEEE 1394 is a serial expansion bus originally promoted for Apple Inc. Computer expansion replacing the SCSI bus. Also adopted for PCs, often used for storage and video cameras, it has application for networking, video, and audio.

After the S-100 bus, this article above mentions only buses used on IBM-compatible/Windows-Intel PCs. Most other computer lines that were not IBM compatible, including those from Apple Inc.(Apple II, Macintosh), Tandy, Commodore, Amiga, and Atari, offered their own expansion buses. Apple used a proprietary system with seven 50-pin-slots for Apple II peripheral cards, then later used the NuBus for its Macintosh series until 1995, at which time they switched to a standard PCI Bus. Generally PCI expansion cards will function on any CPU platform if there is a software driver for that type. PCI video cards and other cards that contain a BIOS are problematic, although video cards conforming to VESA Standards may be used for secondary monitors. DEC Alpha, IBM PowerPC, and NEC MIPS workstations used PCI bus connectors[7].

Even many video game consoles, such as the Sega Genesis, included expansion buses; at least in the case of the Genesis, the expansion bus was proprietary, and in fact the cartridge slots of many cartridge based consoles (not including the Atari 2600) would qualify as expansion buses, as they exposed both read and write capabilities of the system’s internal bus. However, the expansion modules attached to these interfaces, though functionally the same as expansion cards, are not technically expansion cards, due to their physical form.

For their 1000 EX and 1000 HX models, Tandy Computer designed the PLUS expansion interface, an adaptation of the XT-bus supporting cards of a smaller form factor. Because it is electrically compatible with the XT bus (a.k.a. 8-bit ISA or XT-ISA), a passive adapter can be made to connect XT cards to a PLUS expansion connector. Another feature of PLUS cards is that they are stackable. Another bus that offered stackable expansion modules was the “sidecar” bus used by the IBM PCjr. This may have been electrically the same as or similar to the XT bus; it most certainly had some similarities since both essentially exposed the 8088 CPU’s address and data buses, with some buffering and latching, the addition of interrupts and DMA provided by Intel add-on chips, and a few system fault detection lines (Power Good, Memory Check, I/O Channel Check). Again, PCjr sidecars are not technically expansion cards, but expansion modules, with the only difference being that the sidecar is an expansion card enclosed in a plastic box (with holes exposing the connectors).

Expansion slot standards

  • PCI Express
  • AGP
  • PCI
  • ISA
  • MCA
  • VLB
  • CardBus/PC card/PCMCIA (for notebook computers)
  • ExpressCard
  • CompactFlash (for handheld computers)
  • SBus (1990s SPARC-based Sun computers)
  • Zorro (Commodore Amiga)
  • NuBus (Apple Macintosh)

Expansion card types

  • Video cards
  • AMR Advanced Multi Rate Codec
  • Sound cards
  • Network cards
  • TV tuner cards
  • Video processing expansion cards
  • Modems
  • Host adapters such as SCSI and RAID controllers.
  • POST cards
  • BIOS Expansion ROM cards
  • Compatibility card (legacy)
  • Physics cards. (becoming obsolete as they are integrated into video cards)
  • Disk controller cards (for fixed- or removable-media drives)
  • Interface adapter cards, including parallel port cards, serial port cards, multi-I/O cards, USB port cards, and proprietary interface cards.
  • RAM disks, e.g. i-RAM
  • Solid-state drive (becoming obsolete to SATA Rev. 3.0, SSDs)
  • Memory expansion cards (legacy)
  • Hard disk cards (legacy)
  • Clock/calendar cards (legacy)
  • Security device cards
  • Radio tuner cards

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How Programmable Logic Works

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Siemens Simatic S7-400 system at rack, left-to-right: power supply unit PS407 4A,CPU 416-3, interface module IM 460-0 and communication processor CP 443-1.

A programmable logic controller (PLC) or programmable controller is a digital computer used for automation of electromechanical processes, such as control of machinery on factory assembly lines, amusement rides, or lighting fixtures. PLCs are used in many industries and machines. Unlike general-purpose computers, the PLC is designed for multiple inputs and output arrangements, extended temperature ranges, immunity to electrical noise, and resistance to vibration and impact. Programs to control machine operation are typically stored in battery-backed or non-volatile memory. A PLC is an example of a hard real time system since output results must be produced in response to input conditions within a bounded time, otherwise unintended operation will result.

History

The PLC was invented in response to the needs of the American automotive manufacturing industry. Programmable logic controllers were initially adopted by the automotive industry where software revision replaced the re-wiring of hard-wired control panels when production models changed.

Before the PLC, control, sequencing, and safety interlock logic for manufacturing automobiles was accomplished using hundreds or thousands of relays, cam timers, and drum sequencers and dedicated closed-loop controllers. The process for updating such facilities for the yearly model change-over was very time consuming and expensive, as electricians needed to individually rewire each and every relay.

In 1968 GM Hydramatic (the automatic transmission division of General Motors) issued a request for proposal for an electronic replacement for hard-wired relay systems. The winning proposal came from Bedford Associates of Bedford, Massachusetts. The first PLC, designated the 084 because it was Bedford Associates’ eighty-fourth project, was the result. Bedford Associates started a new company dedicated to developing, manufacturing, selling, and servicing this new product: Modicon, which stood for MOdular DIgital CONtroller. One of the people who worked on that project was Dick Morley, who is considered to be the “father” of the PLC. The Modicon brand was sold in 1977 to Gould Electronics, and later acquired by German Company AEG and then by French Schneider Electric, the current owner.

One of the very first 084 models built is now on display at Modicon’s headquarters in North Andover, Massachusetts. It was presented to Modicon by GM, when the unit was retired after nearly twenty years of uninterrupted service. Modicon used the 84 moniker at the end of its product range until the 984 made its appearance.

The automotive industry is still one of the largest users of PLCs.

Development

Early PLCs were designed to replace relay logic systems. These PLCs were programmed in “ladder logic”, which strongly resembles a schematic diagram of relay logic. This program notation was chosen to reduce training demands for the existing technicians. Other early PLCs used a form of instruction list programming, based on a stack-based logic solver.

Modern PLCs can be programmed in a variety of ways, from ladder logic to more traditional programming languages such as BASIC and C. Another method is State Logic, a very high-level programming language designed to program PLCs based on state transition diagrams.

Many early PLCs did not have accompanying programming terminals that were capable of graphical representation of the logic, and so the logic was instead represented as a series of logic expressions in some version of Boolean format, similar to Boolean algebra. As programming terminals evolved, it became more common for ladder logic to be used, for the aforementioned reasons. Newer formats such as State Logic and Function Block (which is similar to the way logic is depicted when using digital integrated logic circuits) exist, but they are still not as popular as ladder logic. A primary reason for this is that PLCs solve the logic in a predictable and repeating sequence, and ladder logic allows the programmer (the person writing the logic) to see any issues with the timing of the logic sequence more easily than would be possible in other formats.

Programming

Early PLCs, up to the mid-1980s, were programmed using proprietary programming panels or special-purpose programming terminals, which often had dedicated function keys representing the various logical elements of PLC programs. Programs were stored on cassette tape cartridges. Facilities for printing and documentation were very minimal due to lack of memory capacity. The very oldest PLCs used non-volatile magnetic core memory.

More recently, PLCs are programmed using application software on personal computers. The computer is connected to the PLC through Ethernet, RS-232, RS-485 or RS-422 cabling. The programming software allows entry and editing of the ladder-style logic. Generally the software provides functions for debugging and troubleshooting the PLC software, for example, by highlighting portions of the logic to show current status during operation or via simulation. The software will upload and download the PLC program, for backup and restoration purposes. In some models of programmable controller, the program is transferred from a personal computer to the PLC though a programming board which writes the program into a removable chip such as an EEPROM or EPROM.

Functionality

The functionality of the PLC has evolved over the years to include sequential relay control, motion control, process control, distributed control systems and networking. The data handling, storage, processing power and communication capabilities of some modern PLCs are approximately equivalent to desktop computers. PLC-like programming combined with remote I/O hardware, allow a general-purpose desktop computer to overlap some PLCs in certain applications. Regarding the practicality of these desktop computer based logic controllers, it is important to note that they have not been generally accepted in heavy industry because the desktop computers run on less stable operating systems than do PLCs, and because the desktop computer hardware is typically not designed to the same levels of tolerance to temperature, humidity, vibration, and longevity as the processors used in PLCs. In addition to the hardware limitations of desktop based logic, operating systems such as Windows do not lend themselves to deterministic logic execution, with the result that the logic may not always respond to changes in logic state or input status with the extreme consistency in timing as is expected from PLCs. Still, such desktop logic applications find use in less critical situations, such as laboratory automation and use in small facilities where the application is less demanding and critical, because they are generally much less expensive than PLCs.

In more recent years, small products called PLRs (programmable logic relays), and also by similar names, have become more common and accepted. These are very much like PLCs, and are used in light industry where only a few points of I/O (i.e. a few signals coming in from the real world and a few going out) are involved, and low cost is desired. These small devices are typically made in a common physical size and shape by several manufacturers, and branded by the makers of larger PLCs to fill out their low end product range. Popular names include PICO Controller, NANO PLC, and other names implying very small controllers. Most of these have between 8 and 12 digital inputs, 4 and 8 digital outputs, and up to 2 analog inputs. Size is usually about 4″ wide, 3″ high, and 3″ deep. Most such devices include a tiny postage stamp sized LCD screen for viewing simplified ladder logic (only a very small portion of the program being visible at a given time) and status of I/O points, and typically these screens are accompanied by a 4-way rocker push-button plus four more separate push-buttons, similar to the key buttons on a VCR remote control, and used to navigate and edit the logic. Most have a small plug for connecting via RS-232 or RS-485 to a personal computer so that programmers can use simple Windows applications for programming instead of being forced to use the tiny LCD and push-button set for this purpose. Unlike regular PLCs that are usually modular and greatly expandable, the PLRs are usually not modular or expandable, but their price can be two orders of magnitude less than a PLC and they still offer robust design and deterministic execution of the logic.

PLC Topics

Features

Control panel with PLC (grey elements in the center). The unit consists of separate elements, from left to right; power supply, controller, relay units for in- and output

The main difference from other computers is that PLCs are armored for severe conditions (such as dust, moisture, heat, cold) and have the facility for extensive input/output (I/O) arrangements. These connect the PLC to sensors and actuators. PLCs read limit switches, analog process variables (such as temperature and pressure), and the positions of complex positioning systems. Some use machine vision. On the actuator side, PLCs operate electric motors, pneumatic or hydraulic cylinders, magnetic relays, solenoids, or analog outputs. The input/output arrangements may be built into a simple PLC, or the PLC may have external I/O modules attached to a computer network that plugs into the PLC.

System scale

A small PLC will have a fixed number of connections built in for inputs and outputs. Typically, expansions are available if the base model has insufficient I/O.

Modular PLCs have a chassis (also called a rack) into which are placed modules with different functions. The processor and selection of I/O modules is customised for the particular application. Several racks can be administered by a single processor, and may have thousands of inputs and outputs. A special high speed serial I/O link is used so that racks can be distributed away from the processor, reducing the wiring costs for large plants.

User interface

See also: User interface and List of human-computer interaction topics

PLCs may need to interact with people for the purpose of configuration, alarm reporting or everyday control.

A Human-Machine Interface (HMI) is employed for this purpose. HMIs are also referred to as MMIs (Man Machine Interface) and GUIs (Graphical User Interface).

A simple system may use buttons and lights to interact with the user. Text displays are available as well as graphical touch screens. More complex systems use programming and monitoring software installed on a computer, with the PLC connected via a communication interface.

Communications

PLCs have built in communications ports, usually 9-pin RS-232, but optionally EIA-485 or Ethernet. Modbus, BACnet or DF1 is usually included as one of the communications protocols. Other options include various fieldbuses such as DeviceNet or Profibus. Other communications protocols that may be used are listed in the List of automation protocols.

Most modern PLCs can communicate over a network to some other system, such as a computer running a SCADA (Supervisory Control And Data Acquisition) system or web browser.

PLCs used in larger I/O systems may have peer-to-peer (P2P) communication between processors. This allows separate parts of a complex process to have individual control while allowing the subsystems to co-ordinate over the communication link. These communication links are also often used for HMI devices such as keypads or PC-type workstations.

Programming

PLC programs are typically written in a special application on a personal computer, then downloaded by a direct-connection cable or over a network to the PLC. The program is stored in the PLC either in battery-backed-up RAM or some other non-volatile flash memory. Often, a single PLC can be programmed to replace thousands of relays.

Under the IEC 61131-3 standard, PLCs can be programmed using standards-based programming languages. A graphical programming notation called Sequential Function Charts is available on certain programmable controllers. Initially most PLCs utilized Ladder Logic Diagram Programming, a model which emulated electromechanical control panel devices (such as the contact and coils of relays) which PLCs replaced. This model remains common today.

IEC 61131-3 currently defines five programming languages for programmable control systems: FBD (Function block diagram), LD (Ladder diagram), ST (Structured text, similar to the Pascal programming language), IL (Instruction list, similar to assembly language) and SFC (Sequential function chart). These techniques emphasize logical organization of operations.

While the fundamental concepts of PLC programming are common to all manufacturers, differences in I/O addressing, memory organization and instruction sets mean that PLC programs are never perfectly interchangeable between different makers. Even within the same product line of a single manufacturer, different models may not be directly compatible.

PLC compared with other control systems

Allen-Bradley PLC installed in a control panel

PLCs are well-adapted to a range of automation tasks. These are typically industrial processes in manufacturing where the cost of developing and maintaining the automation system is high relative to the total cost of the automation, and where changes to the system would be expected during its operational life. PLCs contain input and output devices compatible with industrial pilot devices and controls; little electrical design is required, and the design problem centers on expressing the desired sequence of operations. PLC applications are typically highly customized systems so the cost of a packaged PLC is low compared to the cost of a specific custom-built controller design. On the other hand, in the case of mass-produced goods, customized control systems are economic due to the lower cost of the components, which can be optimally chosen instead of a “generic” solution, and where the non-recurring engineering charges are spread over thousands or millions of units.

For high volume or very simple fixed automation tasks, different techniques are used. For example, a consumer dishwasher would be controlled by an electromechanical cam timer costing only a few dollars in production quantities.

A microcontroller-based design would be appropriate where hundreds or thousands of units will be produced and so the development cost (design of power supplies, input/output hardware and necessary testing and certification) can be spread over many sales, and where the end-user would not need to alter the control. Automotive applications are an example; millions of units are built each year, and very few end-users alter the programming of these controllers. However, some specialty vehicles such as transit busses economically use PLCs instead of custom-designed controls, because the volumes are low and the development cost would be uneconomic.

Very complex process control, such as used in the chemical industry, may require algorithms and performance beyond the capability of even high-performance PLCs. Very high-speed or precision controls may also require customized solutions; for example, aircraft flight controls.

Programmable controllers are widely used in motion control, positioning control and torque control. Some manufacturers produce motion control units to be integrated with PLC so that G-code (involving a CNC machine) can be used to instruct machine movements.[citation needed]

PLCs may include logic for single-variable feedback analog control loop, a “proportional, integral, derivative” or “PID controller”. A PID loop could be used to control the temperature of a manufacturing process, for example. Historically PLCs were usually configured with only a few analog control loops; where processes required hundreds or thousands of loops, a distributed control system (DCS) would instead be used. As PLCs have become more powerful, the boundary between DCS and PLC applications has become less distinct.

PLCs have similar functionality as Remote Terminal Units. An RTU, however, usually does not support control algorithms or control loops. As hardware rapidly becomes more powerful and cheaper, RTUs, PLCs and DCSs are increasingly beginning to overlap in responsibilities, and many vendors sell RTUs with PLC-like features and vice versa. The industry has standardized on the IEC 61131-3 functional block language for creating programs to run on RTUs and PLCs, although nearly all vendors also offer proprietary alternatives and associated development environments.

Digital and analog signals

Digital or discrete signals behave as binary switches, yielding simply an On or Off signal (1 or 0, True or False, respectively). Push buttons, limit switches, and photoelectric sensors are examples of devices providing a discrete signal. Discrete signals are sent using either voltage or current, where a specific range is designated as On and another as Off. For example, a PLC might use 24 V DC I/O, with values above 22 V DC representing On, values below 2VDC representing Off, and intermediate values undefined. Initially, PLCs had only discrete I/O.

Analog signals are like volume controls, with a range of values between zero and full-scale. These are typically interpreted as integer values (counts) by the PLC, with various ranges of accuracy depending on the device and the number of bits available to store the data. As PLCs typically use 16-bit signed binary processors, the integer values are limited between -32,768 and +32,767. Pressure, temperature, flow, and weight are often represented by analog signals. Analog signals can use voltage or current with a magnitude proportional to the value of the process signal. For example, an analog 0 – 10 V input or 4-20 mA would be converted into an integer value of 0 – 32767.

Current inputs are less sensitive to electrical noise (i.e. from welders or electric motor starts) than voltage inputs.

Example

As an example, say a facility needs to store water in a tank. The water is drawn from the tank by another system, as needed, and our example system must manage the water level in the tank.

Using only digital signals, the PLC has two digital inputs from float switches (Low Level and High Level). When the water level is above the switch it closes a contact and passes a signal to an input. The PLC uses a digital output to open and close the inlet valve into the tank.

When the water level drops enough so that the Low Level float switch is off (down), the PLC will open the valve to let more water in. Once the water level rises enough so that the High Level switch is on (up), the PLC will shut the inlet to stop the water from overflowing. This rung is an example of seal-in (latching) logic. The output is sealed in until some condition breaks the circuit.

|                                                             |  |   Low Level      High Level                 Fill Valve      |  |------[/]------|------[/]----------------------(OUT)---------|  |               |                                             |  |               |                                             |  |               |                                             |  |   Fill Valve  |                                             |  |------[ ]------|                                             |  |                                                             |  |                                                             |

An analog system might use a water pressure sensor or a load cell, and an adjustable (throttling) dripping out of the tank, the valve adjusts to slowly drip water back into the tank.

In this system, to avoid ‘flutter’ adjustments that can wear out the valve, many PLCs incorporate “hysteresis” which essentially creates a “deadband” of activity. A technician adjusts this deadband so the valve moves only for a significant change in rate. This will in turn minimize the motion of the valve, and reduce its wear.

A real system might combine both approaches, using float switches and simple valves to prevent spills, and a rate sensor and rate valve to optimize refill rates and prevent water hammer. Backup and maintenance methods can make a real system very complicated.

See also

  • The Westinghouse sign
  • Distributed control system, (DCS).
  • Industrial control systems, (ICS).
  • Industrial safety systems
  • Programmable automation controller, (PAC).
  • Signature image processing, (SIP)
  • SCADA

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Category : Electronic Repair Services | Industrial Controls Repair | Industrial Repair Group | Industrial Repair Service | Programmable Logic Controller - PLC Repair | Blog
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How Circuit Boards Work

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Part of a 1983 Sinclair ZX Spectrum computer board; a populated PCB, showing the conductive traces, vias (the through-hole paths to the other surface), and some mounted electrical components


A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, tracks or signal traces etched from copper sheets laminated onto a non-conductive substrate. It is also referred to as printed wiring board (PWB) or etched wiring board. A PCB populated with electronic components is a printed circuit assembly (PCA), also known as a printed circuit board assembly (PCBA). Printed circuit boards are used in virtually all but the simplest commercially-produced electronic devices.

PCBs are inexpensive, and can be highly reliable. They require much more layout effort and higher initial cost than either wire wrap or point-to-point construction, but are much cheaper and faster for high-volume production; the production and soldering of PCBs can be done by totally automated equipment. Much of the electronics industry’s PCB design, assembly, and quality control needs are set by standards that are published by the IPC organization.

History

The inventor of the printed circuit was the Austrian engineer Paul Eisler who, while working in England, made one circa 1936 as part of a radio set. Around 1943 the USA began to use the technology on a large scale to make rugged radios for use in World War II. After the war, in 1948, the USA released the invention for commercial use. Printed circuits did not become commonplace in consumer electronics until the mid-1950s, after the Auto-Sembly process was developed by the United States Army.

Before printed circuits (and for a while after their invention), point-to-point construction was used. For prototypes, or small production runs, wire wrap or turret board can be more efficient. Predating the printed circuit invention, and similar in spirit, was John Sargrove’s 1936-1947 Electronic Circuit Making Equipment (ECME) which sprayed metal onto a Bakelite plastic board. The ECME could produce 3 radios per minute.

During World War II, the development of the anti-aircraft proximity fuse required an electronic circuit that could withstand being fired from a gun, and could be produced in quantity. The Centralab Division of Globe Union submitted a proposal which met the requirements: a ceramic plate would be screenprinted with metallic paint for conductors and carbon material for resistors, with ceramic disc capacitors and subminiature vacuum tubes soldered in place.[1]

Originally, every electronic component had wire leads, and the PCB had holes drilled for each wire of each component. The components’ leads were then passed through the holes and soldered to the PCB trace. This method of assembly is called through-hole construction. In 1949, Moe Abramson and Stanislaus F. Danko of the United States Army Signal Corps developed the Auto-Sembly process in which component leads were inserted into a copper foil interconnection pattern and dip soldered. With the development of board lamination and etching techniques, this concept evolved into the standard printed circuit board fabrication process in use today. Soldering could be done automatically by passing the board over a ripple, or wave, of molten solder in a wave-soldering machine. However, the wires and holes are wasteful since drilling holes is expensive and the protruding wires are merely cut off.

In recent years, the use of surface mount parts has gained popularity as the demand for smaller electronics packaging and greater functionality has grown.

Manufacturing


Materials






A PCB as a design on a computer (left) and realized as a board assembly populated with components (right). The board is double sided, with through-hole plating, green solder resist, and white silkscreen printing. Both surface mount and through-hole components have been used.







A PCB in a computer mouse. The Component Side (left) and the printed side (right).







The Component Side of a PCB in a computer mouse; some examples for common components and their reference designations on the silk screen.


Conducting layers are typically made of thin copper foil. Insulating layers dielectric are typically laminated together with epoxy resin prepreg. The board is typically coated with a solder mask that is green in color. Other colors that are normally available are blue, black, white and red. There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known prepreg materials used in the PCB industry are FR-2 (Phenolic cotton paper), FR-3 (Cotton paper and epoxy), FR-4 (Woven glass and epoxy), FR-5 (Woven glass and epoxy), FR-6 (Matte glass and polyester), G-10 (Woven glass and epoxy), CEM-1 (Cotton paper and epoxy), CEM-2 (Cotton paper and epoxy), CEM-3 (Woven glass and epoxy), CEM-4 (Woven glass and epoxy), CEM-5 (Woven glass and polyester). Thermal expansion is an important consideration especially with BGA and naked die technologies, and glass fiber offers the best dimensional stability.

FR-4 is by far the most common material used today. The board with copper on it is called “copper-clad laminate”.

Copper foil thickness can be specified in ounces per square foot or micrometres. One ounce per square foot is 1.344 mils or 34 micrometres.

Patterning (etching)

The vast majority of printed circuit boards are made by bonding a layer of copper over the entire substrate, sometimes on both sides, (creating a “blank PCB”) then removing unwanted copper after applying a temporary mask (e.g. by etching), leaving only the desired copper traces. A few PCBs are made by adding traces to the bare substrate (or a substrate with a very thin layer of copper) usually by a complex process of multiple electroplating steps. The PCB manufacturing method primarily depends on whether it is for production volume or sample/prototype quantities.

Commercial (production quantities, usually PTH)



  • silk screen printing -the main commercial method.

  • Photographic methods. Used when fine linewidths are required.


Hobbyist/prototype (small quantities, usually not PTH)



  • Laser-printed resist: Laser-print onto paper (or wax paper), heat-transfer with an iron or modified laminator onto bare laminate, then etch.

  • Print onto transparent film and use as photomask along with photo-sensitized boards. (i.e. pre-sensitized boards), Then etch. (Alternatively, use a film photoplotter).

  • Laser resist ablation: Spray black paint onto copper clad laminate, place into CNC laser plotter. The laser raster-scans the PCB and ablates (vaporizes) the paint where no resist is wanted. Etch. (Note: laser copper ablation is rarely used and is considered experimental.)

  • Use a CNC-mill with a spade-shaped (i.e. 45-degree) cutter or miniature end-mill to route away the undesired copper, leaving only the traces.

There are three common “subtractive” methods (methods that remove copper) used for the production of printed circuit boards:


  1. Silk screen printing uses etch-resistant inks to protect the copper foil. Subsequent etching removes the unwanted copper. Alternatively, the ink may be conductive, printed on a blank (non-conductive) board. The latter technique is also used in the manufacture of hybrid circuits.

  2. Photoengraving uses a photomask and developer to selectively remove a photoresist coating. The remaining photoresist protects the copper foil. Subsequent etching removes the unwanted copper. The photomask is usually prepared with a photoplotter from data produced by a technician using CAM, or computer-aided manufacturing software. Laser-printed transparencies are typically employed for phototools; however, direct laser imaging techniques are being employed to replace phototools for high-resolution requirements.

  3. PCB milling uses a two or three-axis mechanical milling system to mill away the copper foil from the substrate. A PCB milling machine (referred to as a ‘PCB Prototyper’) operates in a similar way to a plotter, receiving commands from the host software that control the position of the milling head in the x, y, and (if relevant) z axis. Data to drive the Prototyper is extracted from files generated in PCB design software and stored in HPGL or Gerber file format.

“Additive” processes also exist. The most common is the “semi-additive” process. In this version, the unpatterned board has a thin layer of copper already on it. A reverse mask is then applied. (Unlike a subtractive process mask, this mask exposes those parts of the substrate that will eventually become the traces.) Additional copper is then plated onto the board in the unmasked areas; copper may be plated to any desired weight. Tin-lead or other surface platings are then applied. The mask is stripped away and a brief etching step removes the now-exposed original copper laminate from the board, isolating the individual traces. Some boards with plated through holes but still single sided were made with a process like this. General Electric made consumer radio sets in the late 1960s using boards like these.

The additive process is commonly used for multi-layer boards as it facilitates the plating-through of the holes (to produce conductive vias) in the circuit board.







  • PCB copper electroplating machine for adding copper to the in-process PCB









  • PCB’s in process of adding copper via electroplating




The dimensions of the copper conductors of the printed circuit board is related to the amount of current the conductor must carry. Each trace consists of a flat, narrow part of the copper foil that remains after etching. Signal traces are usually narrower than power or ground traces because their current carrying requirements are usually much less. In a multi-layer board one entire layer may be mostly solid copper to act as a ground plane for shielding and power return. For printed circuit boards that contain microwave circuits, transmission lines can be laid out in the form of stripline and microstrip with carefully-controlled dimensions to assure a consistent impedance. In radio-frequency circuits the inductance and capacitance of the printed circuit board conductors can be used as a delibrate part of the circuit design, obviating the need for additional discrete components.

Etching

Chemical etching is done with ferric chloride, ammonium persulfate, or sometimes hydrochloric acid. For PTH (plated-through holes), additional steps of electroless deposition are done after the holes are drilled, then copper is electroplated to build up the thickness, the boards are screened, and plated with tin/lead. The tin/lead becomes the resist leaving the bare copper to be etched away.

Lamination

Some PCBs have trace layers inside the PCB and are called multi-layer PCBs. These are formed by bonding together separately etched thin boards.

Drilling

Holes through a PCB are typically drilled with tiny drill bits made of solid tungsten carbide. The drilling is performed by automated drilling machines with placement controlled by a drill tape or drill file. These computer-generated files are also called numerically controlled drill (NCD) files or “Excellon files”. The drill file describes the location and size of each drilled hole. These holes are often filled with annular rings (hollow rivets) to create vias. Vias allow the electrical and thermal connection of conductors on opposite sides of the PCB.

Most common laminate is epoxy filled fiberglass. Drill bit wear is partly due to embedded glass, which is harder than steel. High drill speed necessary for cost effective drilling of hundreds of holes per board causes very high temperatures at the drill bit tip, and high temperatures (400-700 degrees) soften steel and decompose (oxidize) laminate filler. Copper is softer than epoxy and interior conductors may suffer damage during drilling.

When very small vias are required, drilling with mechanical bits is costly because of high rates of wear and breakage. In this case, the vias may be evaporated by lasers. Laser-drilled vias typically have an inferior surface finish inside the hole. These holes are called micro vias.

It is also possible with controlled-depth drilling, laser drilling, or by pre-drilling the individual sheets of the PCB before lamination, to produce holes that connect only some of the copper layers, rather than passing through the entire board. These holes are called blind vias when they connect an internal copper layer to an outer layer, or buried vias when they connect two or more internal copper layers and no outer layers.

The walls of the holes, for boards with 2 or more layers, are made conductive then plated with copper to form plated-through holes that electrically connect the conducting layers of the PCB. For multilayer boards, those with 4 layers or more, drilling typically produces a smear of the high temperature decomposition products of bonding agent in the laminate system. Before the holes can be plated through, this smear must be removed by a chemical de-smear process, or by plasma-etch. Removing (etching back) the smear also reveals the interior conductors as well.

Exposed conductor plating and coating

PCBs[2] are plated with solder, tin, or gold over nickel as a resist for etching away the unneeded underlying copper.[3]

After PCBs are etched and then rinsed with water, the soldermask is applied, and then any exposed copper is coated with solder, nickel/gold, or some other anti-corrosion coating.[4][5]

Matte solder is usually fused to provide a better bonding surface or stripped to bare copper. Treatments, such as benzimidazolethiol, prevent surface oxidation of bare copper. The places to which components will be mounted are typically plated, because untreated bare copper oxidizes quickly, and therefore is not readily solderable. Traditionally, any exposed copper was coated with solder by hot air solder levelling (HASL). The HASL finish prevents oxidation from the underlying copper, thereby guaranteeing a solderable surface.[6] This solder was a tin-lead alloy, however new solder compounds are now used to achieve compliance with the RoHS directive in the EU and US, which restricts the use of lead. One of these lead-free compounds is SN100CL, made up of 99.3% tin, 0.7% copper, 0.05% nickel, and a nominal of 60ppm germanium.

It is important to use solder compatible with both the PCB and the parts used. An example is Ball Grid Array (BGA) using tin-lead solder balls for connections losing their balls on bare copper traces or using lead-free solder paste.

Other platings used are OSP (organic surface protectant), immersion silver (IAg), immersion tin, electroless nickel with immersion gold coating (ENIG), and direct gold plating (over nickel). Edge connectors, placed along one edge of some boards, are often nickel plated then gold plated. Another coating consideration is rapid diffusion of coating metal into Tin solder. Tin forms intermetallics such as Cu5Sn6 and Ag3Cu that dissolve into the Tin liquidus or solidus(@50C), stripping surface coating and/or leaving voids.

Electrochemical migration (ECM) is the growth of conductive metal filaments on or in a printed circuit board (PCB) under the influence of a DC voltage bias.[7][8] Silver, zinc, and aluminum are known to grow whiskers under the influence of an electric field. Silver also grows conducting surface paths in the presence of halide and other ions, making it a poor choice for electronics use. Tin will grow “whiskers” due to tension in the plated surface. Tin-Lead or Solder plating also grows whiskers, only reduced by the percentage Tin replaced. Reflow to melt solder or tin plate to relieve surface stress lowers whisker incidence. Another coating issue is tin pest, the transformation of tin to a powdery allotrope at low temperature.[9]

Solder resist

Areas that should not be soldered may be covered with a polymer solder resist (solder mask) coating. The solder resist prevents solder from bridging between conductors and creating short circuits. Solder resist also provides some protection from the environment. Solder resist is typically 20-30 micrometres thick.

Screen printing

Line art and text may be printed onto the outer surfaces of a PCB by screen printing. When space permits, the screen print text can indicate component designators, switch setting requirements, test points, and other features helpful in assembling, testing, and servicing the circuit board.

Screen print is also known as the silk screen, or, in one sided PCBs, the red print.

Lately some digital printing solutions have been developed to substitute the traditional screen printing process. This technology allows printing variable data onto the PCB, including serialization and barcode information for traceability purposes.

Test

Unpopulated boards may be subjected to a bare-board test where each circuit connection (as defined in a netlist) is verified as correct on the finished board. For high-volume production, a Bed of nails tester, a fixture or a Rigid needle adapter is used to make contact with copper lands or holes on one or both sides of the board to facilitate testing. A computer will instruct the electrical test unit to apply a small voltage to each contact point on the bed-of-nails as required, and verify that such voltage appears at other appropriate contact points. A “short” on a board would be a connection where there should not be one; an “open” is between two points that should be connected but are not. For small- or medium-volume boards, flying probe and flying-grid testers use moving test heads to make contact with the copper/silver/gold/solder lands or holes to verify the electrical connectivity of the board under test.

Printed circuit assembly

After the printed circuit board (PCB) is completed, electronic components must be attached to form a functional printed circuit assembly,[10][11] or PCA (sometimes called a “printed circuit board assembly” PCBA). In through-hole construction, component leads are inserted in holes. In surface-mount construction, the components are placed on pads or lands on the outer surfaces of the PCB. In both kinds of construction, component leads are electrically and mechanically fixed to the board with a molten metal solder.

There are a variety of soldering techniques used to attach components to a PCB. High volume production is usually done with machine placement and bulk wave soldering or reflow ovens, but skilled technicians are able to solder very tiny parts (for instance 0201 packages which are 0.02 in. by 0.01 in.)[12] by hand under a microscope, using tweezers and a fine tip soldering iron for small volume prototypes. Some parts are impossible to solder by hand, such as ball grid array (BGA) packages.

Often, through-hole and surface-mount construction must be combined in a single assembly because some required components are available only in surface-mount packages, while others are available only in through-hole packages. Another reason to use both methods is that through-hole mounting can provide needed strength for components likely to endure physical stress, while components that are expected to go untouched will take up less space using surface-mount techniques.

After the board has been populated it may be tested in a variety of ways:


  • While the power is off, visual inspection, automated optical inspection. JEDEC guidelines for PCB component placement, soldering, and inspection are commonly used to maintain quality control in this stage of PCB manufacturing.



  • While the power is off, analog signature analysis, power-off testing.



  • While the power is on, in-circuit test, where physical measurements (i.e. voltage, frequency) can be done.



  • While the power is on, functional test, just checking if the PCB does what it had been designed for.

To facilitate these tests, PCBs may be designed with extra pads to make temporary connections. Sometimes these pads must be isolated with resistors. The in-circuit test may also exercise boundary scan test features of some components. In-circuit test systems may also be used to program nonvolatile memory components on the board.

In boundary scan testing, test circuits integrated into various ICs on the board form temporary connections between the PCB traces to test that the ICs are mounted correctly. Boundary scan testing requires that all the ICs to be tested use a standard test configuration procedure, the most common one being the Joint Test Action Group (JTAG) standard. The JTAG test architecture provides a means to test interconnects between integrated circuits on a board without using physical test probes. JTAG tool vendors provide various types of stimulus and sophisticated algorithms, not only to detect the failing nets, but also to isolate the faults to specific nets, devices, and pins.[13]

When boards fail the test, technicians may desolder and replace failed components, a task known as rework.

Protection and packaging

PCBs intended for extreme environments often have a conformal coating, which is applied by dipping or spraying after the components have been soldered. The coat prevents corrosion and leakage currents or shorting due to condensation. The earliest conformal coats were wax; modern conformal coats are usually dips of dilute solutions of silicone rubber, polyurethane, acrylic, or epoxy. Another technique for applying a conformal coating is for plastic to be sputtered onto the PCB in a vacuum chamber. The chief disadvantage of conformal coatings is that servicing of the board is rendered extremely difficult.[14]

Many assembled PCBs are static sensitive, and therefore must be placed in antistatic bags during transport. When handling these boards, the user must be grounded (earthed). Improper handling techniques might transmit an accumulated static charge through the board, damaging or destroying components. Even bare boards are sometimes static sensitive. Traces have become so fine that it’s quite possible to blow an etch off the board (or change its characteristics) with a static charge. This is especially true on non-traditional PCBs such as MCMs and microwave PCBs.

Design



  • Schematic capture or schematic entry is done through an EDA tool.

  • Card dimensions and template are decided based on required circuitry and case of the PCB. Determine the fixed components and heat sinks if required.

  • Deciding stack layers of the PCB. 4 to 12 layers or more depending on design complexity. Ground plane and Power plane are decided. Signal planes where signals are routed are in top layer as well as internal layers.[15]

  • Line impedance determination using dielectric layer thickness, routing copper thickness and trace-width. Trace separation also taken into account in case of differential signals. Microstrip, stripline or dual stripline can be used to route signals.

  • Placement of the components. Thermal considerations and geometry are taken into account. Vias and lands are marked.

  • Routing the signal trace. For optimal EMI performance high frequency signals are routed in internal layers between power or ground planes as power plane behaves as ground for AC.

  • Gerber file generation for manufacturing.


Safety certification (US)

Safety Standard UL 796 covers component safety requirements for printed wiring boards for use as components in devices or appliances. Testing analyzes characteristics such as flammability, maximum operating temperature, electrical tracking, heat deflection, and direct support of live electrical parts.

“Cordwood” construction






A cordwood module.


Cordwood construction can save significant space and was often used with wire-ended components in applications where space was at a premium (such as missile guidance and telemetry systems) and in high-speed computers, where short traces were important. In “cordwood” construction, axial-leaded components were mounted between two parallel planes. The components were either soldered together with jumper wire, or they were connected to other components by thin nickel ribbon welded at right angles onto the component leads. To avoid shorting together different interconnection layers, thin insulating cards were placed between them. Perforations or holes in the cards allowed component leads to project through to the next interconnection layer. One disadvantage of this system was that special nickel leaded components had to be used to allow the interconnecting welds to be made. Some versions of cordwood construction used single sided PCBs as the interconnection method (as pictured). This meant that normal leaded components could be used. Another disadvantage of this system is that components located in the interior are difficult to replace.

Before the advent of integrated circuits, this method allowed the highest possible component packing density; because of this, it was used by a number of computer vendors including Control Data Corporation. The cordwood method of construction now appears to have fallen into disuse, probably because high packing densities can be more easily achieved using surface mount techniques and integrated circuits.

Multiwire boards

Multiwire is a patented technique of interconnection which uses machine-routed insulated wires embedded in a non-conducting matrix (often plastic resin). It was used during the 1980s and 1990s. (Kollmorgen Technologies Corp., U.S. Patent 4,175,816) Multiwire is still available in 2010 through Hitachi. There are other competitive discrete wiring technologies that have been developed (Jumatech [2]).

Since it was quite easy to stack interconnections (wires) inside the embedding matrix, the approach allowed designers to forget completely about the routing of wires (usually a time-consuming operation of PCB design): Anywhere the designer needs a connection, the machine will draw a wire in straight line from one location/pin to another. This led to very short design times (no complex algorithms to use even for high density designs) as well as reduced crosstalk (which is worse when wires run parallel to each other—which almost never happens in Multiwire), though the cost is too high to compete with cheaper PCB technologies when large quantities are needed.

Surface-mount technology


Main article: Surface-mount technology





Surface mount components, including resistors, transistors and an integrated circuit


Surface-mount technology emerged in the 1960s, gained momentum in the early 1980s and became widely used by the mid 1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly on to the PCB surface. Components became much smaller and component placement on both sides of the board became more common than with through-hole mounting, allowing much higher circuit densities. Surface mounting lends itself well to a high degree of automation, reducing labour costs and greatly increasing production and quality rates. Carrier Tapes provide a stable and protective environment for Surface mount devices (SMDs) which can be one-quarter to one-tenth of the size and weight, and passive components can be one-half to one-quarter of the cost of corresponding through-hole parts. However, integrated circuits are often priced the same regardless of the package type, because the chip itself is the most expensive part. As of 2006, some wire-ended components, such as small-signal switch diodes, e.g. 1N4148, are actually significantly cheaper than corresponding SMD versions.

See also










Nuvola apps ksim.png Electronics portal






Schematic Capture. (KiCAD)







PCB layout. (KiCAD)







3D View. (KiCAD)




  • Breadboard

  • C.I.D.+

  • Design for manufacturability (PCB)

  • Electronic packaging

  • Electronic waste

  • Multi-Chip Module

  • Occam Process – another process for the manufacturing of PCBs



PCB Materials




  • Conductive ink

  • Heavy copper

  • Laminate materials:

    • BT-Epoxy

    • Composite epoxy material, CEM-1,5

    • Cyanate Ester

    • FR-2

    • FR-4, the most common PCB material

    • Polyimide

    • PTFE, Polytetrafluoroethylene (Teflon)






PCB layout software



  • List of EDA companies

  • Comparison of EDA software



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Category : Electronic Repair Services | Industrial Controls Repair | Industrial Repair Group | Industrial Repair Service | Blog
14
May

Circuit Board Repair Service by Industrial Repair Group

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Category : AC, DC, VFD, Servo Drives | Analog Circuit Board Repair | Electronic Repair Services | Industrial Controls Repair | Blog
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Industrial Repair Group performs extensive component level repairs, touching up solder traces, replacing bad components, as well as full testing of ICs, PALs, EPROMs, GALs, surface mounted components and much more. Every Femco Repair Service by Industrial Repair Group is subjected to dynamic function tests to verify successful repair and then backed by our 18 month repair guarantee. Sealers and conformal coatings are re-applied as needed with each repair restoring your equipment back to its original OEM specs.

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ACME ELECTRIC & STANDARD POWER INC INLAND MOTOR
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DYNISCO PULS
EATON CORPORATION PYRAMID
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ECCI QUINDAR ELECTRONICS
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ELECTROL RTA PAVIA
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ELPAC & CINCINNATI MILACRON SCI & ISSC
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FIREYE & ITT SOLA ELECTRIC
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FOXBORO & BALSBAUGH SUMITOMO MACHINERY INC & TOSHIBA
FUJI ELECTRIC SUMTAK CORP
FUTEC SUNX LTD
GAI & ASEA BROWN BOVERI SUPERIOR ELECTRIC
GALIL MOTION CONTROLS SWEO ENGINEERING & ROCHESTER INSTRUMENT SYSTEMS
GD CALIFORNIA INC T&R ELECTRIC & SYRON ENGINEERING
GEM80 TAMAGAWA & RELIANCE ELECTRIC
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GIDDINGS & LEWIS TDK
GLENTEK TECNO ELETTRONICA
GOLDSTAR TECTROL
GORING KERR TEIJIN SEIKI
GOSSEN TEKEL
GRAHAM TODD PRODUCTS CORP
GRAINGER TOEI ELECTRIC
GRAPHA ELECTRONIC TOSHIBA
GREAT LAKES INSTRUMENTS TOTKU ELECTRIC & GENERAL ELECTRIC
GROUPE SCHNEIDER TRACO ENGINEERING
HAAS UNICO
HAMMOND UNIPOWER
HATHAWAY VAREC
HAYSEEN VECTOR VID
HEIDELBERG VERO ELECTRONICS & TELEMOTIVE
HEIDENHAIN CORP VIDEO JET
HIRATA VIEW TRONIX
HITACHI & FANUC VIVID
HITRON ELECTRONICS VOLGEN & POWER SOURCE
HOBART BROTHERS CO WARNER ELECTRIC & EMERSON
HOHER AUTOMATION WESTAMP INC & WESTINGHOUSE
HONEYWELL WESTINGHOUSE
HONEYWELL & NEMATRON CORP WHEDCO
HORNER ELECTRIC WIRE ELECTRIC
HUBBELL & FEMCO XENTEK INC
HUBNER & AMICON XYCOM & WARNER ELECTRIC
HURCO MFG CO YASKAWA ELECTRIC
IEE ZENITH
IMMERSION CORPORATION ZYCRON

How Circuit Boards Work

Thank you for choosing Industrial Repair Group. If you would like a printable version of How Circuit Boards Operate, please follow this link: IRG-Circuit-Boards

 

Part of a 1983 Sinclair ZX Spectrum computer board; a populated PCB, showing the conductive traces, vias (the through-hole paths to the other surface), and some mounted electrical components

A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, tracks or signal traces etched from copper sheets laminated onto a non-conductive substrate. It is also referred to as printed wiring board (PWB) or etched wiring board. A PCB populated with electronic components is a printed circuit assembly (PCA), also known as a printed circuit board assembly (PCBA). Printed circuit boards are used in virtually all but the simplest commercially-produced electronic devices.

PCBs are inexpensive, and can be highly reliable. They require much more layout effort and higher initial cost than either wire wrap or point-to-point construction, but are much cheaper and faster for high-volume production; the production and soldering of PCBs can be done by totally automated equipment. Much of the electronics industry’s PCB design, assembly, and quality control needs are set by standards that are published by the IPC organization.

History

The inventor of the printed circuit was the Austrian engineer Paul Eisler who, while working in England, made one circa 1936 as part of a radio set. Around 1943 the USA began to use the technology on a large scale to make rugged radios for use in World War II. After the war, in 1948, the USA released the invention for commercial use. Printed circuits did not become commonplace in consumer electronics until the mid-1950s, after the Auto-Sembly process was developed by the United States Army.

Before printed circuits (and for a while after their invention), point-to-point construction was used. For prototypes, or small production runs, wire wrap or turret board can be more efficient. Predating the printed circuit invention, and similar in spirit, was John Sargrove’s 1936-1947 Electronic Circuit Making Equipment (ECME) which sprayed metal onto a Bakelite plastic board. The ECME could produce 3 radios per minute.

During World War II, the development of the anti-aircraft proximity fuse required an electronic circuit that could withstand being fired from a gun, and could be produced in quantity. The Centralab Division of Globe Union submitted a proposal which met the requirements: a ceramic plate would be screenprinted with metallic paint for conductors and carbon material for resistors, with ceramic disc capacitors and subminiature vacuum tubes soldered in place.[1]

Originally, every electronic component had wire leads, and the PCB had holes drilled for each wire of each component. The components’ leads were then passed through the holes and soldered to the PCB trace. This method of assembly is called through-hole construction. In 1949, Moe Abramson and Stanislaus F. Danko of the United States Army Signal Corps developed the Auto-Sembly process in which component leads were inserted into a copper foil interconnection pattern and dip soldered. With the development of board lamination and etching techniques, this concept evolved into the standard printed circuit board fabrication process in use today. Soldering could be done automatically by passing the board over a ripple, or wave, of molten solder in a wave-soldering machine. However, the wires and holes are wasteful since drilling holes is expensive and the protruding wires are merely cut off.

In recent years, the use of surface mount parts has gained popularity as the demand for smaller electronics packaging and greater functionality has grown.

Manufacturing

Materials

 

A PCB as a design on a computer (left) and realized as a board assembly populated with components (right). The board is double sided, with through-hole plating, green solder resist, and white silkscreen printing. Both surface mount and through-hole components have been used.

 

A PCB in a computer mouse. The Component Side (left) and the printed side (right).

 

The Component Side of a PCB in a computer mouse; some examples for common components and their reference designations on the silk screen.

Conducting layers are typically made of thin copper foil. Insulating layers dielectric are typically laminated together with epoxy resin prepreg. The board is typically coated with a solder mask that is green in color. Other colors that are normally available are blue, black, white and red. There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known prepreg materials used in the PCB industry are FR-2 (Phenolic cotton paper), FR-3 (Cotton paper and epoxy), FR-4 (Woven glass and epoxy), FR-5 (Woven glass and epoxy), FR-6 (Matte glass and polyester), G-10 (Woven glass and epoxy), CEM-1 (Cotton paper and epoxy), CEM-2 (Cotton paper and epoxy), CEM-3 (Woven glass and epoxy), CEM-4 (Woven glass and epoxy), CEM-5 (Woven glass and polyester). Thermal expansion is an important consideration especially with BGA and naked die technologies, and glass fiber offers the best dimensional stability.

FR-4 is by far the most common material used today. The board with copper on it is called “copper-clad laminate”.

Copper foil thickness can be specified in ounces per square foot or micrometres. One ounce per square foot is 1.344 mils or 34 micrometres.

Patterning (etching)

The vast majority of printed circuit boards are made by bonding a layer of copper over the entire substrate, sometimes on both sides, (creating a “blank PCB”) then removing unwanted copper after applying a temporary mask (e.g. by etching), leaving only the desired copper traces. A few PCBs are made by adding traces to the bare substrate (or a substrate with a very thin layer of copper) usually by a complex process of multiple electroplating steps. The PCB manufacturing method primarily depends on whether it is for production volume or sample/prototype quantities.

Commercial (production quantities, usually PTH)

  • silk screen printing -the main commercial method.
  • Photographic methods. Used when fine linewidths are required.

Hobbyist/prototype (small quantities, usually not PTH)

  • Laser-printed resist: Laser-print onto paper (or wax paper), heat-transfer with an iron or modified laminator onto bare laminate, then etch.
  • Print onto transparent film and use as photomask along with photo-sensitized boards. (i.e. pre-sensitized boards), Then etch. (Alternatively, use a film photoplotter).
  • Laser resist ablation: Spray black paint onto copper clad laminate, place into CNC laser plotter. The laser raster-scans the PCB and ablates (vaporizes) the paint where no resist is wanted. Etch. (Note: laser copper ablation is rarely used and is considered experimental.)
  • Use a CNC-mill with a spade-shaped (i.e. 45-degree) cutter or miniature end-mill to route away the undesired copper, leaving only the traces.

There are three common “subtractive” methods (methods that remove copper) used for the production of printed circuit boards:

  1. Silk screen printing uses etch-resistant inks to protect the copper foil. Subsequent etching removes the unwanted copper. Alternatively, the ink may be conductive, printed on a blank (non-conductive) board. The latter technique is also used in the manufacture of hybrid circuits.
  2. Photoengraving uses a photomask and developer to selectively remove a photoresist coating. The remaining photoresist protects the copper foil. Subsequent etching removes the unwanted copper. The photomask is usually prepared with a photoplotter from data produced by a technician using CAM, or computer-aided manufacturing software. Laser-printed transparencies are typically employed for phototools; however, direct laser imaging techniques are being employed to replace phototools for high-resolution requirements.
  3. PCB milling uses a two or three-axis mechanical milling system to mill away the copper foil from the substrate. A PCB milling machine (referred to as a ‘PCB Prototyper’) operates in a similar way to a plotter, receiving commands from the host software that control the position of the milling head in the x, y, and (if relevant) z axis. Data to drive the Prototyper is extracted from files generated in PCB design software and stored in HPGL or Gerber file format.

“Additive” processes also exist. The most common is the “semi-additive” process. In this version, the unpatterned board has a thin layer of copper already on it. A reverse mask is then applied. (Unlike a subtractive process mask, this mask exposes those parts of the substrate that will eventually become the traces.) Additional copper is then plated onto the board in the unmasked areas; copper may be plated to any desired weight. Tin-lead or other surface platings are then applied. The mask is stripped away and a brief etching step removes the now-exposed original copper laminate from the board, isolating the individual traces. Some boards with plated through holes but still single sided were made with a process like this. General Electric made consumer radio sets in the late 1960s using boards like these.

The additive process is commonly used for multi-layer boards as it facilitates the plating-through of the holes (to produce conductive vias) in the circuit board.

  • PCB copper electroplating machine for adding copper to the in-process PCB

  • PCB’s in process of adding copper via electroplating

The dimensions of the copper conductors of the printed circuit board is related to the amount of current the conductor must carry. Each trace consists of a flat, narrow part of the copper foil that remains after etching. Signal traces are usually narrower than power or ground traces because their current carrying requirements are usually much less. In a multi-layer board one entire layer may be mostly solid copper to act as a ground plane for shielding and power return. For printed circuit boards that contain microwave circuits, transmission lines can be laid out in the form of stripline and microstrip with carefully-controlled dimensions to assure a consistent impedance. In radio-frequency circuits the inductance and capacitance of the printed circuit board conductors can be used as a delibrate part of the circuit design, obviating the need for additional discrete components.

Etching

Chemical etching is done with ferric chloride, ammonium persulfate, or sometimes hydrochloric acid. For PTH (plated-through holes), additional steps of electroless deposition are done after the holes are drilled, then copper is electroplated to build up the thickness, the boards are screened, and plated with tin/lead. The tin/lead becomes the resist leaving the bare copper to be etched away.

Lamination

Some PCBs have trace layers inside the PCB and are called multi-layer PCBs. These are formed by bonding together separately etched thin boards.

Drilling

Holes through a PCB are typically drilled with tiny drill bits made of solid tungsten carbide. The drilling is performed by automated drilling machines with placement controlled by a drill tape or drill file. These computer-generated files are also called numerically controlled drill (NCD) files or “Excellon files”. The drill file describes the location and size of each drilled hole. These holes are often filled with annular rings (hollow rivets) to create vias. Vias allow the electrical and thermal connection of conductors on opposite sides of the PCB.

Most common laminate is epoxy filled fiberglass. Drill bit wear is partly due to embedded glass, which is harder than steel. High drill speed necessary for cost effective drilling of hundreds of holes per board causes very high temperatures at the drill bit tip, and high temperatures (400-700 degrees) soften steel and decompose (oxidize) laminate filler. Copper is softer than epoxy and interior conductors may suffer damage during drilling.

When very small vias are required, drilling with mechanical bits is costly because of high rates of wear and breakage. In this case, the vias may be evaporated by lasers. Laser-drilled vias typically have an inferior surface finish inside the hole. These holes are called micro vias.

It is also possible with controlled-depth drilling, laser drilling, or by pre-drilling the individual sheets of the PCB before lamination, to produce holes that connect only some of the copper layers, rather than passing through the entire board. These holes are called blind vias when they connect an internal copper layer to an outer layer, or buried vias when they connect two or more internal copper layers and no outer layers.

The walls of the holes, for boards with 2 or more layers, are made conductive then plated with copper to form plated-through holes that electrically connect the conducting layers of the PCB. For multilayer boards, those with 4 layers or more, drilling typically produces a smear of the high temperature decomposition products of bonding agent in the laminate system. Before the holes can be plated through, this smear must be removed by a chemical de-smear process, or by plasma-etch. Removing (etching back) the smear also reveals the interior conductors as well.

Exposed conductor plating and coating

PCBs[2] are plated with solder, tin, or gold over nickel as a resist for etching away the unneeded underlying copper.[3]

After PCBs are etched and then rinsed with water, the soldermask is applied, and then any exposed copper is coated with solder, nickel/gold, or some other anti-corrosion coating.[4][5]

Matte solder is usually fused to provide a better bonding surface or stripped to bare copper. Treatments, such as benzimidazolethiol, prevent surface oxidation of bare copper. The places to which components will be mounted are typically plated, because untreated bare copper oxidizes quickly, and therefore is not readily solderable. Traditionally, any exposed copper was coated with solder by hot air solder levelling (HASL). The HASL finish prevents oxidation from the underlying copper, thereby guaranteeing a solderable surface.[6] This solder was a tin-lead alloy, however new solder compounds are now used to achieve compliance with the RoHS directive in the EU and US, which restricts the use of lead. One of these lead-free compounds is SN100CL, made up of 99.3% tin, 0.7% copper, 0.05% nickel, and a nominal of 60ppm germanium.

It is important to use solder compatible with both the PCB and the parts used. An example is Ball Grid Array (BGA) using tin-lead solder balls for connections losing their balls on bare copper traces or using lead-free solder paste.

Other platings used are OSP (organic surface protectant), immersion silver (IAg), immersion tin, electroless nickel with immersion gold coating (ENIG), and direct gold plating (over nickel). Edge connectors, placed along one edge of some boards, are often nickel plated then gold plated. Another coating consideration is rapid diffusion of coating metal into Tin solder. Tin forms intermetallics such as Cu5Sn6 and Ag3Cu that dissolve into the Tin liquidus or solidus(@50C), stripping surface coating and/or leaving voids.

Electrochemical migration (ECM) is the growth of conductive metal filaments on or in a printed circuit board (PCB) under the influence of a DC voltage bias.[7][8] Silver, zinc, and aluminum are known to grow whiskers under the influence of an electric field. Silver also grows conducting surface paths in the presence of halide and other ions, making it a poor choice for electronics use. Tin will grow “whiskers” due to tension in the plated surface. Tin-Lead or Solder plating also grows whiskers, only reduced by the percentage Tin replaced. Reflow to melt solder or tin plate to relieve surface stress lowers whisker incidence. Another coating issue is tin pest, the transformation of tin to a powdery allotrope at low temperature.[9]

Solder resist

Areas that should not be soldered may be covered with a polymer solder resist (solder mask) coating. The solder resist prevents solder from bridging between conductors and creating short circuits. Solder resist also provides some protection from the environment. Solder resist is typically 20-30 micrometres thick.

Screen printing

Line art and text may be printed onto the outer surfaces of a PCB by screen printing. When space permits, the screen print text can indicate component designators, switch setting requirements, test points, and other features helpful in assembling, testing, and servicing the circuit board.

Screen print is also known as the silk screen, or, in one sided PCBs, the red print.

Lately some digital printing solutions have been developed to substitute the traditional screen printing process. This technology allows printing variable data onto the PCB, including serialization and barcode information for traceability purposes.

Test

Unpopulated boards may be subjected to a bare-board test where each circuit connection (as defined in a netlist) is verified as correct on the finished board. For high-volume production, a Bed of nails tester, a fixture or a Rigid needle adapter is used to make contact with copper lands or holes on one or both sides of the board to facilitate testing. A computer will instruct the electrical test unit to apply a small voltage to each contact point on the bed-of-nails as required, and verify that such voltage appears at other appropriate contact points. A “short” on a board would be a connection where there should not be one; an “open” is between two points that should be connected but are not. For small- or medium-volume boards, flying probe and flying-grid testers use moving test heads to make contact with the copper/silver/gold/solder lands or holes to verify the electrical connectivity of the board under test.

Printed circuit assembly

After the printed circuit board (PCB) is completed, electronic components must be attached to form a functional printed circuit assembly,[10][11] or PCA (sometimes called a “printed circuit board assembly” PCBA). In through-hole construction, component leads are inserted in holes. In surface-mount construction, the components are placed on pads or lands on the outer surfaces of the PCB. In both kinds of construction, component leads are electrically and mechanically fixed to the board with a molten metal solder.

There are a variety of soldering techniques used to attach components to a PCB. High volume production is usually done with machine placement and bulk wave soldering or reflow ovens, but skilled technicians are able to solder very tiny parts (for instance 0201 packages which are 0.02 in. by 0.01 in.)[12] by hand under a microscope, using tweezers and a fine tip soldering iron for small volume prototypes. Some parts are impossible to solder by hand, such as ball grid array (BGA) packages.

Often, through-hole and surface-mount construction must be combined in a single assembly because some required components are available only in surface-mount packages, while others are available only in through-hole packages. Another reason to use both methods is that through-hole mounting can provide needed strength for components likely to endure physical stress, while components that are expected to go untouched will take up less space using surface-mount techniques.

After the board has been populated it may be tested in a variety of ways:

  • While the power is off, visual inspection, automated optical inspection. JEDEC guidelines for PCB component placement, soldering, and inspection are commonly used to maintain quality control in this stage of PCB manufacturing.
  • While the power is off, analog signature analysis, power-off testing.
  • While the power is on, in-circuit test, where physical measurements (i.e. voltage, frequency) can be done.
  • While the power is on, functional test, just checking if the PCB does what it had been designed for.

To facilitate these tests, PCBs may be designed with extra pads to make temporary connections. Sometimes these pads must be isolated with resistors. The in-circuit test may also exercise boundary scan test features of some components. In-circuit test systems may also be used to program nonvolatile memory components on the board.

In boundary scan testing, test circuits integrated into various ICs on the board form temporary connections between the PCB traces to test that the ICs are mounted correctly. Boundary scan testing requires that all the ICs to be tested use a standard test configuration procedure, the most common one being the Joint Test Action Group (JTAG) standard. The JTAG test architecture provides a means to test interconnects between integrated circuits on a board without using physical test probes. JTAG tool vendors provide various types of stimulus and sophisticated algorithms, not only to detect the failing nets, but also to isolate the faults to specific nets, devices, and pins.[13]

When boards fail the test, technicians may desolder and replace failed components, a task known as rework.

Protection and packaging

PCBs intended for extreme environments often have a conformal coating, which is applied by dipping or spraying after the components have been soldered. The coat prevents corrosion and leakage currents or shorting due to condensation. The earliest conformal coats were wax; modern conformal coats are usually dips of dilute solutions of silicone rubber, polyurethane, acrylic, or epoxy. Another technique for applying a conformal coating is for plastic to be sputtered onto the PCB in a vacuum chamber. The chief disadvantage of conformal coatings is that servicing of the board is rendered extremely difficult.[14]

Many assembled PCBs are static sensitive, and therefore must be placed in antistatic bags during transport. When handling these boards, the user must be grounded (earthed). Improper handling techniques might transmit an accumulated static charge through the board, damaging or destroying components. Even bare boards are sometimes static sensitive. Traces have become so fine that it’s quite possible to blow an etch off the board (or change its characteristics) with a static charge. This is especially true on non-traditional PCBs such as MCMs and microwave PCBs.

Design

  • Schematic capture or schematic entry is done through an EDA tool.
  • Card dimensions and template are decided based on required circuitry and case of the PCB. Determine the fixed components and heat sinks if required.
  • Deciding stack layers of the PCB. 4 to 12 layers or more depending on design complexity. Ground plane and Power plane are decided. Signal planes where signals are routed are in top layer as well as internal layers.[15]
  • Line impedance determination using dielectric layer thickness, routing copper thickness and trace-width. Trace separation also taken into account in case of differential signals. Microstrip, stripline or dual stripline can be used to route signals.
  • Placement of the components. Thermal considerations and geometry are taken into account. Vias and lands are marked.
  • Routing the signal trace. For optimal EMI performance high frequency signals are routed in internal layers between power or ground planes as power plane behaves as ground for AC.
  • Gerber file generation for manufacturing.

Safety certification (US)

Safety Standard UL 796 covers component safety requirements for printed wiring boards for use as components in devices or appliances. Testing analyzes characteristics such as flammability, maximum operating temperature, electrical tracking, heat deflection, and direct support of live electrical parts.

“Cordwood” construction

 

A cordwood module.

Cordwood construction can save significant space and was often used with wire-ended components in applications where space was at a premium (such as missile guidance and telemetry systems) and in high-speed computers, where short traces were important. In “cordwood” construction, axial-leaded components were mounted between two parallel planes. The components were either soldered together with jumper wire, or they were connected to other components by thin nickel ribbon welded at right angles onto the component leads. To avoid shorting together different interconnection layers, thin insulating cards were placed between them. Perforations or holes in the cards allowed component leads to project through to the next interconnection layer. One disadvantage of this system was that special nickel leaded components had to be used to allow the interconnecting welds to be made. Some versions of cordwood construction used single sided PCBs as the interconnection method (as pictured). This meant that normal leaded components could be used. Another disadvantage of this system is that components located in the interior are difficult to replace.

Before the advent of integrated circuits, this method allowed the highest possible component packing density; because of this, it was used by a number of computer vendors including Control Data Corporation. The cordwood method of construction now appears to have fallen into disuse, probably because high packing densities can be more easily achieved using surface mount techniques and integrated circuits.

Multiwire boards

Multiwire is a patented technique of interconnection which uses machine-routed insulated wires embedded in a non-conducting matrix (often plastic resin). It was used during the 1980s and 1990s. (Kollmorgen Technologies Corp., U.S. Patent 4,175,816) Multiwire is still available in 2010 through Hitachi. There are other competitive discrete wiring technologies that have been developed (Jumatech [2]).

Since it was quite easy to stack interconnections (wires) inside the embedding matrix, the approach allowed designers to forget completely about the routing of wires (usually a time-consuming operation of PCB design): Anywhere the designer needs a connection, the machine will draw a wire in straight line from one location/pin to another. This led to very short design times (no complex algorithms to use even for high density designs) as well as reduced crosstalk (which is worse when wires run parallel to each other—which almost never happens in Multiwire), though the cost is too high to compete with cheaper PCB technologies when large quantities are needed.

Surface-mount technology

Main article: Surface-mount technology
 

Surface mount components, including resistors, transistors and an integrated circuit

Surface-mount technology emerged in the 1960s, gained momentum in the early 1980s and became widely used by the mid 1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly on to the PCB surface. Components became much smaller and component placement on both sides of the board became more common than with through-hole mounting, allowing much higher circuit densities. Surface mounting lends itself well to a high degree of automation, reducing labour costs and greatly increasing production and quality rates. Carrier Tapes provide a stable and protective environment for Surface mount devices (SMDs) which can be one-quarter to one-tenth of the size and weight, and passive components can be one-half to one-quarter of the cost of corresponding through-hole parts. However, integrated circuits are often priced the same regardless of the package type, because the chip itself is the most expensive part. As of 2006, some wire-ended components, such as small-signal switch diodes, e.g. 1N4148, are actually significantly cheaper than corresponding SMD versions.

See also

Nuvola apps ksim.png Electronics portal
 

Schematic Capture. (KiCAD)

 

PCB layout. (KiCAD)

 

3D View. (KiCAD)

  • Breadboard
  • C.I.D.+
  • Design for manufacturability (PCB)
  • Electronic packaging
  • Electronic waste
  • Multi-Chip Module
  • Occam Process – another process for the manufacturing of PCBs
PCB Materials
  • Conductive ink
  • Heavy copper
  • Laminate materials:
    • BT-Epoxy
    • Composite epoxy material, CEM-1,5
    • Cyanate Ester
    • FR-2
    • FR-4, the most common PCB material
    • Polyimide
    • PTFE, Polytetrafluoroethylene (Teflon)
PCB layout software
  • List of EDA companies
  • Comparison of EDA software

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How AC Technology Drives Work

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How Variable-Frequency Drives Operate

A variable-frequency drive (VFD), also known as an AC Drive, is a system for controlling the rotational speed of an alternating current (AC) electric motor by controlling the frequency of the electrical power supplied to the motor.[1][2][3] A variable frequency drive is a specific type of adjustable-speed drive. Variable-frequency drives are also known as adjustable-frequency drives (AFD), variable-speed drives (VSD), AC drives, microdrives or inverter drives. Since the voltage is varied along with frequency, these are sometimes also called VVVF (variable voltage variable frequency) drives.

Variable-frequency drives are widely used. In ventilation systems for large buildings, variable-frequency motors on fans save energy by allowing the volume of air moved to match the system demand. They are also used on pumps, elevator, conveyor and machine tool drives.

VFD types

All VFDs use their output devices (IGBTs, transistors, thyristors) only as switches, turning them only on or off. Using a linear device such as a transistor in its linear mode is impractical for a VFD drive, since the power dissipated in the drive devices would be about as much as the power delivered to the load.

Drives can be classified as:

  • Constant voltage
  • Constant current
  • Cycloconverter

In a constant voltage converter, the intermediate DC link voltage remains approximately constant during each output cycle. In constant current drives, a large inductor is placed between the input rectifier and the output bridge, so the current delivered is nearly constant. A cycloconverter has no input rectifier or DC link and instead connects each output terminal to the appropriate input phase.

The most common type of packaged VF drive is the constant-voltage type, using pulse width modulation to control both the frequency and effective voltage applied to the motor load.

VFD system description

VFD system

A variable frequency drive system generally consists of an AC motor, a controller and an operator interface.[4][5]

VFD motor

The motor used in a VFD system is usually a three-phase induction motor. Some types of single-phase motors can be used, but three-phase motors are usually preferred. Various types of synchronous motors offer advantages in some situations, but induction motors are suitable for most purposes and are generally the most economical choice. Motors that are designed for fixed-speed operation are often used. Certain enhancements to the standard motor designs offer higher reliability and better VFD performance, such as MG-31 rated motors.[6]

VFD controller

Variable frequency drive controllers are solid state electronic power conversion devices. The usual design first converts AC input power to DC intermediate power using a rectifier or converter bridge. The rectifier is usually a three-phase, full-wave-diode bridge. The DC intermediate power is then converted to quasi-sinusoidal AC power using an inverter switching circuit. The inverter circuit is probably the most important section of the VFD, changing DC energy into three channels of AC energy that can be used by an AC motor. These units provide improved power factor, less harmonic distortion, and low sensitivity to the incoming phase sequencing than older phase controlled converter VFD’s. Since incoming power is converted to DC, many units will accept single-phase as well as three-phase input power (acting as a phase converter as well as a speed controller); however the unit must be derated when using single phase input as only part of the rectifier bridge is carrying the connected load.[7]

As new types of semiconductor switches have been introduced, these have promptly been applied to inverter circuits at all voltage and current ratings for which suitable devices are available. Introduced in the 1980s, the insulated-gate bipolar transistor (IGBT) became the device used in most VFD inverter circuits in the first decade of the 21st century.[8][9][10]

AC motor characteristics require the applied voltage to be proportionally adjusted whenever the frequency is changed in order to deliver the rated torque. For example, if a motor is designed to operate at 460 volts at 60 Hz, the applied voltage must be reduced to 230 volts when the frequency is reduced to 30 Hz. Thus the ratio of volts per hertz must be regulated to a constant value (460/60 = 7.67 V/Hz in this case). For optimum performance, some further voltage adjustment may be necessary especially at low speeds, but constant volts per hertz is the general rule. This ratio can be changed in order to change the torque delivered by the motor.[11]

In addition to this simple volts per hertz control more advanced control methods such as vector control and direct torque control (DTC) exist. These methods adjust the motor voltage in such a way that the magnetic flux and mechanical torque of the motor can be precisely controlled.

The usual method used to achieve variable motor voltage is pulse-width modulation (PWM). With PWM voltage control, the inverter switches are used to construct a quasi-sinusoidal output waveform by a series of narrow voltage pulses with pseudosinusoidal varying pulse durations.[8][12]

Operation of the motors above rated name plate speed (base speed) is possible, but is limited to conditions that do not require more power than nameplate rating of the motor. This is sometimes called “field weakening” and, for AC motors, means operating at less than rated volts/hertz and above rated name plate speed. Permanent magnet synchronous motors have quite limited field weakening speed range due to the constant magnet flux linkage. Wound rotor synchronous motors and induction motors have much wider speed range. For example, a 100 hp, 460 V, 60 Hz, 1775 RPM (4 pole) induction motor supplied with 460 V, 75 Hz (6.134 V/Hz), would be limited to 60/75 = 80% torque at 125% speed (2218.75 RPM) = 100% power.[13] At higher speeds the induction motor torque has to be limited further due to the lowering of the breakaway torque of the motor. Thus rated power can be typically produced only up to 130…150 % of the rated name plate speed. Wound rotor synchronous motors can be run even higher speeds. In rolling mill drives often 200…300 % of the base speed is used. Naturally the mechanical strength of the rotor and lifetime of the bearings is also limiting the maximum speed of the motor. It is recommended to consult the motor manufacturer if more than 150 % speed is required by the application.

PWM VFD Output Voltage Waveform

An embedded microprocessor governs the overall operation of the VFD controller. The main microprocessor programming is in firmware that is inaccessible to the VFD user. However, some degree of configuration programming and parameter adjustment is usually provided so that the user can customize the VFD controller to suit specific motor and driven equipment requirements.[8]

VFD operator interface

The operator interface provides a means for an operator to start and stop the motor and adjust the operating speed. Additional operator control functions might include reversing and switching between manual speed adjustment and automatic control from an external process control signal. The operator interface often includes an alphanumeric display and/or indication lights and meters to provide information about the operation of the drive. An operator interface keypad and display unit is often provided on the front of the VFD controller as shown in the photograph above. The keypad display can often be cable-connected and mounted a short distance from the VFD controller. Most are also provided with input and output (I/O) terminals for connecting pushbuttons, switches and other operator interface devices or control signals. A serial communications port is also often available to allow the VFD to be configured, adjusted, monitored and controlled using a computer.[8][14][15]

VFD operation

When an induction motor is connected to a full voltage supply, it draws several times (up to about 6 times) its rated current. As the load accelerates, the available torque usually drops a little and then rises to a peak while the current remains very high until the motor approaches full speed.

By contrast, when a VFD starts a motor, it initially applies a low frequency and voltage to the motor. The starting frequency is typically 2 Hz or less. Thus starting at such a low frequency avoids the high inrush current that occurs when a motor is started by simply applying the utility (mains) voltage by turning on a switch. After the start of the VFD, the applied frequency and voltage are increased at a controlled rate or ramped up to accelerate the load without drawing excessive current. This starting method typically allows a motor to develop 150% of its rated torque while the VFD is drawing less than 50% of its rated current from the mains in the low speed range. A VFD can be adjusted to produce a steady 150% starting torque from standstill right up to full speed.[16] Note, however, that cooling of the motor is usually not good in the low speed range. Thus running at low speeds even with rated torque for long periods is not possible due to overheating of the motor. If continuous operation with high torque is required in low speeds an external fan is usually needed. The manufacturer of the motor and/or the VFD should specify the cooling requirements for this mode of operation.

In principle, the current on the motor side is in direct proportion of the torque that is generated and the voltage on the motor is in direct proportion of the actual speed, while on the network side, the voltage is constant, thus the current on line side is in direct proportion of the power drawn by the motor, that is U.I or C.N where C is torque and N the speed of the motor (we shall consider losses as well, neglected in this explanation).

(1) n stands for network (grid) and m for motor

(2) C stands for torque [Nm], U for voltage [V], I for current [A], and N for speed [rad/s]

We neglect losses for the moment :

Un.In = Um.Im (same power drawn from network and from motor)

Um.Im = Cm.Nm (motor mechanical power = motor electrical power)

Given Un is a constant (network voltage) we conclude : In = Cm.Nm/Un That is “line current (network) is in direct proportion of motor power”.

With a VFD, the stopping sequence is just the opposite as the starting sequence. The frequency and voltage applied to the motor are ramped down at a controlled rate. When the frequency approaches zero, the motor is shut off. A small amount of braking torque is available to help decelerate the load a little faster than it would stop if the motor were simply switched off and allowed to coast. Additional braking torque can be obtained by adding a braking circuit (resistor controlled by a transistor) to dissipate the braking energy. With 4-quadrants rectifiers (active-front-end), the VFD is able to brake the load by applying a reverse torque and reverting the energy back to the network.

Power line harmonics

While PWM allows for nearly sinusoidal currents to be applied to a motor load, the diode rectifier of the VFD takes roughly square-wave current pulses out of the AC grid, creating harmonic distortion in the power line voltage. When the VFD load size is small and the available utility power is large, the effects of VFD systems slicing small chunks out of AC grid generally go unnoticed. Further, in low voltage networks the harmonics caused by single phase equipment such as computers and TVs are such that they are partially cancelled by three-phase diode bridge harmonics.

However, when either a large number of low-current VFDs, or just a few very large-load VFDs are used, they can have a cumulative negative impact on the AC voltages available to other utility customers in the same grid.

When the utility voltage becomes misshapen and distorted the losses in other loads such as normal AC motors are increased. This may in the worst case lead to overheating and shorter operation life. Also substation transformers and compensation capacitors are affected, the latter especially if resonances are aroused by the harmonics.

In order to limit the voltage distortion the owner of the VFDs may be required to install filtering equipment to smooth out the irregular waveform. Alternately, the utility may choose to install filtering equipment of its own at substations affected by the large amount of VFD equipment being used. In high power installations decrease of the harmonics can be obtained by supplying the VSDs from transformers that have different phase shift.[17]

Further, it is possible to use instead of the diode rectifier a similar transistor circuit that is used to control the motor. This kind of rectifier is called active infeed converter in IEC standards. However, manufacturers call it by several names such as active rectifier, ISU (IGBT Supply Unit), AFE (Active Front End) or four quadrant rectifier. With PWM control of the transistors and filter inductors in the supply lines the AC current can be made nearly sinusoidal. Even better attenuation of the harmonics can be obtained by using an LCL (inductor-capacitor-inductor) filter instead of single three-phase filter inductor.

Additional advantage of the active infeed converter over the diode bridge is its ability to feed back the energy from the DC side to the AC grid. Thus no braking resistor is needed and the efficiency of the drive is improved if the drive is frequently required to brake the motor.

Application considerations

The output voltage of a PWM VFD consists of a train of pulses switched at the carrier frequency. Because of the rapid rise time of these pulses, transmission line effects of the cable between the drive and motor must be considered. Since the transmission-line impedance of the cable and motor are different, pulses tend to reflect back from the motor terminals into the cable. The resulting voltages can produce up to twice the rated line voltage for long cable runs, putting high stress on the cable and motor winding and eventual insulation failure. Increasing the cable or motor size/type for long runs and 480v or 600v motors will help offset the stresses imposed upon the equipment due to the VFD (modern 230v single phase motors not effected). At 460 V, the maximum recommended cable distances between VFDs and motors can vary by a factor of 2.5:1. The longer cables distances are allowed at the lower Carrier Switching Frequencies (CSF) of 2.5 kHz. The lower CSF can produce audible noise at the motors. For applications requiring long motor cables VSD manufacturers usually offer du/dt filters that decrease the steepness of the pulses. For very long cables or old motors with insufficient winding insulation more efficient sinus filter is recommended. Expect the older motor’s life to shorten. Purchase VFD rated motors for the application.

Further, the rapid rise time of the pulses may cause trouble with the motor bearings. The stray capacitance of the windings provide paths for high frequency currents that close through the bearings. If the voltage between the shaft and the shield of the motor exceeds few volts the stored charge is discharged as a small spark. Repeated sparking causes erosion in the bearing surface that can be seen as fluting pattern. In order to prevent sparking the motor cable should provide a low impedance return path from the motor frame back to the inverter. Thus it is essential to use a cable designed to be used with VSDs.[18]

In big motors a slip ring with brush can be used to provide a bypass path for the bearing currents. Alternatively isolated bearings can be used.

The 2.5 kHz and 5 kHz CSFs cause fewer motor bearing problems than the 20 kHz CSFs.[19] Shorter cables are recommended at the higher CSF of 20 kHz. The minimum CSF for synchronize tracking of multiple conveyors is 8 kHz.

The high frequency current ripple in the motor cables may also cause interference with other cabling in the building. This is another reason to use a motor cable designed for VSDs that has a symmetrical three-phase structure and good shielding. Further, it is highly recommended to route the motor cables as far away from signal cables as possible.[20]

Available VFD power ratings

Variable frequency drives are available with voltage and current ratings to match the majority of 3-phase motors that are manufactured for operation from utility (mains) power. VFD controllers designed to operate at 111 V to 690 V are often classified as low voltage units. Low voltage units are typically designed for use with motors rated to deliver 0.2 kW or 1/4 horsepower (hp) up to several megawatts. For example, the largest ABB ACS800 single drives are rated for 5.6 MW[21] . Medium voltage VFD controllers are designed to operate at 2,400/4,162 V (60 Hz), 3,000 V (50 Hz) or up to 10 kV. In some applications a step up transformer is placed between a low voltage drive and a medium voltage load. Medium voltage units are typically designed for use with motors rated to deliver 375 kW or 500 hp and above. Medium voltage drives rated above 7 kV and 5,000 or 10,000 hp should probably be considered to be one-of-a-kind (one-off) designs.[22]

Medium voltage drives are generally rated amongst the following voltages : 2,3 KV – 3,3 Kv – 4 Kv – 6 Kv – 11 Kv

The in-between voltages are generally possible as well. The power of MV drives is generally in the range of 0,3 to 100 MW however involving a range a several different type of drives with different technologies.

Dynamic braking

Using the motor as a generator to absorb energy from the system is called dynamic braking. Dynamic braking stops the system more quickly than coasting. Since dynamic braking requires relative motion of the motor’s parts, it becomes less effective at low speed and cannot be used to hold a load at a stopped position. During normal braking of an electric motor the electrical energy produced by the motor is dissipated as heat inside of the rotor, which increases the likelihood of damage and eventual failure. Therefore, some systems transfer this energy to an outside bank of resistors. Cooling fans may be used to protect the resistors from damage. Modern systems have thermal monitoring, so if the temperature of the bank becomes excessive, it will be switched off.[23]

Regenerative variable-frequency drives

Regenerative AC drives have the capacity to recover the braking energy of an overhauling load and return it to the power system.[24]

Line regenerative variable frequency drives, showing capacitors(top cylinders)and inductors attached which filter the regenerated power.

[2][3][24][25][26][27]

Cycloconverters and current-source inverters inherently allow return of energy from the load to the line; voltage-source inverters require an additional converter to return energy to the supply.[28]

Regeneration is only useful in variable-frequency drives where the value of the recovered energy is large compared to the extra cost of a regenerative system,[28] and if the system requires frequent braking and starting. An example would be use in conveyor belt during manufacturing where it should stop for every few minutes, so that the parts can be assembled correctly and moves on. Another example is a crane, where the hoist motor stops and reverses frequently, and braking is required to slow the load during lowering. Regenerative variable-frequency drives are widely used where speed control of overhauling loads is required.

Brushless DC motor drives

Much of the same logic contained in large, powerful VFDs is also embedded in small brushless DC motors such as those commonly used in computer fans. In this case, the chopper usually converts a low DC voltage (such as 12 volts) to the three-phase current used to drive the electromagnets that turn the permanent magnet rotor.

See also

  • Regenerative variable-Frequency drives
  • Direct torque control
  • Frequency changer
  • Space Vector Modulation
  • Variable speed air compressor
  • Vector control (motor)
Category : AC Drive Repair | AC, DC, VFD, Servo Drives | DC Drive Repair | Electronic Repair Services | Industrial Controls Repair | Industrial Repair Group | Industrial Repair Service | Servo Drive Repair | Spindle Drive Repair | VFD Drives | Blog
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HONEYWELL WESTINGHOUSE
HONEYWELL & NEMATRON CORP WHEDCO
HORNER ELECTRIC WIRE ELECTRIC
HUBBELL & FEMCO XENTEK INC
HUBNER & AMICON XYCOM & WARNER ELECTRIC
HURCO MFG CO YASKAWA ELECTRIC
IEE ZENITH
IMMERSION CORPORATION ZYCRON

How Power Supplies Work

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A power supply is a device that supplies electrical energy to one or more electric loads. The term is most commonly applied to devices that convert one form of electrical energy to another, though it may also refer to devices that convert another form of energy (e.g., mechanical, chemical, solar) to electrical energy. A regulated power supply is one that controls the output voltage or current to a specific value; the controlled value is held nearly constant despite variations in either load current or the voltage supplied by the power supply’s energy source.

Every power supply must obtain the energy it supplies to its load, as well as any energy it consumes while performing that task, from an energy source. Depending on its design, a power supply may obtain energy from:

  • Electrical energy transmission systems. Common examples of this include power supplies that convert AC line voltage to DC voltage.
  • Energy storage devices such as batteries and fuel cells.
  • Electromechanical systems such as generators and alternators.
  • Solar power.

A power supply may be implemented as a discrete, stand-alone device or as an integral device that is hardwired to its load. In the latter case, for example, low voltage DC power supplies are commonly integrated with their loads in devices such as computers and household electronics.

Constraints that commonly affect power supplies include:

  • The amount of voltage and current they can supply.
  • How long they can supply energy without needing some kind of refueling or recharging (applies to power supplies that employ portable energy sources).
  • How stable their output voltage or current is under varying load conditions.
  • Whether they provide continuous or pulsed energy.

Power supplies types

Power supplies for electronic devices can be broadly divided into linear and switching power supplies. The linear supply is usually a relatively simple design, but it becomes increasingly bulky and heavy for high-current equipment due to the need for large mains-frequency transformers and heat-sinked electronic regulation circuitry. Linear voltage regulators produce regulated output voltage by means of an active voltage divider that consumes energy, thus making efficiency low. A switched-mode supply of the same rating as a linear supply will be smaller, is usually more efficient, but will be more complex.

Battery

A battery is an alternative to a line-operated power supply;[1] it is independent of the availability of mains electricity, suitable for portable equipment and use in locations without mains power. A battery consists of several electrochemical cells connected in series to provide the voltage desired. Batteries may be primary (able to supply current when constructed, discarded when drained) or secondary (rechargeable; can be charged, used, and recharged many times)

The primary cell first used was the carbon-zinc dry cell.[1] It had a voltage of 1.5 volts; later battery types have been manufactured, when possible, to give the same voltage per cell. Carbon-zinc and related cells are still used, but the alkaline battery delivers more energy per unit weight and is widely used. The most commonly used battery voltages are 1.5 (1 cell) and 9V (6 cells).

Various technologies of rechargeable battery are used. Types most commonly used are NiMH, and lithium ion and variants.

DC power supply

A home-made linear power supply (used here to power amateur radio equipment)

An AC powered unregulated power supply usually uses a transformer to convert the voltage from the wall outlet (mains) to a different, nowadays usually lower, voltage. If it is used to produce DC, a rectifier is used to convert alternating voltage to a pulsating direct voltage, followed by a filter, comprising one or more capacitors, resistors, and sometimes inductors, to filter out (smooth) most of the pulsation. A small remaining unwanted alternating voltage component at mains or twice mains power frequency (depending upon whether half- or full-wave rectification is used)—ripple—is unavoidably superimposed on the direct output voltage.

For purposes such as charging batteries the ripple is not a problem, and the simplest unregulated mains-powered DC power supply circuit consists of a transformer driving a single diode in series with a resistor.

Before the introduction of solid-state electronics, equipment used valves (vacuum tubes) which required high voltages; power supplies used step-up transformers, rectifiers, and filters to generate one or more direct voltages of some hundreds of volts, and a low alternating voltage for filaments. Only the most advanced equipment used expensive and bulky regulated power supplies.

AC power supply

An AC power supply typically takes the voltage from a wall outlet (mains supply, often 230v in Europe) and lowers it to the desired voltage (eg 9vac). As well as lowering the voltage some filtering may take place. An example use for an AC power supply is powering certain guitar effects pedals (e.g. the Digitech Whammy pedal) although it is more common for effects pedals to require DC.

Linear regulated power supply

The voltage produced by an unregulated power supply will vary depending on the load and on variations in the AC supply voltage. For critical electronics applications a linear regulator may be used to set the voltage to a precise value, stabilized against fluctuations in input voltage and load. The regulator also greatly reduces the ripple and noise in the output direct current. Linear regulators often provide current limiting, protecting the power supply and attached circuit from overcurrent.

Adjustable linear power supplies are common laboratory and service shop test equipment, allowing the output voltage to be adjusted over a range. For example, a bench power supply used by circuit designers may be adjustable up to 30 volts and up to 5 amperes output. Some can be driven by an external signal, for example, for applications requiring a pulsed output.

AC/DC supply

Main article: AC/DC (electricity)

In the past, mains electricity was supplied as DC in some regions, AC in others. Transformers cannot be used for DC, but a simple, cheap unregulated power supply could run directly from either AC or DC mains without using a transformer. The power supply consisted of a rectifier and a filter capacitor. When operating from DC, the rectifier was essentially a conductor, having no effect; it was included to allow operation from AC or DC without modification.

Switched-mode power supply

Main article: Switched-mode power supply

A computer’s switched mode power supply unit.

A switched-mode power supply (SMPS) works on a different principle. AC input, usually at mains voltage, is rectified without the use of a mains transformer, to obtain a DC voltage. This voltage is then switched on and off at a high speed by electronic switching circuitry, which may then pass through a high-frequency, hence small, light, and cheap, transformer or inductor. The duty cycle of the output square wave increases as power output requirements increase. Switched-mode power supplies are always regulated. If the SMPS uses a properly-insulated high-frequency transformer, the output will be electrically isolated from the mains, essential for safety.

The input power slicing occurs at a very high speed (typically 10 kHz — 1 MHz). High frequency and high voltages in this first stage permit much smaller transformers and smoothing capacitors than in a power supply operating at mains frequency, as linear supplies do. After the transformer secondary, the AC is again rectified to DC. To keep output voltage constant, the power supply needs a sophisticated feedback controller to monitor current drawn by the load.

SMPSs often include safety features such as current limiting or a crowbar circuit to help protect the device and the user from harm.[2] In the event that an abnormal high-current power draw is detected, the switched-mode supply can assume this is a direct short and will shut itself down before damage is done. For decades PC power supplies have provided a power good signal to the motherboard whose absence prevents operation when abnormal supply voltages are present.

SMPSs have an absolute limit on their minimum current output.[3] They are only able to output above a certain power level and cannot function below that point. In a no-load condition the frequency of the power slicing circuit increases to great speed, causing the isolated transformer to act as a Tesla coil, causing damage due to the resulting very high voltage power spikes. Switched-mode supplies with protection circuits may briefly turn on but then shut down when no load has been detected. A very small low-power dummy load such as a ceramic power resistor or 10-watt light bulb can be attached to the supply to allow it to run with no primary load attached.

Power factor has become a recent issue of concern for computer manufacturers. Switched mode power supplies have traditionally been a source of power line harmonics and have a very poor power factor. Many computer power supplies built in the last few years now include power factor correction built right into the switched-mode supply, and may advertise the fact that they offer 1.0 power factor.

By slicing up the sinusoidal AC wave into very small discrete pieces, a portion of unused alternating current stays in the power line as very small spikes of power that cannot be utilized by AC motors and results in waste heating of power line transformers. Hundreds of switched mode power supplies in a building can result in poor power quality for other customers surrounding that building, and high electric bills for the company if they are billed according to their power factor in addition to the actual power used. Filtering capacitor banks may be needed on the building power mains to suppress and absorb these negative power factor effects[citation needed].

Programmable power supply

Programmable power supplies

Programmable power supplies allow for remote control of the output voltage through an analog input signal or a computer interface such as RS232 or GPIB. Variable properties include voltage, current, and frequency (for AC output units). These supplies are composed of a processor, voltage/current programming circuits, current shunt, and voltage/current read-back circuits. Additional features can include overcurrent, overvoltage, and short circuit protection, and temperature compensation. Programmable power supplies also come in a variety of forms including modular, board-mounted, wall-mounted, floor-mounted or bench top.

Programmable power supplies can furnish DC, AC, or AC with a DC offset. The AC output can be either single-phase or three-phase. Single-phase is generally used for low-voltage, while three-phase is more common for high-voltage power supplies.

Programmable power supplies are now used in many applications. Some examples include automated equipment testing, crystal growth monitoring, and differential thermal analysis.[4]

Uninterruptible power supply

Main article: Uninterruptible power supply

An uninterruptible power supply (UPS) takes its power from two or more sources simultaneously. It is usually powered directly from the AC mains, while simultaneously charging a storage battery. Should there be a dropout or failure of the mains, the battery instantly takes over so that the load never experiences an interruption. Such a scheme can supply power as long as the battery charge suffices, e.g., in a computer installation, giving the operator sufficient time to effect an orderly system shutdown without loss of data. Other UPS schemes may use an internal combustion engine or turbine to continuously supply power to a system in parallel with power coming from the AC . The engine-driven generators would normally be idling, but could come to full power in a matter of a few seconds in order to keep vital equipment running without interruption. Such a scheme might be found in hospitals or telephone central offices.

High-voltage power supply

High voltage refers to an output on the order of hundreds or thousands of volts. High-voltage supplies use a linear setup to produce an output voltage in this range.

Additional features available on high-voltage supplies can include the ability to reverse the output polarity along with the use of circuit breakers and special connectors intended to minimize arcing and accidental contact with human hands. Some supplies provide analog inputs (i.e. 0-10V) that can be used to control the output voltage, effectively turning them into high-voltage amplifiers albeit with very limited bandwidth.

Voltage multipliers

Voltage multipliers, as the name implies, are circuits designed to multiply the input voltage. The input voltage may be doubled (voltage doubler), tripled (voltage tripler), quadrupled (voltage quadrupler), etc. Voltage multipliers are also power converters. An AC input is converted to a higher DC output. These circuits allow high voltages to be obtained using a much lower voltage AC source.

Typically, voltage multipliers are composed of half-wave rectifiers, capacitors, and diodes. For example, a voltage tripler consists of three half-wave rectifiers, three capacitors, and three diodes (see Cockcroft Walton Multiplier). Full-wave rectifiers may be used in a different configuration to achieve even higher voltages. Also, both parallel and series configurations are available. For parallel multipliers, a higher voltage rating is required at each consecutive multiplication stage, but less capacitance is required. The voltage capability of the capacitor limits the maximum output voltage.

Voltage multipliers have many applications. For example, voltage multipliers can be found in everyday items like televisions and photocopiers. Even more applications can be found in the laboratory, such as cathode ray tubes, oscilloscopes, and photomultiplier tubes.[5][6]

Power supply applications

Computer power supply

Main article: Computer power supply

A modern computer power supply is a switch with on and off supply designed to convert 110-240 V AC power from the mains supply, to several output both positive (and historically negative) DC voltages in the range + 12V,-12V,+5V,+5VBs and +3.3V. The first generation of computers power supplies were linear devices, but as cost became a driving factor, and weight became important, switched mode supplies are almost universal.

The diverse collection of output voltages also have widely varying current draw requirements, which are difficult to all be supplied from the same switched-mode source. Consequently most modern computer power supplies actually consist of several different switched mode supplies, each producing just one voltage component and each able to vary its output based on component power requirements, and all are linked together to shut down as a group in the event of a fault condition.

Welding power supply

Main article: Welding power supply

Arc welding uses electricity to melt the surfaces of the metals in order to join them together through coalescence. The electricity is provided by a welding power supply, and can either be AC or DC. Arc welding typically requires high currents typically between 100 and 350 amps. Some types of welding can use as few as 10 amps, while some applications of spot welding employ currents as high as 60,000 amps for an extremely short time. Older welding power supplies consisted of transformers or engines driving generators. More recent supplies use semiconductors and microprocessors reducing their size and weight.

AC adapter

Switched mode mobile phone charger

Main article: AC adapter

A linear or switched-mode power supply (or in some cases just a transformer) that is built into the top of a plug is known as a “plug pack”, “plug-in adapter”, “adapter block”, “domestic mains adapter” or just “power adapter”. Slang terms include “wall wart” and “power brick”. They are even more diverse than their names; often with either the same kind of DC plug offering different voltage or polarity, or a different plug offering the same voltage. “Universal” adapters attempt to replace missing or damaged ones, using multiple plugs and selectors for different voltages and polarities. Replacement power supplies must match the voltage of, and supply at least as much current as, the original power supply.

The least expensive AC units consist solely of a small transformer, while DC adapters include a few additional diodes. Whether or not a load is connected to the power adapter, the transformer has a magnetic field continuously present and normally cannot be completely turned off unless unplugged.

Because they consume standby power, they are sometimes known as “electricity vampires” and may be plugged into a power strip to allow turning them off. Expensive switched-mode power supplies can cut off leaky electrolyte-capacitors, use powerless MOSFETs, and reduce their working frequency to get a gulp of energy once in a while to power, for example, a clock, which would otherwise need a battery.

Overload protection

Power supplies often include some type of overload protection that protects the power supply from load faults (e.g., short circuits) that might otherwise cause damage by overheating components or, in the worst case, electrical fire. Fuses and circuit breakers are two commonly used mechanisms for overload protection.[1]

Fuses

A fuse is a piece of wire, often in a casing that improves its electrical characteristics. If too much current flows, the wire becomes hot and melts. This effectively disconnects the power supply from its load, and the equipment stops working until the problem that caused the overload is identified and the fuse is replaced.

There are various types of fuses used in power supplies.

  • fast blow fuses cut the power as quick as they can
  • slow blow fuses tolerate more short term overload
  • wire link fuses are just an open piece of wire, and have poorer overload characteristics than glass and ceramic fuses

Some power supplies use a very thin wire link soldered in place as a fuse.

Circuit breakers

One benefit of using a circuit breaker as opposed to a fuse is that it can simply be reset instead of having to replace the blown fuse. A circuit breaker contains an element that heats, bends and triggers a spring which shuts the circuit down. Once the element cools, and the problem is identified the breaker can be reset and the power restored.

Thermal cutouts

Some PSUs use a thermal cutout buried in the transformer rather than a fuse. The advantage is it allows greater current to be drawn for limited time than the unit can supply continuously. Some such cutouts are self resetting, some are single use only.

Current limiting

Some supplies use current limiting instead of cutting off power if overloaded. The two types of current limiting used are electronic limiting and impedance limiting. The former is common on lab bench PSUs, the latter is common on supplies of less than 3 watts output.

A foldback current limiter reduces the output current to much less than the maximum non-fault current.

Power conversion

The term “power supply” is sometimes restricted to those devices that convert some other form of energy into electricity (such as solar power and fuel cells and generators). A more accurate term for devices that convert one form of electric power into another form (such as transformers and linear regulators) is power converter. The most common conversion is from AC to DC.

Mechanical power supplies

  • Flywheels coupled to electrical generators or alternators
  • Compulsators
  • Explosively pumped flux compression generators

Terminology

  • SCP – Short circuit protection
  • OPP – Overpower (overload) protection
  • OCP – Overcurrent protection
  • OTP – Overtemperature protection
  • OVP – Overvoltage protection
  • UVP – Undervoltage protection
  • UPS – Uninterruptable Power Supply
  • PSU – Power Supply Unit
  • SMPSU – Switch-Mode Power Supply Unit

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Category : Electronic Repair Services | Industrial Repair Group | Industrial Repair Service | Uncategorized | Blog
19
Feb

VFD, AC, DC, & Servo Drive Repair

Service

If you need VFD, AC, DC, & Servo Drive Repair, Industrial Repair Group is your go to partner for dependable service .

Industrial Repair Group performs extensive component level repairs, touching up solder traces, replacing bad components, as well as full testing of ICs, PALs, EPROMs, GALs, surface mounted components and much more. Every VFD, AC, DC, & Servo Drive Repair is subjected to dynamic function tests to verify successful repair and then backed by our 18 month repair guarantee. Sealers and conformal coatings are re-applied as needed with each repair restoring your equipment back to its original OEM specs.

Industrial Repair Group is more than a service provider for your industry. We are a partner and a dedicated resource for your team members to rely upon. Feel confident that we don't play the lingo game. We are real people, with real goals. Our company is always open minded and intent on isolating problems to keep organizations up and running 24/7. We are a leading service provider that believes educated personal is the best policy.

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How AC, DC, Servo Drives Work

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How Variable-Frequency Drives Operate

A variable-frequency drive (VFD) is a system for controlling the rotational speed of an alternating current (AC) electric motor by controlling the frequency of the electrical power supplied to the motor.[1][2][3] A variable frequency drive is a specific type of adjustable-speed drive. Variable-frequency drives are also known as adjustable-frequency drives (AFD), variable-speed drives (VSD), AC drives, microdrives or inverter drives. Since the voltage is varied along with frequency, these are sometimes also called VVVF (variable voltage variable frequency) drives.

Variable-frequency drives are widely used. In ventilation systems for large buildings, variable-frequency motors on fans save energy by allowing the volume of air moved to match the system demand. They are also used on pumps, elevator, conveyor and machine tool drives.

VFD types

All VFDs use their output devices (IGBTs, transistors, thyristors) only as switches, turning them only on or off. Using a linear device such as a transistor in its linear mode is impractical for a VFD drive, since the power dissipated in the drive devices would be about as much as the power delivered to the load.

Drives can be classified as:

  • Constant voltage
  • Constant current
  • Cycloconverter

In a constant voltage converter, the intermediate DC link voltage remains approximately constant during each output cycle. In constant current drives, a large inductor is placed between the input rectifier and the output bridge, so the current delivered is nearly constant. A cycloconverter has no input rectifier or DC link and instead connects each output terminal to the appropriate input phase.

The most common type of packaged VF drive is the constant-voltage type, using pulse width modulation to control both the frequency and effective voltage applied to the motor load.

VFD system description

VFD system

A variable frequency drive system generally consists of an AC motor, a controller and an operator interface.[4][5]

VFD motor

The motor used in a VFD system is usually a three-phase induction motor. Some types of single-phase motors can be used, but three-phase motors are usually preferred. Various types of synchronous motors offer advantages in some situations, but induction motors are suitable for most purposes and are generally the most economical choice. Motors that are designed for fixed-speed operation are often used. Certain enhancements to the standard motor designs offer higher reliability and better VFD performance, such as MG-31 rated motors.[6]

VFD controller

Variable frequency drive controllers are solid state electronic power conversion devices. The usual design first converts AC input power to DC intermediate power using a rectifier or converter bridge. The rectifier is usually a three-phase, full-wave-diode bridge. The DC intermediate power is then converted to quasi-sinusoidal AC power using an inverter switching circuit. The inverter circuit is probably the most important section of the VFD, changing DC energy into three channels of AC energy that can be used by an AC motor. These units provide improved power factor, less harmonic distortion, and low sensitivity to the incoming phase sequencing than older phase controlled converter VFD’s. Since incoming power is converted to DC, many units will accept single-phase as well as three-phase input power (acting as a phase converter as well as a speed controller); however the unit must be derated when using single phase input as only part of the rectifier bridge is carrying the connected load.[7]

As new types of semiconductor switches have been introduced, these have promptly been applied to inverter circuits at all voltage and current ratings for which suitable devices are available. Introduced in the 1980s, the insulated-gate bipolar transistor (IGBT) became the device used in most VFD inverter circuits in the first decade of the 21st century.[8][9][10]

AC motor characteristics require the applied voltage to be proportionally adjusted whenever the frequency is changed in order to deliver the rated torque. For example, if a motor is designed to operate at 460 volts at 60 Hz, the applied voltage must be reduced to 230 volts when the frequency is reduced to 30 Hz. Thus the ratio of volts per hertz must be regulated to a constant value (460/60 = 7.67 V/Hz in this case). For optimum performance, some further voltage adjustment may be necessary especially at low speeds, but constant volts per hertz is the general rule. This ratio can be changed in order to change the torque delivered by the motor.[11]

In addition to this simple volts per hertz control more advanced control methods such as vector control and direct torque control (DTC) exist. These methods adjust the motor voltage in such a way that the magnetic flux and mechanical torque of the motor can be precisely controlled.

The usual method used to achieve variable motor voltage is pulse-width modulation (PWM). With PWM voltage control, the inverter switches are used to construct a quasi-sinusoidal output waveform by a series of narrow voltage pulses with pseudosinusoidal varying pulse durations.[8][12]

Operation of the motors above rated name plate speed (base speed) is possible, but is limited to conditions that do not require more power than nameplate rating of the motor. This is sometimes called “field weakening” and, for AC motors, means operating at less than rated volts/hertz and above rated name plate speed. Permanent magnet synchronous motors have quite limited field weakening speed range due to the constant magnet flux linkage. Wound rotor synchronous motors and induction motors have much wider speed range. For example, a 100 hp, 460 V, 60 Hz, 1775 RPM (4 pole) induction motor supplied with 460 V, 75 Hz (6.134 V/Hz), would be limited to 60/75 = 80% torque at 125% speed (2218.75 RPM) = 100% power.[13] At higher speeds the induction motor torque has to be limited further due to the lowering of the breakaway torque of the motor. Thus rated power can be typically produced only up to 130…150 % of the rated name plate speed. Wound rotor synchronous motors can be run even higher speeds. In rolling mill drives often 200…300 % of the base speed is used. Naturally the mechanical strength of the rotor and lifetime of the bearings is also limiting the maximum speed of the motor. It is recommended to consult the motor manufacturer if more than 150 % speed is required by the application.

PWM VFD Output Voltage Waveform

An embedded microprocessor governs the overall operation of the VFD controller. The main microprocessor programming is in firmware that is inaccessible to the VFD user. However, some degree of configuration programming and parameter adjustment is usually provided so that the user can customize the VFD controller to suit specific motor and driven equipment requirements.[8]

VFD operator interface

The operator interface provides a means for an operator to start and stop the motor and adjust the operating speed. Additional operator control functions might include reversing and switching between manual speed adjustment and automatic control from an external process control signal. The operator interface often includes an alphanumeric display and/or indication lights and meters to provide information about the operation of the drive. An operator interface keypad and display unit is often provided on the front of the VFD controller as shown in the photograph above. The keypad display can often be cable-connected and mounted a short distance from the VFD controller. Most are also provided with input and output (I/O) terminals for connecting pushbuttons, switches and other operator interface devices or control signals. A serial communications port is also often available to allow the VFD to be configured, adjusted, monitored and controlled using a computer.[8][14][15]

VFD operation

When an induction motor is connected to a full voltage supply, it draws several times (up to about 6 times) its rated current. As the load accelerates, the available torque usually drops a little and then rises to a peak while the current remains very high until the motor approaches full speed.

By contrast, when a VFD starts a motor, it initially applies a low frequency and voltage to the motor. The starting frequency is typically 2 Hz or less. Thus starting at such a low frequency avoids the high inrush current that occurs when a motor is started by simply applying the utility (mains) voltage by turning on a switch. After the start of the VFD, the applied frequency and voltage are increased at a controlled rate or ramped up to accelerate the load without drawing excessive current. This starting method typically allows a motor to develop 150% of its rated torque while the VFD is drawing less than 50% of its rated current from the mains in the low speed range. A VFD can be adjusted to produce a steady 150% starting torque from standstill right up to full speed.[16] Note, however, that cooling of the motor is usually not good in the low speed range. Thus running at low speeds even with rated torque for long periods is not possible due to overheating of the motor. If continuous operation with high torque is required in low speeds an external fan is usually needed. The manufacturer of the motor and/or the VFD should specify the cooling requirements for this mode of operation.

In principle, the current on the motor side is in direct proportion of the torque that is generated and the voltage on the motor is in direct proportion of the actual speed, while on the network side, the voltage is constant, thus the current on line side is in direct proportion of the power drawn by the motor, that is U.I or C.N where C is torque and N the speed of the motor (we shall consider losses as well, neglected in this explanation).

(1) n stands for network (grid) and m for motor

(2) C stands for torque [Nm], U for voltage [V], I for current [A], and N for speed [rad/s]

We neglect losses for the moment :

Un.In = Um.Im (same power drawn from network and from motor)

Um.Im = Cm.Nm (motor mechanical power = motor electrical power)

Given Un is a constant (network voltage) we conclude : In = Cm.Nm/Un That is “line current (network) is in direct proportion of motor power”.

With a VFD, the stopping sequence is just the opposite as the starting sequence. The frequency and voltage applied to the motor are ramped down at a controlled rate. When the frequency approaches zero, the motor is shut off. A small amount of braking torque is available to help decelerate the load a little faster than it would stop if the motor were simply switched off and allowed to coast. Additional braking torque can be obtained by adding a braking circuit (resistor controlled by a transistor) to dissipate the braking energy. With 4-quadrants rectifiers (active-front-end), the VFD is able to brake the load by applying a reverse torque and reverting the energy back to the network.

Power line harmonics

While PWM allows for nearly sinusoidal currents to be applied to a motor load, the diode rectifier of the VFD takes roughly square-wave current pulses out of the AC grid, creating harmonic distortion in the power line voltage. When the VFD load size is small and the available utility power is large, the effects of VFD systems slicing small chunks out of AC grid generally go unnoticed. Further, in low voltage networks the harmonics caused by single phase equipment such as computers and TVs are such that they are partially cancelled by three-phase diode bridge harmonics.

However, when either a large number of low-current VFDs, or just a few very large-load VFDs are used, they can have a cumulative negative impact on the AC voltages available to other utility customers in the same grid.

When the utility voltage becomes misshapen and distorted the losses in other loads such as normal AC motors are increased. This may in the worst case lead to overheating and shorter operation life. Also substation transformers and compensation capacitors are affected, the latter especially if resonances are aroused by the harmonics.

In order to limit the voltage distortion the owner of the VFDs may be required to install filtering equipment to smooth out the irregular waveform. Alternately, the utility may choose to install filtering equipment of its own at substations affected by the large amount of VFD equipment being used. In high power installations decrease of the harmonics can be obtained by supplying the VSDs from transformers that have different phase shift.[17]

Further, it is possible to use instead of the diode rectifier a similar transistor circuit that is used to control the motor. This kind of rectifier is called active infeed converter in IEC standards. However, manufacturers call it by several names such as active rectifier, ISU (IGBT Supply Unit), AFE (Active Front End) or four quadrant rectifier. With PWM control of the transistors and filter inductors in the supply lines the AC current can be made nearly sinusoidal. Even better attenuation of the harmonics can be obtained by using an LCL (inductor-capacitor-inductor) filter instead of single three-phase filter inductor.

Additional advantage of the active infeed converter over the diode bridge is its ability to feed back the energy from the DC side to the AC grid. Thus no braking resistor is needed and the efficiency of the drive is improved if the drive is frequently required to brake the motor.

Application considerations

The output voltage of a PWM VFD consists of a train of pulses switched at the carrier frequency. Because of the rapid rise time of these pulses, transmission line effects of the cable between the drive and motor must be considered. Since the transmission-line impedance of the cable and motor are different, pulses tend to reflect back from the motor terminals into the cable. The resulting voltages can produce up to twice the rated line voltage for long cable runs, putting high stress on the cable and motor winding and eventual insulation failure. Increasing the cable or motor size/type for long runs and 480v or 600v motors will help offset the stresses imposed upon the equipment due to the VFD (modern 230v single phase motors not effected). At 460 V, the maximum recommended cable distances between VFDs and motors can vary by a factor of 2.5:1. The longer cables distances are allowed at the lower Carrier Switching Frequencies (CSF) of 2.5 kHz. The lower CSF can produce audible noise at the motors. For applications requiring long motor cables VSD manufacturers usually offer du/dt filters that decrease the steepness of the pulses. For very long cables or old motors with insufficient winding insulation more efficient sinus filter is recommended. Expect the older motor’s life to shorten. Purchase VFD rated motors for the application.

Further, the rapid rise time of the pulses may cause trouble with the motor bearings. The stray capacitance of the windings provide paths for high frequency currents that close through the bearings. If the voltage between the shaft and the shield of the motor exceeds few volts the stored charge is discharged as a small spark. Repeated sparking causes erosion in the bearing surface that can be seen as fluting pattern. In order to prevent sparking the motor cable should provide a low impedance return path from the motor frame back to the inverter. Thus it is essential to use a cable designed to be used with VSDs.[18]

In big motors a slip ring with brush can be used to provide a bypass path for the bearing currents. Alternatively isolated bearings can be used.

The 2.5 kHz and 5 kHz CSFs cause fewer motor bearing problems than the 20 kHz CSFs.[19] Shorter cables are recommended at the higher CSF of 20 kHz. The minimum CSF for synchronize tracking of multiple conveyors is 8 kHz.

The high frequency current ripple in the motor cables may also cause interference with other cabling in the building. This is another reason to use a motor cable designed for VSDs that has a symmetrical three-phase structure and good shielding. Further, it is highly recommended to route the motor cables as far away from signal cables as possible.[20]

Available VFD power ratings

Variable frequency drives are available with voltage and current ratings to match the majority of 3-phase motors that are manufactured for operation from utility (mains) power. VFD controllers designed to operate at 111 V to 690 V are often classified as low voltage units. Low voltage units are typically designed for use with motors rated to deliver 0.2 kW or 1/4 horsepower (hp) up to several megawatts. For example, the largest ABB ACS800 single drives are rated for 5.6 MW[21] . Medium voltage VFD controllers are designed to operate at 2,400/4,162 V (60 Hz), 3,000 V (50 Hz) or up to 10 kV. In some applications a step up transformer is placed between a low voltage drive and a medium voltage load. Medium voltage units are typically designed for use with motors rated to deliver 375 kW or 500 hp and above. Medium voltage drives rated above 7 kV and 5,000 or 10,000 hp should probably be considered to be one-of-a-kind (one-off) designs.[22]

Medium voltage drives are generally rated amongst the following voltages : 2,3 KV – 3,3 Kv – 4 Kv – 6 Kv – 11 Kv

The in-between voltages are generally possible as well. The power of MV drives is generally in the range of 0,3 to 100 MW however involving a range a several different type of drives with different technologies.

Dynamic braking

Using the motor as a generator to absorb energy from the system is called dynamic braking. Dynamic braking stops the system more quickly than coasting. Since dynamic braking requires relative motion of the motor’s parts, it becomes less effective at low speed and cannot be used to hold a load at a stopped position. During normal braking of an electric motor the electrical energy produced by the motor is dissipated as heat inside of the rotor, which increases the likelihood of damage and eventual failure. Therefore, some systems transfer this energy to an outside bank of resistors. Cooling fans may be used to protect the resistors from damage. Modern systems have thermal monitoring, so if the temperature of the bank becomes excessive, it will be switched off.[23]

Regenerative variable-frequency drives

Regenerative AC drives have the capacity to recover the braking energy of an overhauling load and return it to the power system.[24]

Line regenerative variable frequency drives, showing capacitors(top cylinders)and inductors attached which filter the regenerated power.

[2][3][24][25][26][27]

Cycloconverters and current-source inverters inherently allow return of energy from the load to the line; voltage-source inverters require an additional converter to return energy to the supply.[28]

Regeneration is only useful in variable-frequency drives where the value of the recovered energy is large compared to the extra cost of a regenerative system,[28] and if the system requires frequent braking and starting. An example would be use in conveyor belt during manufacturing where it should stop for every few minutes, so that the parts can be assembled correctly and moves on. Another example is a crane, where the hoist motor stops and reverses frequently, and braking is required to slow the load during lowering. Regenerative variable-frequency drives are widely used where speed control of overhauling loads is required.

Brushless DC motor drives

Much of the same logic contained in large, powerful VFDs is also embedded in small brushless DC motors such as those commonly used in computer fans. In this case, the chopper usually converts a low DC voltage (such as 12 volts) to the three-phase current used to drive the electromagnets that turn the permanent magnet rotor.

See also

  • Regenerative variable-Frequency drives
  • Direct torque control
  • Frequency changer
  • Space Vector Modulation
  • Variable speed air compressor
  • Vector control (motor)
Category : AC Drive Repair | AC, DC, VFD, Servo Drives | DC Drive Repair | Dexter VFD Repair | Electronic Repair Services | Servo Drive Repair | Spindle Drive Repair | VFD Drive Repair | VFD Drives | Blog
25
Mar

At Industrial Repair Group, our goal is to offer the best repair in the industry and the most competitive quotes. Our wide selection of services and industry leading 18 month repair guarantee are sure to provide you with the perfect repair solution for all of your industrial needs. We specialize in industrial electronics, electric motor rebuilds, and complete customer satisfaction.

We support the following manufacturers and Industrial Repair Group is always seeking to serve special requests not listed below, please let us know if you have any questions!

AC TECHNOLOGY INDRAMAT
ACCO BABCOCK INC INDRAMAT & STEGMANN
ACCO BRISTOL INELCO & HS ELECTRONIC
ACCU SORT INEX INC
ACME ELECTRIC & STANDARD POWER INC INLAND MOTOR
ACOPIAN ACRISONS INFRANOR
ACROMAG & MOORE PRODUCTS INGERSOLL RAND
ADEPT TECH INIVEN
ADTECH POWER INC INNOVATIVE TECHNOLOGY INC
ADVANCE BALLAST INTEL
ADVANCED MICRO CONTROLS INTERMEC
ADVANCED MOTION INTERNATIONAL POWER
AEROTECH & MOTOROLA INTROL DESIGN
AGASTAT IRCON
AGILENT ISHIDA
AGR ISI ROBOTICS
AIRCO ISSC
ALLEN BRADLEY ISSC & SCI
AMBITECH IND JOHNSON CONTROLS & YOKOGAWA
AMETEK KTRON
AMGRAPH KTRON & KB ELECTRONICS
AMICON KB ELECTRONICS
AMPROBE KB ELECTRONICS & RIMA
ANAHEIM AUTOMATION KEARNEY & TRECKER
ANALOGIC KEB COMBIVERT
ANDOVER CONTROLSANILAM & SEQUENTIAL INFO SYS KEB COMBIVERT & TOSHIBA
ANORAD KEITHLEY & HOLADAY
ANRITSU KEPCO
AO SMITH & MAGNETEK KEYENCE CORP
APC KIKUSUI
APPLIED AUTOMATION KME INSTACOLOR
APPLIED MATERIAL KNIEL
APPLIED MICORSYSTEMS KOEHLER COMPANY
APV AUTOMATION KONE
APW MCLEAN KONSBERG
ARBURG KRAUSS MAFFEI
ARCAIR KRISTEL CORPORATION
ARCOM LABOD ELECTRONICS
ARGUS LAMBDA
AROS ELECTRONICS LAMBDA & QUALIDYNE CORP
ARPECO LANTECH
ARTESYN TECHNOLOGIES LEESON ELECTRIC CO
ASCO & ITT LEESONA & ELECTRIC REGULATOR
ASEA BROWN BOVERI & STROMBERG LEINE & LINDE
ASHE CONTROLS LENORD & BAUER
ASI CONTROLS LENZE
ASI KEYSTONE & ANALOGIC LEROY SOMER
ASR SERVOTRON LESTER ELECTRIC
ASSOCIATED RESEARCH LEUZE
ASTROSYSTEMS LH RESEARCH
ATC LINCOLN ELECTRIC
ATHENA LITTON
ATLAS LOVE CONTROLS
ATLA COPCO LOVEHOY & BOSTON
AUTOCON TECHNOLGIES INC LOYOLA
AUTOMATED PACKAGING LUST ELECTRONICS
AUTOMATION DIRECT MAGNETEK
AUTOMATION INTELLIGENCE MAGNETEK & GEMCO ELECTRIC
AUTOMATIX MAN ROLAND
AVERY MAPLE SYSTEMS
AVG AUTOMATION MARKEM
AYDON CONTROLS MARQUIP
B & K MARSCH
B & R MAHTSUSHITA ELECTRIC & FANUC
BABCOCK & ASEA BROWN BOVERI MAZAK
BAKER PERKINS MCC ELECTRONICS
BALANCE ENGINEERING MEMOTEC
BALDOR & ASR SERVOTRON MERRICK SCALE
BALWIN & BEI INDUSTRIAL ENCODER METRA INSTRUMENTS
BALL ELECTRONIC METTLER TOLEDO
BALUFF MHI CORRUGATING MACHINERY
BALOGH MIBUDENKI
BANNER ENGINEERING MICRO MEMORY
BARBER COLMAN MICRO MOTION
BARBER COLMAN MICROSWITCH
BARDAC MICROSWITCH & HONEYWELL
BARKSDALE MIKI PULLEY & BOSTON
BARR MULLIN MILLER ELECTRIC
BASLER ELECTRIC & WESTINGHOUSE MILLER ELECTRIC & LINCOLN ELECTRIC
BAUMULLER MINARIK ELECTRIC CO
BEI INDUSTRIAL ENCODER MINARIK ELECTRIC CO & LEESON ELECTRIC CO
BENDIX DYNAPATH MITUSUBISHI
DENDIX SHEFFIELD MOELLER ELECTRIC
BENSHAW MOOG
BENTLEY NEVADA MONTWILL& SCHAFER
BERGER LAHR MOTOROLA
BEST POWER MOTORLA SEMICONDUCTOR
BIKOR CORP MOTORTRONICS
BK PRECISION MSA
BOBST MTS SYSTEMS CO
BOGEN COMMUNICATION MULLER MARTINI & GRAPHA ELECTRONIC
BOMAC MURR ELEKTRONIK
BORG WARNER & DANFOSS NACHI
BOSCH NATIONAL CONTROLS
BOSCHERT & ARTESYN TECHNOLOGIES NEMATRON CORP
BOSTON NEWPORT
BRANSON NEXT
BRIDGEPORT NIKKI DENSO
BURTON & EMERSON NIOBRARA R&D CORP
BUTLER AUTOMATIC NJE CORPORATION
CAROTRON NORDSON
CE INVALCO NORDSON & DANAHER CONTROLS
CHROMALOX NORTH AMERICAN MFG
CINCINNATI MILACRON & ADVANTAGE ELECTRONICS NORTHERN TELECOM
CLEAVELAND MOTION CONTROL NOVA
CONDOR NSD
CONRAC NUM
CONTRAVES NUMERIK
CONTREX OLEC
CONTROL CONCEPTS OKUMA
CONTROL TECHNOLGY INC OMEGA ENGINEERING
COSEL OMRON
COUTANT & LAMBDA OPTO 22
CROMPTON ORIENTAL MOTOR
CROWN ORMEC
CUSTOM SERVO OSG TAP & DIEP&H HARNISCHFEGER
CYBEREX PACKAGE CONTROLS
DANAHER CONTROLS PANALARM
DANAHER MOTION PARKER
DANFOSS & DART CONTROLS PAYNE ENGINEERING & BURTON
DART CONTROLS PEPPERL & FUCHS
DATA ACQUISITION SYS PJILLIPS & PHILLIPS PMA
DAYKIN PHOENIX CONTACT
DAYTRONIC PILZ
DEC PINNACLE SYSTEMS
DELTA PIONEER MAGNETICS
DELTA ELECTRONICS PLANAR SYSTEMS
DELTRON & POWER MATE POLYCOM
DEUTRONIC POLYSPEDE
DIGITEC POWER CONTROL SYSTEM
DISC INSTURMENTS & DANAHER CONTROLS POWER CONVERSION
DISPLAY TECH POWER ELECTRONICS
DOERR POWER GENERAL & WESTINGHOUSE
DOMINO PRINTING POWER MATE
DREXELBROOK POWER ONE
DRIVE CONTROL SYSTEMS POWER PROP
DUNKERMOTOREN POWER SOURCE
DYNAGE & BROWN & SHARPE POWER SWITCH CORP
DYNAMICS RESEARCH POWER SYSTEMS INC
DYNAPOWER & DANAHER CONTROLS POWER VOLT
DYNAPRO & FLUKE POWERTEC INDUSTIRAL MOTORS INC
DYNISCO PULS
EATON CORPORATION PYRAMID
EATON CORPORATION & DANAHER CONTROLS QEST
ECCI QUINDAR ELECTRONICS
EG&G RADIO ENERGIE
ELCIS RAMSEY TECHNOLOGY
ELCO RED LION CONTROLS & SABINA ELECTRIC
ELECTRIC REGULATOR RELIANCE ELECTRIC
ELECTRO CAM RENCO CORP
ELECTRO CRAFT & RELIANCE ELECTRIC ROBICON
ELECTROHOME ROSEMOUNT & WESTINGHOUSE
ELECTROL RTA PAVIA
ELECTROMOTIVE SABINA ELECTRIC
ELECTROSTATICS INC SAFTRONICS
ELGE SANYO
ELO TOUCH SYSTEMS SCHROFF & STYRKONSULT AB
ELPAC & CINCINNATI MILACRON SCI & ISSC
ELSTON ELECTRONICS SELTI
ELWOOD CORPORATION SEMCO
EMS INC SEQUENTIAL INFO SYS
ENCODER PRODUCTS SEW EURODRIVE & TOSHIBA
ETA SHINDENGEN
EUROTHERM CONTROLS SICK OPTIC ELECTRONIC
EXOR SIEMENS
FANUC SIEMENS MOORE
FANUC & GENERAL ELECTRIC SIERRACIN POWER SYSTEMS
FENWAL SIGMA INSTRUMENTS INC
FIFE CORP SMC & CONAIRSOCAPEL
FIREYE & ITT SOLA ELECTRIC
FIRING CIRCUITS SOLITECH
FISCHER & PORTER SONY
FISHER CONTROLS SORENSEN
FLUKE STANDARD POWER INC
FORNEY STATIC CONTROL SYSTEMS
FOXBORO STEGMANN & INDRAMAT
FOXBORO & BALSBAUGH SUMITOMO MACHINERY INC & TOSHIBA
FUJI ELECTRIC SUMTAK CORP
FUTEC SUNX LTD
GAI & ASEA BROWN BOVERI SUPERIOR ELECTRIC
GALIL MOTION CONTROLS SWEO ENGINEERING & ROCHESTER INSTRUMENT SYSTEMS
GD CALIFORNIA INC T&R ELECTRIC & SYRON ENGINEERING
GEM80 TAMAGAWA & RELIANCE ELECTRIC
GENERAL ELECTRIC TAPESWITCH
GENERAL ELECTRIC & FANUC TB WOODS & FUJI ELECTRIC
GIDDINGS & LEWIS TDK
GLENTEK TECNO ELETTRONICA
GOLDSTAR TECTROL
GORING KERR TEIJIN SEIKI
GOSSEN TEKEL
GRAHAM TODD PRODUCTS CORP
GRAINGER TOEI ELECTRIC
GRAPHA ELECTRONIC TOSHIBA
GREAT LAKES INSTRUMENTS TOTKU ELECTRIC & GENERAL ELECTRIC
GROUPE SCHNEIDER TRACO ENGINEERING
HAAS UNICO
HAMMOND UNIPOWER
HATHAWAY VAREC
HAYSEEN VECTOR VID
HEIDELBERG VERO ELECTRONICS & TELEMOTIVE
HEIDENHAIN CORP VIDEO JET
HIRATA VIEW TRONIX
HITACHI & FANUC VIVID
HITRON ELECTRONICS VOLGEN & POWER SOURCE
HOBART BROTHERS CO WARNER ELECTRIC & EMERSON
HOHER AUTOMATION WESTAMP INC & WESTINGHOUSE
HONEYWELL WESTINGHOUSE
HONEYWELL & NEMATRON CORP WHEDCO
HORNER ELECTRIC WIRE ELECTRIC
HUBBELL & FEMCO XENTEK INC
HUBNER & AMICON XYCOM & WARNER ELECTRIC
HURCO MFG CO YASKAWA ELECTRIC
IEE ZENITH
IMMERSION CORPORATION ZYCRON

INDUSTRIAL REPAIR GROUP FAST QUOTE

Category : AC Drive Repair | AC, DC, VFD, Servo Drives | Amateur Radio Amplifier Repair Service | Analog Circuit Board Repair | CNC Circuit Board Repair | DC Drive Repair | Dexter VFD Repair | Electronic Repair Services | Encoder Repair | HAM Radio Amplifier Repair | Industrial Controls Repair | Industrial Monitor Repair | Industrial Repair Group | Industrial Repair Service | Industrial Scale Repair | LCD Display Repair | Light Curtain Repair | Linear Amplifier Repair | Motor Soft Starter Repair | Optical Sensor Repair | Programmable Logic Controller - PLC Repair | Resource Lab | Rotary Encoder Repair | Rugged Display Repair | Servo Drive Repair | Spindle Drive Repair | Touchscreen Repair | VFD Drive Repair | VFD Drives | Blog
2
Mar

At Industrial Repair Group, our goal is to offer the best repair in the industry and the most competitive quotes. Our wide selection of services and industry leading 18 month repair guarantee are sure to provide you with the perfect repair solution for all of your industrial needs. We specialize in industrial electronics, electric motor rebuilds, and complete customer satisfaction.

We support the following manufacturers and Industrial Repair Group is always seeking to serve special requests not listed below, please let us know if you have any questions!

AC TECHNOLOGY INDRAMAT
ACCO BABCOCK INC INDRAMAT & STEGMANN
ACCO BRISTOL INELCO & HS ELECTRONIC
ACCU SORT INEX INC
ACME ELECTRIC & STANDARD POWER INC INLAND MOTOR
ACOPIAN ACRISONS INFRANOR
ACROMAG & MOORE PRODUCTS INGERSOLL RAND
ADEPT TECH INIVEN
ADTECH POWER INC INNOVATIVE TECHNOLOGY INC
ADVANCE BALLAST INTEL
ADVANCED MICRO CONTROLS INTERMEC
ADVANCED MOTION INTERNATIONAL POWER
AEROTECH & MOTOROLA INTROL DESIGN
AGASTAT IRCON
AGILENT ISHIDA
AGR ISI ROBOTICS
AIRCO ISSC
ALLEN BRADLEY ISSC & SCI
AMBITECH IND JOHNSON CONTROLS & YOKOGAWA
AMETEK KTRON
AMGRAPH KTRON & KB ELECTRONICS
AMICON KB ELECTRONICS
AMPROBE KB ELECTRONICS & RIMA
ANAHEIM AUTOMATION KEARNEY & TRECKER
ANALOGIC KEB COMBIVERT
ANDOVER CONTROLSANILAM & SEQUENTIAL INFO SYS KEB COMBIVERT & TOSHIBA
ANORAD KEITHLEY & HOLADAY
ANRITSU KEPCO
AO SMITH & MAGNETEK KEYENCE CORP
APC KIKUSUI
APPLIED AUTOMATION KME INSTACOLOR
APPLIED MATERIAL KNIEL
APPLIED MICORSYSTEMS KOEHLER COMPANY
APV AUTOMATION KONE
APW MCLEAN KONSBERG
ARBURG KRAUSS MAFFEI
ARCAIR KRISTEL CORPORATION
ARCOM LABOD ELECTRONICS
ARGUS LAMBDA
AROS ELECTRONICS LAMBDA & QUALIDYNE CORP
ARPECO LANTECH
ARTESYN TECHNOLOGIES LEESON ELECTRIC CO
ASCO & ITT LEESONA & ELECTRIC REGULATOR
ASEA BROWN BOVERI & STROMBERG LEINE & LINDE
ASHE CONTROLS LENORD & BAUER
ASI CONTROLS LENZE
ASI KEYSTONE & ANALOGIC LEROY SOMER
ASR SERVOTRON LESTER ELECTRIC
ASSOCIATED RESEARCH LEUZE
ASTROSYSTEMS LH RESEARCH
ATC LINCOLN ELECTRIC
ATHENA LITTON
ATLAS LOVE CONTROLS
ATLA COPCO LOVEHOY & BOSTON
AUTOCON TECHNOLGIES INC LOYOLA
AUTOMATED PACKAGING LUST ELECTRONICS
AUTOMATION DIRECT MAGNETEK
AUTOMATION INTELLIGENCE MAGNETEK & GEMCO ELECTRIC
AUTOMATIX MAN ROLAND
AVERY MAPLE SYSTEMS
AVG AUTOMATION MARKEM
AYDON CONTROLS MARQUIP
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How Variable-Frequency Drives Operate

A variable-frequency drive (VFD) is a system for controlling the rotational speed of an alternating current (AC) electric motor by controlling the frequency of the electrical power supplied to the motor.[1][2][3] A variable frequency drive is a specific type of adjustable-speed drive. Variable-frequency drives are also known as adjustable-frequency drives (AFD), variable-speed drives (VSD), AC drives, microdrives or inverter drives. Since the voltage is varied along with frequency, these are sometimes also called VVVF (variable voltage variable frequency) drives.

Variable-frequency drives are widely used. In ventilation systems for large buildings, variable-frequency motors on fans save energy by allowing the volume of air moved to match the system demand. They are also used on pumps, elevator, conveyor and machine tool drives.

VFD types

All VFDs use their output devices (IGBTs, transistors, thyristors) only as switches, turning them only on or off. Using a linear device such as a transistor in its linear mode is impractical for a VFD drive, since the power dissipated in the drive devices would be about as much as the power delivered to the load.

Drives can be classified as:

  • Constant voltage
  • Constant current
  • Cycloconverter

In a constant voltage converter, the intermediate DC link voltage remains approximately constant during each output cycle. In constant current drives, a large inductor is placed between the input rectifier and the output bridge, so the current delivered is nearly constant. A cycloconverter has no input rectifier or DC link and instead connects each output terminal to the appropriate input phase.

The most common type of packaged VF drive is the constant-voltage type, using pulse width modulation to control both the frequency and effective voltage applied to the motor load.

VFD system description

VFD system

A variable frequency drive system generally consists of an AC motor, a controller and an operator interface.[4][5]

VFD motor

The motor used in a VFD system is usually a three-phase induction motor. Some types of single-phase motors can be used, but three-phase motors are usually preferred. Various types of synchronous motors offer advantages in some situations, but induction motors are suitable for most purposes and are generally the most economical choice. Motors that are designed for fixed-speed operation are often used. Certain enhancements to the standard motor designs offer higher reliability and better VFD performance, such as MG-31 rated motors.[6]

VFD controller

Variable frequency drive controllers are solid state electronic power conversion devices. The usual design first converts AC input power to DC intermediate power using a rectifier or converter bridge. The rectifier is usually a three-phase, full-wave-diode bridge. The DC intermediate power is then converted to quasi-sinusoidal AC power using an inverter switching circuit. The inverter circuit is probably the most important section of the VFD, changing DC energy into three channels of AC energy that can be used by an AC motor. These units provide improved power factor, less harmonic distortion, and low sensitivity to the incoming phase sequencing than older phase controlled converter VFD’s. Since incoming power is converted to DC, many units will accept single-phase as well as three-phase input power (acting as a phase converter as well as a speed controller); however the unit must be derated when using single phase input as only part of the rectifier bridge is carrying the connected load.[7]

As new types of semiconductor switches have been introduced, these have promptly been applied to inverter circuits at all voltage and current ratings for which suitable devices are available. Introduced in the 1980s, the insulated-gate bipolar transistor (IGBT) became the device used in most VFD inverter circuits in the first decade of the 21st century.[8][9][10]

AC motor characteristics require the applied voltage to be proportionally adjusted whenever the frequency is changed in order to deliver the rated torque. For example, if a motor is designed to operate at 460 volts at 60 Hz, the applied voltage must be reduced to 230 volts when the frequency is reduced to 30 Hz. Thus the ratio of volts per hertz must be regulated to a constant value (460/60 = 7.67 V/Hz in this case). For optimum performance, some further voltage adjustment may be necessary especially at low speeds, but constant volts per hertz is the general rule. This ratio can be changed in order to change the torque delivered by the motor.[11]

In addition to this simple volts per hertz control more advanced control methods such as vector control and direct torque control (DTC) exist. These methods adjust the motor voltage in such a way that the magnetic flux and mechanical torque of the motor can be precisely controlled.

The usual method used to achieve variable motor voltage is pulse-width modulation (PWM). With PWM voltage control, the inverter switches are used to construct a quasi-sinusoidal output waveform by a series of narrow voltage pulses with pseudosinusoidal varying pulse durations.[8][12]

Operation of the motors above rated name plate speed (base speed) is possible, but is limited to conditions that do not require more power than nameplate rating of the motor. This is sometimes called “field weakening” and, for AC motors, means operating at less than rated volts/hertz and above rated name plate speed. Permanent magnet synchronous motors have quite limited field weakening speed range due to the constant magnet flux linkage. Wound rotor synchronous motors and induction motors have much wider speed range. For example, a 100 hp, 460 V, 60 Hz, 1775 RPM (4 pole) induction motor supplied with 460 V, 75 Hz (6.134 V/Hz), would be limited to 60/75 = 80% torque at 125% speed (2218.75 RPM) = 100% power.[13] At higher speeds the induction motor torque has to be limited further due to the lowering of the breakaway torque of the motor. Thus rated power can be typically produced only up to 130…150 % of the rated name plate speed. Wound rotor synchronous motors can be run even higher speeds. In rolling mill drives often 200…300 % of the base speed is used. Naturally the mechanical strength of the rotor and lifetime of the bearings is also limiting the maximum speed of the motor. It is recommended to consult the motor manufacturer if more than 150 % speed is required by the application.

PWM VFD Output Voltage Waveform

An embedded microprocessor governs the overall operation of the VFD controller. The main microprocessor programming is in firmware that is inaccessible to the VFD user. However, some degree of configuration programming and parameter adjustment is usually provided so that the user can customize the VFD controller to suit specific motor and driven equipment requirements.[8]

VFD operator interface

The operator interface provides a means for an operator to start and stop the motor and adjust the operating speed. Additional operator control functions might include reversing and switching between manual speed adjustment and automatic control from an external process control signal. The operator interface often includes an alphanumeric display and/or indication lights and meters to provide information about the operation of the drive. An operator interface keypad and display unit is often provided on the front of the VFD controller as shown in the photograph above. The keypad display can often be cable-connected and mounted a short distance from the VFD controller. Most are also provided with input and output (I/O) terminals for connecting pushbuttons, switches and other operator interface devices or control signals. A serial communications port is also often available to allow the VFD to be configured, adjusted, monitored and controlled using a computer.[8][14][15]

VFD operation

When an induction motor is connected to a full voltage supply, it draws several times (up to about 6 times) its rated current. As the load accelerates, the available torque usually drops a little and then rises to a peak while the current remains very high until the motor approaches full speed.

By contrast, when a VFD starts a motor, it initially applies a low frequency and voltage to the motor. The starting frequency is typically 2 Hz or less. Thus starting at such a low frequency avoids the high inrush current that occurs when a motor is started by simply applying the utility (mains) voltage by turning on a switch. After the start of the VFD, the applied frequency and voltage are increased at a controlled rate or ramped up to accelerate the load without drawing excessive current. This starting method typically allows a motor to develop 150% of its rated torque while the VFD is drawing less than 50% of its rated current from the mains in the low speed range. A VFD can be adjusted to produce a steady 150% starting torque from standstill right up to full speed.[16] Note, however, that cooling of the motor is usually not good in the low speed range. Thus running at low speeds even with rated torque for long periods is not possible due to overheating of the motor. If continuous operation with high torque is required in low speeds an external fan is usually needed. The manufacturer of the motor and/or the VFD should specify the cooling requirements for this mode of operation.

In principle, the current on the motor side is in direct proportion of the torque that is generated and the voltage on the motor is in direct proportion of the actual speed, while on the network side, the voltage is constant, thus the current on line side is in direct proportion of the power drawn by the motor, that is U.I or C.N where C is torque and N the speed of the motor (we shall consider losses as well, neglected in this explanation).

(1) n stands for network (grid) and m for motor

(2) C stands for torque [Nm], U for voltage [V], I for current [A], and N for speed [rad/s]

We neglect losses for the moment :

Un.In = Um.Im (same power drawn from network and from motor)

Um.Im = Cm.Nm (motor mechanical power = motor electrical power)

Given Un is a constant (network voltage) we conclude : In = Cm.Nm/Un That is “line current (network) is in direct proportion of motor power”.

With a VFD, the stopping sequence is just the opposite as the starting sequence. The frequency and voltage applied to the motor are ramped down at a controlled rate. When the frequency approaches zero, the motor is shut off. A small amount of braking torque is available to help decelerate the load a little faster than it would stop if the motor were simply switched off and allowed to coast. Additional braking torque can be obtained by adding a braking circuit (resistor controlled by a transistor) to dissipate the braking energy. With 4-quadrants rectifiers (active-front-end), the VFD is able to brake the load by applying a reverse torque and reverting the energy back to the network.

Power line harmonics

While PWM allows for nearly sinusoidal currents to be applied to a motor load, the diode rectifier of the VFD takes roughly square-wave current pulses out of the AC grid, creating harmonic distortion in the power line voltage. When the VFD load size is small and the available utility power is large, the effects of VFD systems slicing small chunks out of AC grid generally go unnoticed. Further, in low voltage networks the harmonics caused by single phase equipment such as computers and TVs are such that they are partially cancelled by three-phase diode bridge harmonics.

However, when either a large number of low-current VFDs, or just a few very large-load VFDs are used, they can have a cumulative negative impact on the AC voltages available to other utility customers in the same grid.

When the utility voltage becomes misshapen and distorted the losses in other loads such as normal AC motors are increased. This may in the worst case lead to overheating and shorter operation life. Also substation transformers and compensation capacitors are affected, the latter especially if resonances are aroused by the harmonics.

In order to limit the voltage distortion the owner of the VFDs may be required to install filtering equipment to smooth out the irregular waveform. Alternately, the utility may choose to install filtering equipment of its own at substations affected by the large amount of VFD equipment being used. In high power installations decrease of the harmonics can be obtained by supplying the VSDs from transformers that have different phase shift.[17]

Further, it is possible to use instead of the diode rectifier a similar transistor circuit that is used to control the motor. This kind of rectifier is called active infeed converter in IEC standards. However, manufacturers call it by several names such as active rectifier, ISU (IGBT Supply Unit), AFE (Active Front End) or four quadrant rectifier. With PWM control of the transistors and filter inductors in the supply lines the AC current can be made nearly sinusoidal. Even better attenuation of the harmonics can be obtained by using an LCL (inductor-capacitor-inductor) filter instead of single three-phase filter inductor.

Additional advantage of the active infeed converter over the diode bridge is its ability to feed back the energy from the DC side to the AC grid. Thus no braking resistor is needed and the efficiency of the drive is improved if the drive is frequently required to brake the motor.

Application considerations

The output voltage of a PWM VFD consists of a train of pulses switched at the carrier frequency. Because of the rapid rise time of these pulses, transmission line effects of the cable between the drive and motor must be considered. Since the transmission-line impedance of the cable and motor are different, pulses tend to reflect back from the motor terminals into the cable. The resulting voltages can produce up to twice the rated line voltage for long cable runs, putting high stress on the cable and motor winding and eventual insulation failure. Increasing the cable or motor size/type for long runs and 480v or 600v motors will help offset the stresses imposed upon the equipment due to the VFD (modern 230v single phase motors not effected). At 460 V, the maximum recommended cable distances between VFDs and motors can vary by a factor of 2.5:1. The longer cables distances are allowed at the lower Carrier Switching Frequencies (CSF) of 2.5 kHz. The lower CSF can produce audible noise at the motors. For applications requiring long motor cables VSD manufacturers usually offer du/dt filters that decrease the steepness of the pulses. For very long cables or old motors with insufficient winding insulation more efficient sinus filter is recommended. Expect the older motor’s life to shorten. Purchase VFD rated motors for the application.

Further, the rapid rise time of the pulses may cause trouble with the motor bearings. The stray capacitance of the windings provide paths for high frequency currents that close through the bearings. If the voltage between the shaft and the shield of the motor exceeds few volts the stored charge is discharged as a small spark. Repeated sparking causes erosion in the bearing surface that can be seen as fluting pattern. In order to prevent sparking the motor cable should provide a low impedance return path from the motor frame back to the inverter. Thus it is essential to use a cable designed to be used with VSDs.[18]

In big motors a slip ring with brush can be used to provide a bypass path for the bearing currents. Alternatively isolated bearings can be used.

The 2.5 kHz and 5 kHz CSFs cause fewer motor bearing problems than the 20 kHz CSFs.[19] Shorter cables are recommended at the higher CSF of 20 kHz. The minimum CSF for synchronize tracking of multiple conveyors is 8 kHz.

The high frequency current ripple in the motor cables may also cause interference with other cabling in the building. This is another reason to use a motor cable designed for VSDs that has a symmetrical three-phase structure and good shielding. Further, it is highly recommended to route the motor cables as far away from signal cables as possible.[20]

Available VFD power ratings

Variable frequency drives are available with voltage and current ratings to match the majority of 3-phase motors that are manufactured for operation from utility (mains) power. VFD controllers designed to operate at 111 V to 690 V are often classified as low voltage units. Low voltage units are typically designed for use with motors rated to deliver 0.2 kW or 1/4 horsepower (hp) up to several megawatts. For example, the largest ABB ACS800 single drives are rated for 5.6 MW[21] . Medium voltage VFD controllers are designed to operate at 2,400/4,162 V (60 Hz), 3,000 V (50 Hz) or up to 10 kV. In some applications a step up transformer is placed between a low voltage drive and a medium voltage load. Medium voltage units are typically designed for use with motors rated to deliver 375 kW or 500 hp and above. Medium voltage drives rated above 7 kV and 5,000 or 10,000 hp should probably be considered to be one-of-a-kind (one-off) designs.[22]

Medium voltage drives are generally rated amongst the following voltages : 2,3 KV – 3,3 Kv – 4 Kv – 6 Kv – 11 Kv

The in-between voltages are generally possible as well. The power of MV drives is generally in the range of 0,3 to 100 MW however involving a range a several different type of drives with different technologies.

Dynamic braking

Using the motor as a generator to absorb energy from the system is called dynamic braking. Dynamic braking stops the system more quickly than coasting. Since dynamic braking requires relative motion of the motor’s parts, it becomes less effective at low speed and cannot be used to hold a load at a stopped position. During normal braking of an electric motor the electrical energy produced by the motor is dissipated as heat inside of the rotor, which increases the likelihood of damage and eventual failure. Therefore, some systems transfer this energy to an outside bank of resistors. Cooling fans may be used to protect the resistors from damage. Modern systems have thermal monitoring, so if the temperature of the bank becomes excessive, it will be switched off.[23]

Regenerative variable-frequency drives

Regenerative AC drives have the capacity to recover the braking energy of an overhauling load and return it to the power system.[24]

Line regenerative variable frequency drives, showing capacitors(top cylinders)and inductors attached which filter the regenerated power.

[2][3][24][25][26][27]

Cycloconverters and current-source inverters inherently allow return of energy from the load to the line; voltage-source inverters require an additional converter to return energy to the supply.[28]

Regeneration is only useful in variable-frequency drives where the value of the recovered energy is large compared to the extra cost of a regenerative system,[28] and if the system requires frequent braking and starting. An example would be use in conveyor belt during manufacturing where it should stop for every few minutes, so that the parts can be assembled correctly and moves on. Another example is a crane, where the hoist motor stops and reverses frequently, and braking is required to slow the load during lowering. Regenerative variable-frequency drives are widely used where speed control of overhauling loads is required.

Brushless DC motor drives

Much of the same logic contained in large, powerful VFDs is also embedded in small brushless DC motors such as those commonly used in computer fans. In this case, the chopper usually converts a low DC voltage (such as 12 volts) to the three-phase current used to drive the electromagnets that turn the permanent magnet rotor.

See also

  • Regenerative variable-Frequency drives
  • Direct torque control
  • Frequency changer
  • Space Vector Modulation
  • Variable speed air compressor
  • Vector control (motor)
DTR007S11A
DTR007S21U
DTR015S21U
DTR015S21U3
DTR015S21A
DTR022S21U
DTR022S21A
Category : AC Drive Repair | DC Drive Repair | Dexter VFD Repair | Electronic Repair Services | Industrial Controls Repair | VFD Drive Repair | VFD Drives | Blog
18
Aug

INDUSTRIAL REPAIR GROUP FAST QUOTE

Industrial Monitor – Industrial Repair Group (IRG) – Electronic Repair Service

If you need Industrial Monitor & Rugged Display Repair, Industrial Repair Group is your go to partner for dependable service.

Industrial Repair Group performs extensive component level repairs, touching up solder traces, replacing bad components, as well as full testing of ICs, PALs, EPROMs, GALs, surface mounted components and much more. Every Industrial Monitor & Rugged Display Repair is subjected to dynamic function tests to verify successful repair and then backed by our 18 month repair guarantee. Sealers and conformal coatings are re-applied as needed with each repair restoring your equipment back to its original OEM specs.

A monitor or display (sometimes called a visual display unit) is an electronic visual display for computers. The monitor comprises the display device, circuitry, and an enclosure. The display device in modern monitors is typically a thin film transistor liquid crystal display (TFT-LCD) thin panel, while older monitors use a cathode ray tube about as deep as the screen size.

The first computer monitors used Cathode ray tubes (CRTs), which was the dominant technology until they were replaced by LCD monitors in the 21st Century.

Originally, computer monitors were used for data processing while television receivers were used for entertainment. From the 1980s onwards, computers (and their monitors) have been used for both data processing and entertainment, while televisions have implemented some computer functionality. The common aspect ratio of televisions, and then computer monitors, has also changed from 4:3 to 16:9.

Contents

[hide]

  • 1 Technologies
  • 2 Performance measurements
  • 3 Additional features
  • 4 Manufacturers
  • 5 See also
  • 6 References
  • 7 External links

Technologies

Further information: Comparison CRT, LCD, Plasma and History of display technology

Different image techniques have been used for Computer monitors. Until the 21st century most monitors were CRT but they have been phased out for LCD monitors.

Cathode ray tube

Main article: Cathode ray tube

A CRT monitor.

The first computer monitors used cathode ray tubes (CRT). Until the early 1980s, they were known as video display terminals and were physically attached to the computer and keyboard. The monitors were monochrome, flickered and the image quality was poor. In 1981, IBM invented the Color Graphics Adapter, which could display four colors with a resolution of 320 by 200 pixels. They introduced the Enhanced Graphics Adapter in 1984, which was capable of producing 16 colors and had a resolution of 640 by 350.[1]

CRT remained the standard for computer monitors through the 1990s. CRT technology remained dominant in the PC monitor market into the new millennium partly because it was cheaper to produce and offered viewing angles close to 180 degrees.[2]

Liquid Crystal

Main article: Liquid crystal display

There are multiple technologies that have been used to implement Liquid Crystal Displays (LCDs). Throughout the 1990s the primary use of LCD technology as computer monitors was in laptops where the lower power consumption, lighter weight, and smaller physical size of LCDs justified the higher price versus a CRT. Commonly, the same laptop would be offered with an assortment of display options at increasing price points (active or passive monochrome, passive color, active matrix color (TFT). As volume and manufacturing capability have improved the monochrome and passive color technologies were dropped from most product lines.

TFT is a variant of liquid crystal display (LCD) which is now the dominant technology used for computer monitors.[3]

The first standalone LCD displays appeared in the mid 1990s selling for high prices. As prices declined over a period of years they became more popular. During the 2000s TFT LCDs gradually displaced CRTs, eventually becoming the primary technology used for computer monitors.[2] The main advantages of LCDs over CRT displays are that LCDs consume less power, take up much less space, and are considerably lighter. The now common active matrix TFT-LCD technology also has less flickering than CRTs, which reduces eye strain.[4]

Organic light-emitting diode

Organic light-emitting diode (OLED) monitors provide higher contrast and better viewing angles than LCDs, and are predicted to replace them. In 2011 a 25 inch OLED monitor costs $6000, but the prices are expected to drop.[5]

Performance measurements

The performance of a monitor is measured by the following parameters:

  • Luminance is measured in candelas per square meter (cd/m2 also called a Nit).
  • Aspect ratios is the ratio of the horizontal length to the vertical length. Monitors usually have the aspect ratio 4:3, 5:4, 16:10 or 16:9.
  • Viewable image size is usually measured diagonally, but the actual widths and heights are more informative since they are not affected by the aspect ratio in the same way. For CRTs, the viewable size is typically 1 in (25 mm) smaller than the tube itself.
  • Display resolution is the number of distinct pixels in each dimension that can be displayed. Maximum resolution is limited by dot pitch.
  • Dot pitch is the distance between subpixels of the same color in millimeters. In general, the smaller the dot pitch, the sharper the picture will appear.
  • Refresh rate is the number of times in a second that a display is illuminated. Maximum refresh rate is limited by response time.
  • Response time is the time a pixel in a monitor takes to go from active (black) to inactive (white) and back to active (black) again, measured in milliseconds. Lower numbers mean faster transitions and therefore fewer visible image artifacts.
  • Contrast ratio is the ratio of the luminosity of the brightest color (white) to that of the darkest color (black) that the monitor is capable of producing.
  • Power consumption is measured in watts.
  • Viewing angle is the maximum angle at which images on the monitor can be viewed, without excessive degradation to the image. It is measured in degrees horizontally and vertically.

Size

Main article: Display size

For any rectangular section on a round tube, the diagonal measurement is also the diameter of the tube

The area, height and width of displays with identical diagonal measurements vary dependent on aspect ratio

On two-dimensional display devices such as computer monitors the display size or viewable image size is the actual amount of screen space that is available to display a picture, video or working space, without obstruction from the case or other aspects of the unit’s design. The main measurements for display devices are: width, height, total area and the diagonal.

The size of a display is usually by monitor manufacturers given by the diagonal i.e. the distance between two opposite screen corners. This method of measurement is inherited from the method used for the first generation of CRT television, when picture tubes with circular faces were in common use. Being circular, only their diameter was needed to describe their size. Since these circular tubes were used to display rectangular images, the diagonal measurement of the rectangle was equivalent to the diameter of the tube’s face. This method continued even when cathode ray tubes were manufactured as rounded rectangles; it had the advantage of being a single number specifying the size, and was not confusing when the aspect ratio was universally 4:3.

The estimation of the monitor size by the distance between opposite corners does not take into account the display aspect ratio, so that for example a 16:9 21 in (53 cm) widescreen display has less area, than a 21 in (53 cm) 4:3 screen. The 4:3 screen has dimensions of 16.8 × 12.6 in (43 × 32 cm) and area 211 sq in (1,360 cm2), while the widescreen is 18.3 × 10.3 in (46 × 26 cm), 188 sq in (1,210 cm2).

Aspect ratio

Main article: Display aspect ratio

Until about 2003, most computer monitors had a 4:3 aspect ratio and some had 5:4. Between 2003 and 2006, monitors with 16:9 and mostly 16:10 (8:5) aspect ratios became commonly available, first in laptops and later also in standalone monitors. Reasons for this transition was productive uses for such monitors, i.e. besides widescreen computer game play and movie viewing, are the word processor display of two standard letter pages side by side, as well as CAD displays of large-size drawings and CAD application menus at the same time.[6][7] 2008 16:10 became the most common sold aspect ratio for LCD monitors and the same year 16:10 was the mainstream standard for laptops and notebooks.[8]

In 2008 the computer industry started to move over from 16:10 to 16:9. According to a report by displaysearch the reasons for this were/are:[8]

  • Innovative product concepts drives a new product cycle and stimulating the growth of the notebook PC and LCD monitor market.
  • 16:9 provides better economic cut (panelization) in existing TFT LCD fabs.
  • 16:9 products provide higher resolution and wider aspect ratio.
  • The widespread adoption of High Definition in the consumer entertainment sector will help end users readily adopt the new products with the wider aspect ratio.
  • The 16:9 panels provide an opportunity for PC brands to further diversify their products.

In 2011 Bennie Budler, product manager of IT products at Samsung South Africa, confirmed that monitors capable of 1920 × 1200 resolutions are no longer being manufactured. “It is all about reducing manufacturing costs. The new 16:9 aspect ratio panels are more cost effective to manufacture locally than the previous 16:10 panels”[9]

In 2011 non-widescreen displays with 4:3 aspect ratios were only being manufactured in small quantities. According to Samsung this was because the “Demand for the old ‘Square monitors’ has decreased rapidly over the last couple of years,” and “I predict that by the end of 2011, production on all 4:3 or similar panels will be halted due to a lack of demand.”[9]

Resolution

Main article: Display resolution

The resolution for computer monitors have increased over time. From 320×200 during the early 80s, to 800×600 during the late 90s. In March 2011 1920×1080 became the most common used resolution among Steam users. The earlier most common resolution was 1680×1050.[10]

Additional features

Power saving

Most modern monitors will switch to a power-saving mode if no video-input signal is received. This allows modern operating systems to turn off a monitor after a specified period of inactivity. This also extends the monitor’s service life.

Some monitors will also switch themselves off after a time period on standby.

Most modern laptops provide a method of screen dimming after periods of inactivity or when the battery is in use. This extends battery life and reduces wear.

Integrated accessories

Many monitors have other accessories (or connections for them) integrated. This places standard ports within easy reach and eliminates the need for another separate hub, camera, microphone, or set of speakers. These monitors have advanced microprocessors which contain codec information, Windows Interface drivers and other small software which help in proper functioning of these functions.

Glossy screen

Main article: Glossy display

Some displays, especially newer LCD monitors, replace the traditional anti-glare matte finish with a glossy one. This increases color saturation and sharpness but reflections from lights and windows are very visible.

Directional screen

Narrow viewing angle screens are used in some security conscious applications.

Autostereoscopic (3D) screen

Main article: Autostereoscopy

A directional screen which generates 3D images without headgear.

Touch screen

Main article: Touchscreen

These monitors use touching of the screen as an input method. Items can be selected or moved with a finger, and finger gestures may be used to convey commands. The screen will need frequent cleaning due to image degradation from fingerprints.

Tablet screens

Main article: Graphics tablet/screen hybrid

A combination of a monitor with a graphics tablet. Such devices are typically unresponsive to touch without the use of one or more special tools’ pressure. Newer models however are now able to detect touch from any pressure and often have the ability to detect tilt and rotation as well.

Touch and tablet screens are used on LCD displays as a substitute for the light pen, which can only work on CRTs.

Manufacturers

  • Republic of China Acer
  • Republic of China AOC
  • United States Apple Inc.
  • Republic of China Asus
  • Germany Belinea
  • Republic of China BenQ
  • Republic of China Chimei
  • United States Dell
  • Japan Eizo
  • United States Gateway
  • United States Hewlett-Packard
  • Republic of China HannStar Display Corporation
  • United States IBM
  • Japan Iiyama Corporation
  • Australia Kogan Technologies
  • South Korea LG
  • Japan NEC
  • Netherlands Philips
  • United States Planar Systems
  • South Korea Samsung
  • United States Sceptre Incorporated
  • Japan Sony
  • Japan Toshiba
  • United States Tyco Electronics
  • United States ViewSonic
  • Germany Wortmann
  • South Korea Zalman

Liquid Crystal Display (LCD)

A liquid crystal display (LCD) is a flat panel display, electronic visual display, video display that uses the light modulating properties of liquid crystals (LCs). LCs do not emit light directly.

They are used in a wide range of applications, including computer monitors, television, instrument panels, aircraft cockpit displays, signage, etc. They are common in consumer devices such as video players, gaming devices, clocks, watches, calculators, and telephones. LCDs have displaced cathode ray tube (CRT) displays in most applications. They are usually more compact, lightweight, portable, less expensive, more reliable, and easier on the eyes.[citation needed] They are available in a wider range of screen sizes than CRT and plasma displays, and since they do not use phosphors, they cannot suffer image burn-in.

LCDs are more energy efficient and offer safer disposal than CRTs. Its low electrical power consumption enables it to be used in battery-powered electronic equipment. It is an electronically modulated optical device made up of any number of segments filled with liquid crystals and arrayed in front of a light source (backlight) or reflector to produce images in colour or monochrome. The most flexible ones use an array of small pixels. The earliest discovery leading to the development of LCD technology, the discovery of liquid crystals, dates from 1888.[1] By 2008, worldwide sales of televisions with LCD screens had surpassed the sale of CRT units.

Overview

LCD alarm clock

Each pixel of an LCD typically consists of a layer of molecules aligned between two transparent electrodes, and two polarizing filters, the axes of transmission of which are (in most of the cases) perpendicular to each other. With no actual liquid crystal between the polarizing filters, light passing through the first filter would be blocked by the second (crossed) polarizer. In most of the cases the liquid crystal has double refraction.[citation needed]

The surface of the electrodes that are in contact with the liquid crystal material are treated so as to align the liquid crystal molecules in a particular direction. This treatment typically consists of a thin polymer layer that is unidirectionally rubbed using, for example, a cloth. The direction of the liquid crystal alignment is then defined by the direction of rubbing. Electrodes are made of a transparent conductor called Indium Tin Oxide (ITO).

Before applying an electric field, the orientation of the liquid crystal molecules is determined by the alignment at the surfaces of electrodes. In a twisted nematic device (still the most common liquid crystal device), the surface alignment directions at the two electrodes are perpendicular to each other, and so the molecules arrange themselves in a helical structure, or twist. This reduces the rotation of the polarization of the incident light, and the device appears grey. If the applied voltage is large enough, the liquid crystal molecules in the center of the layer are almost completely untwisted and the polarization of the incident light is not rotated as it passes through the liquid crystal layer. This light will then be mainly polarized perpendicular to the second filter, and thus be blocked and the pixel will appear black. By controlling the voltage applied across the liquid crystal layer in each pixel, light can be allowed to pass through in varying amounts thus constituting different levels of gray. This electric field also controls (reduces) the double refraction properties of the liquid crystal.[citation needed]

LCD with top polarizer removed from device and placed on top, such that the top and bottom polarizers are parallel.

The optical effect of a twisted nematic device in the voltage-on state is far less dependent on variations in the device thickness than that in the voltage-off state. Because of this, these devices are usually operated between crossed polarizers such that they appear bright with no voltage (the eye is much more sensitive to variations in the dark state than the bright state). These devices can also be operated between parallel polarizers, in which case the bright and dark states are reversed. The voltage-off dark state in this configuration appears blotchy, however, because of small variations of thickness across the device.

Both the liquid crystal material and the alignment layer material contain ionic compounds. If an electric field of one particular polarity is applied for a long period of time, this ionic material is attracted to the surfaces and degrades the device performance. This is avoided either by applying an alternating current or by reversing the polarity of the electric field as the device is addressed (the response of the liquid crystal layer is identical, regardless of the polarity of the applied field).

Displays for a small number of individual digits and/or fixed symbols (as in digital watches, pocket calculators etc.) can be implemented with independent electrodes for each segment. In contrast full alphanumeric and/or variable graphics displays are usually implemented with pixels arranged as a matrix consisting of electrically connected rows on one side of the LC layer and columns on the other side which makes it possible to address each pixel at the intersections. The general method of matrix addressing consists of sequentially addressing one side of the matrix, for example by selecting the rows one-by-one and applying the picture information on the other side at the columns row-by-row.

For details on the various matrix addressing schemes see Passive-matrix and active-matrix addressed LCDs.

Brief history

  • 1888: Friedrich Reinitzer (1858–1927) discovers the liquid crystalline nature of cholesterol extracted from carrots (that is, two melting points and generation of colours) and published his findings at a meeting of the Vienna Chemical Society on May 3, 1888 (F. Reinitzer: Beiträge zur Kenntniss des Cholesterins, Monatshefte für Chemie (Wien) 9, 421-441 (1888)).[2]
  • 1904: Otto Lehmann publishes his work “Flüssige Kristalle” (Liquid Crystals).
  • 1911: Charles Mauguin first experiments of liquids crystals confined between plates in thin layers.
  • 1922: Georges Friedel describes the structure and properties of liquid crystals and classified them in 3 types (nematics, smectics and cholesterics).
  • 1927: Vsevolod Frederiks devises the electrically switched light valve, called the Fréedericksz transition, the essential effect of all LCD technology.
  • 1936: The Marconi Wireless Telegraph company patents the first practical application of the technology, “The Liquid Crystal Light Valve”.
  • 1962: The first major English language publication on the subject “Molecular Structure and Properties of Liquid Crystals”, by Dr. George W. Gray.[3]
  • 1962: Richard Williams of RCA found that liquid crystals had some interesting electro-optic characteristics and he realized an electro-optical effect by generating stripe-patterns in a thin layer of liquid crystal material by the application of a voltage. This effect is based on an electro-hydrodynamic instability forming what is now called “Williams domains” inside the liquid crystal.[4]
  • 1964: George H. Heilmeier, then working in the RCA laboratories on the effect discovered by Williams achieved the switching of colours by field-induced realignment of dichroic dyes in a homeotropically oriented liquid crystal. Practical problems with this new electro-optical effect made Heilmeier continue to work on scattering effects in liquid crystals and finally the achievement of the first operational liquid crystal display based on what he called the dynamic scattering mode (DSM). Application of a voltage to a DSM display switches the initially clear transparent liquid crystal layer into a milky turbid state. DSM displays could be operated in transmissive and in reflective mode but they required a considerable current to flow for their operation.[5][6][7] George H. Heilmeier was inducted in the National Inventors Hall of Fame and credited with the invention of LCD.[8] Heilmeier’s work is an IEEE Milestone.[9]
  • 1960s: Pioneering work on liquid crystals was undertaken in the late 1960s by the UK’s Royal Radar Establishment at Malvern, England. The team at RRE supported ongoing work by George Gray and his team at the University of Hull who ultimately discovered the cyanobiphenyl liquid crystals (which had correct stability and temperature properties for application in LCDs).
  • 1970: On December 4, 1970, the twisted nematic field effect in liquid crystals was filed for patent by Hoffmann-LaRoche in Switzerland, (Swiss patent No. 532 261) with Wolfgang Helfrich and Martin Schadt (then working for the Central Research Laboratories) listed as inventors.[5] Hoffmann-La Roche then licensed the invention to the Swiss manufacturer Brown, Boveri & Cie who produced displays for wrist watches during the 1970s and also to Japanese electronics industry which soon produced the first digital quartz wrist watches with TN-LCDs and numerous other products. James Fergason while working with Sardari Arora and Alfred Saupe at Kent State University Liquid Crystal Institute filed an identical patent in the USA on April 22, 1971.[10] In 1971 the company of Fergason ILIXCO (now LXD Incorporated) produced the first LCDs based on the TN-effect, which soon superseded the poor-quality DSM types due to improvements of lower operating voltages and lower power consumption.
  • 1972: The first active-matrix liquid crystal display panel was produced in the United States by Westinghouse, in Pittsburgh, PA.[11]
  • 1983: Researchers at Brown, Boveri & Cie (BBC), Switzerland, invented the super-twisted nematic (STN) structure for passive-matrix addressed LCDs. H. Amstutz et al were listed as inventors in the corresponding patent applications filed in Switzerland on July 7, 1983, and October 28, 1983. Patents were granted in Switzerland CH 665491, Europe EP 0131216[12], US 4634229 and many more countries. Scientific details are published in the referenced article.[13]
  • 1996 Samsung develops the optical patterning technique that enables multi-domain LCD. Multi-domain and In Plane Switching subsequently remain the dominant LCD designs through 2010.[14]
  • 1997 Hitachi resurrects the In Plane Switching (IPS) technology producing the first LCD to have the visual quality acceptable for TV application.
  • 2007: In the 4Q of 2007 for the first time LCD televisions surpassed CRT units in worldwide sales.[15]
  • 2008: LCD TVs become the majority with a 50% market share of the 200 million TVs forecast to ship globally in 2008 according to Display Bank.[16]

A detailed description of the origins and the complex history of liquid crystal displays from the perspective of an insider during the early days has been published by Joseph A. Castellano in Liquid Gold: The Story of Liquid Crystal Displays and the Creation of an Industry.[17] Another report on the origins and history of LCD from a different perspective until 1991 has been published by Hiroshi Kawamoto, available at the IEEE History Center.[18]

Liquid Cristal Display

Illumination

As LCD panels produce no light of their own, they require an external lighting mechanism to be easily visible. On most displays, this consists of a cold cathode fluorescent lamp that is situated behind the LCD panel. Passive-matrix displays are usually not backlit, but active-matrix displays almost always are, with a few exceptions such as the display in the original Gameboy Advance.

Recently, two types of LED backlit displays have appeared in some televisions as an alternative to conventional backlit LCDs. In one scheme, the LEDs are used to backlight the entire LCD panel. In another scheme, a set of red, green and blue LEDs is used to illuminate a small cluster of pixels, which can improve contrast and black level in some situations. For example, the LEDs in one section of the screen can be dimmed to produce a dark section of the image while the LEDs in another section are kept bright. Both schemes also allows for a slimmer panel than on conventional displays.

Passive-matrix and active-matrix addressed LCDs

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A general purpose alphanumeric LCD, with two lines of 16 characters.

Monochrome passive-matrix LCDs were standard in most early laptops (although a few used plasma displays) and the original Nintendo Game Boy [19] until the mid-1990s, when colour active-matrix became standard on all laptops. The commercially unsuccessful Macintosh Portable (released in 1989) was one of the first to use an active-matrix display (though still monochrome). Passive-matrix LCDs are still used today for applications less demanding than laptops and TVs. In particular, portable devices with less information content to be displayed, where lowest power consumption (no backlight), low cost and/or readability in direct sunlight are needed, use this type of display.

Small monochrome displays having a passive-matrix structure are employing super-twisted nematic STN or double-layer STN (DSTN) technology (the latter of which addresses a colour-shifting problem with the former), and colour-STN (CSTN) in which colour is added by using an internal filter.

STN LCDs have been optimized for passive-matrix addressing. They exhibit a sharper threshold of the contrast-vs-voltage characteristic than the original TN LCDs. This is important because pixels are subjected to partial voltages even while not selected. Crosstalk between activated and non-activated pixels has to be handled properly by keeping the RMS voltage of non-activated pixels below the threshold voltage [20], while activated pixels are subjected to voltages above threshold [21]. STN LCDs have to be continuously refreshed by alternating pulsed voltages of one polarity during one frame and pulses of opposite polarity during the next frame. Individual pixels are addressed by the corresponding row and column circuits. This type of display is called passive-matrix addressed because the pixel must retain its state between refreshes without the benefit of a steady electrical charge. As the number of pixels (and, correspondingly, columns and rows) increases, this type of display becomes less feasible. Slow response times and poor contrast are typical of passive-matrix addressed LCDs.

New zero-power (bistable) LCDs do not require continuous refreshing. Rewriting is only required for picture information changes. Potentially, passive-matrix addressing can be used with these new devices, if their write/erase characteristics are suitable.

High-resolution colour displays such as modern LCD computer monitors and televisions use an active matrix structure. A matrix of thin-film transistors (TFTs) is added to the electrodes in contact with the LC layer. Each pixel has its own dedicated transistor, allowing each column line to access one pixel. When a row line is selected, all of the column lines are connected to a row of pixels and voltages corresponding to the picture information are driven onto all of the column lines. The row line is then deactivated and the next row line is selected. All of the row lines are selected in sequence during a refresh operation. Active-matrix addressed displays look “brighter” and “sharper” than passive-matrix addressed displays of the same size, and generally have quicker response times, producing much better images.

Active matrix technologies

A Casio 1.8 in colour TFT LCD which equips the Sony Cyber-shot DSC-P93A digital compact cameras

Main articles: Thin film transistor liquid crystal display and Active-matrix liquid crystal display

Twisted nematic (TN)

See also: twisted nematic field effect

Twisted nematic displays contain liquid crystals which twist and untwist at varying degrees to allow light to pass through. When no voltage is applied to a TN liquid crystal cell, polarized light passes through the 90-degrees twisted LC layer. In proportion to the voltage applied, the liquid crystals untwist changing the polarization and blocking the light’s path. By properly adjusting the level of the voltage almost any grey level or transmission can be achieved.

In-plane switching (IPS)

In-plane switching is an LCD technology which aligns the liquid crystals in a plane parallel to the glass substrates. In this method, the electrical field is applied through opposite electrodes on the same glass substrate, so that the liquid crystals can be reoriented (switched) in the same plane. This requires two transistors for each pixel instead of the single transistor needed for a standard thin-film transistor (TFT) display. Before LG Enhanced IPS was introduced in 2009, the additional transistors resulted in blocking more transmission area, thus requiring a brighter backlight, which consumed more power, and made this type of display less desirable for notebook computers. This newer, lower power technology can be found in the Apple iMac, iPad, and iPhone 4, as well as several Hewlett-Packard EliteBook mobile workstations. Currently Panasonic is using an enhanced version eIPS for their large size LCD-TV products.

Advanced fringe field switching (AFFS)

Known as fringe field switching (FFS) until 2003,[22] advanced fringe field switching is similar to IPS or S-IPS offering superior performance and colour gamut with high luminosity. AFFS was developed by Hydis Technologies Co., Ltd, Korea (formally Hyundai Electronics, LCD Task Force).[23]

AFFS-applied notebook applications minimize colour distortion while maintaining a wider viewing angle for a professional display. Colour shift and deviation caused by light leakage is corrected by optimizing the white gamut which also enhances white/grey reproduction.

In 2004, Hydis Technologies Co.,Ltd licensed AFFS to Japan’s Hitachi Displays. Hitachi is using AFFS to manufacture high-end panels. In 2006, HYDIS licensed AFFS to Sanyo Epson Imaging Devices Corporation.

Hydis introduced AFFS+ with improved outdoor readability in 2007. AFFS panels are mostly utilized in the cockpits of latest commercial aircraft displays.

Vertical alignment (VA)

Vertical alignment displays are a form of LCDs in which the liquid crystals naturally align vertically to the glass substrates. When no voltage is applied, the liquid crystals remain perpendicular to the substrate creating a black display between crossed polarizers. When voltage is applied, the liquid crystals shift to a tilted position allowing light to pass through and create a gray-scale display depending on the amount of tilt generated by the electric field.

Blue Phase mode

Main article: Blue Phase Mode LCD

Blue phase mode LCDs have been shown as engineering samples early in 2008, but they are not in mass-production yet. The physics of blue phase mode LCDs suggest that very short switching times (~1 ms) can be achieved, so time sequential colour control can possibly be realized and expensive colour filters would be obsolete. For details refer to Blue Phase Mode LCD.

Quality control

Some LCD panels have defective transistors, causing permanently lit or unlit pixels which are commonly referred to as stuck pixels or dead pixels respectively. Unlike integrated circuits (ICs), LCD panels with a few defective transistors are usually still usable. It is claimed that it is economically prohibitive to discard a panel with just a few defective pixels because LCD panels are much larger than ICs, but this has never been proven.[citation needed] Manufacturers’ policies for the acceptable number of defective pixels vary greatly. At one point, Samsung held a zero-tolerance policy for LCD monitors sold in Korea.[24] As of 2005, though, Samsung adheres to the less restrictive ISO 13406-2 standard.[25] Other companies have been known to tolerate as many as 11 dead pixels in their policies.[26] Dead pixel policies are often hotly debated between manufacturers and customers. To regulate the acceptability of defects and to protect the end user, ISO released the ISO 13406-2 standard.[27] However, not every LCD manufacturer conforms to the ISO standard and the ISO standard is quite often interpreted in different ways.

LCD panels are more likely to have defects than most ICs due to their larger size. For example, a 300 mm SVGA LCD has 8 defects and a 150 mm wafer has only 3 defects. However, 134 of the 137 dies on the wafer will be acceptable, whereas rejection of the LCD panel would be a 0% yield. In recent years, quality control has been improved. An SVGA LCD panel with 4 defective pixels is usually considered defective and customers can request an exchange for a new one. Some manufacturers, notably in South Korea where some of the largest LCD panel manufacturers, such as LG, are located, now have “zero defective pixel guarantee”, which is an extra screening process which can then determine “A” and “B” grade panels. Many manufacturers would replace a product even with one defective pixel. Even where such guarantees do not exist, the location of defective pixels is important. A display with only a few defective pixels may be unacceptable if the defective pixels are near each other. Manufacturers may also relax their replacement criteria when defective pixels are in the center of the viewing area.

LCD panels also have defects known as clouding (or less commonly mura), which describes the uneven patches of changes in luminance. It is most visible in dark or black areas of displayed scenes.[28]

Zero-power (bistable) displays

See also: Ferro Liquid Display

The zenithal bistable device (ZBD), developed by QinetiQ (formerly DERA), can retain an image without power. The crystals may exist in one of two stable orientations (“Black” and “White”) and power is only required to change the image. ZBD Displays is a spin-off company from QinetiQ who manufacture both grayscale and colour ZBD devices.

Kent Displays has also developed a “no power” display that uses Polymer Stabilized Cholesteric liquid crystal (ChLCD). A major drawback of ChLCD screens are their slow refresh rate, especially at low temperatures[citation needed]. Kent has recently demonstrated the use of a ChLCD to cover the entire surface of a mobile phone, allowing it to change colours, and keep that colour even when power is cut off.[29]

In 2004 researchers at the University of Oxford demonstrated two new types of zero-power bistable LCDs based on Zenithal bistable techniques.[30]

Several bistable technologies, like the 360° BTN and the bistable cholesteric, depend mainly on the bulk properties of the liquid crystal (LC) and use standard strong anchoring, with alignment films and LC mixtures similar to the traditional monostable materials. Other bistable technologies (i.e. Binem Technology) are based mainly on the surface properties and need specific weak anchoring materials.

Specifications

Important factors to consider when evaluating a Liquid Crystal Display (LCD):

  • Resolution versus Range: Fundamentally resolution is the granularity (or number of levels) with which a performance feature of the display is divided. Resolution is often confused with range or the total end-to-end output of the display. Each of the major features of a display has both a resolution and a range that are tied to each other but very different. Frequently the range is an inherent limitation of the display while the resolution is a function of the electronics that make the display work.
  • Spatial Performance LCDs come in only one size for a variety of applications and a variety of resolutions within each of those applications. LCD spatial performance is also sometimes described in terms of a “dot pitch”. The size (or spatial range) of an LCD is always described in terms of the diagonal distance from one corner to its opposite. This is a historical aspect from the early days of CRT TV when CRT screens were manufactured on the bottoms of a glass bottle. The diameter of the bottle determined the size of the screen. Later, when TVs went to a more square format, the square screens were measured diagonally to compare with the older round screens.[31]

The spatial resolution of an LCD is expressed in terms of the number of columns and rows of pixels (e.g., 1024×768). This had been one of the few features of LCD performance that was easily understood and not subject to interpretation. Each pixel is usually composed of a red, green, and blue sub pixel. However there are newer schemes to share sub-pixels among pixels and to add additional colours of sub-pixels. So going forward, spatial resolution may be more subject to interpretation.

One external factor to consider in evaluating display resolution is the resolution of your own eyes. For a normal person with 20/20 vision, the resolution of your eyes is about one minute of arc. In practical terms that means for an older standard definition TV set the ideal viewing distance was about 8 times the height (not diagonal) of the screen away. At that distance the individual rows of pixels merge into a solid. If you were closer to the screen than that, you would be able to see the individual rows of pixels. If you are further away, the image of the rows of pixels still merge, but the total image becomes smaller as you get further away. For an HDTV set with slightly more than twice the number of rows of pixels, the ideal viewing distance is about half what it is for a standard definition set. The higher the resolution, the closer you can sit to the set or the larger the set can usefully be sitting at the same distance as an older standard definition display.

For a computer monitor or some other LCD that is being viewed from a very close distance, resolution is often expressed in terms of dot pitch or pixels per inch. This is consistent with the printing industry (another form of a display). Magazines, and other premium printed media are often at 300 dots per inch. As with the distance discussion above, this provides a very solid looking and detailed image. LCDs, particularly on mobile devices, are frequently much less than this as the higher the dot pitch, the more optically inefficient the display and the more power it burns. Running the LCD is frequently half, or more, of the power consumed by a mobile device.

An additional consideration in spatial performance are viewing cone and aspect ratio. The Aspect ratio is the ratio of the width to the height (for example, 4:3, 5:4, 16:9 or 16:10). Older, standard definition TVs were 4:3. Newer, HDTV’s are 16:9 as are most new notebook computers. Movies are often filmed in much different (wider) aspect ratios which is why there will frequently still be black bars at the top and bottom of a HDTV screen.

The Viewing Angle of an LCD may be important depending on its use or location. The viewing angle is usually measured as the angle where the contrast of the LCD falls below 10:1. At this point, the colours usually start to change and can even invert, red becoming green and so forth. Viewing angles for LCDs used to be very restrictive however, improved optical films have been developed that give almost 180 degree viewing angles from left to right. Top to bottom viewing angles may still be restrictive, by design, as looking at an LCD from an extreme up or down angle is not a common usage model and these photons are wasted. Manufacturers commonly focus the light in a left to right plane to obtain a brighter image here.

  • Temporal/Timing Performance: Contrary to spatial performance, temporal performance is a feature where smaller is better. Specifically, the range is the pixel response time of an LCD, or how quickly you can change a sub-pixel’s brightness from one level to another. For LCD monitors, this is measured in btb (black to black) or gtg (gray to gray). These different types of measurements make comparison difficult.[32] Further, this number is almost never published in sales advertising.

Refresh rate or the temporal resolution of an LCD is the number of times per second in which the display draws the data it is being given. Since activated LCD pixels do not flash on/off between frames, LCD monitors exhibit no refresh-induced flicker, no matter how low the refresh. rate.[33] High-end LCD televisions now feature up to 240 Hz refresh rate, which requires advanced digital processing to insert additional interpolated frames between the real images to smooth the image motion. However, such high refresh rates may not be actually supported by pixel response times and the result can be visual artifacts that distort the image in unpleasant ways.

Temporal performance can be further taxed if it is a 3D display. 3D displays work by showing a different series of images to each eye, alternating from eye to eye. For a 3D display it must display twice as many images in the same period of time as a conventional display and consequently the response time of the LCD becomes more important. 3D LCDs with marginal response times, will exhibit image smearing.

The temporal resolution of human perception is about 1/100th of a second[citation needed]. It is actually greater in your black and white vision (rod cells) than in colour vision (cone cells). You are more able to see flicker or any sort of temporal distortion in a display image by not looking directly at it as your rods are mostly grouped at the periphery of your vision.

  • Colour Performance There are many terms to describe colour performance of an LCD. They include colour gamut which is the range of colours that can be displayed and colour depth which is the colour resolution or the resolution or fineness with which the colour range is divided. Although colour gamut can be expressed as three pairs of numbers, the XY coordinates within colour space of the reddest red, greenest green, and bluest blue, it is usually expressed as a ratio of the total area within colour space that a display can show relative to some standard such as saying that a display was “120% of NTSC”. NTSC is the National Television Standards Committee, the old standard definition TV specification. Colour gamut is a relatively straight forward feature. However with clever optical techniques that are based on the way humans see colour, termed colour stretch,[34] colours can be shown that are outside of the nominal range of the display. In any case, colour range is rarely discussed as a feature of the display as LCDs are designed to match the colour ranges of the content that they are intended to show. Having a colour range that exceeds the content is a useless feature.

Colour Depth or colour support is sometimes expressed in bits, either as the number of bits per sub-pixel or the number of bits per pixel. This can be ambiguous as an 8-bit colour LCD can be 8 total bits spread between red, green, and blue or 8 bits each for each colour in a different display. Further, LCDs sometimes use a technique called dithering which is time averaging colours to get intermediate colours such as alternating between two different colours to get a colour in between. This doubles the number of colours that can be displayed; however this is done at the expense of the temporal performance of the display. Dithering is commonly used on computer displays where the images are mostly static and the temporal performance is unimportant.

When colour depth is reported as colour support, it is usually stated in terms of number of colours the LCD can show. The number of colours is the translation from the base 2-bit numbers into common base-10. For example, s 8-bit, in common terms means 2 to the 8th power or 256 colours. 8-bits per colour or 24-bits would be 256 x 256 x 256 or over 16 Million colours. The colour resolution of the human eye depends on both the range of colours being sliced and the number of slices; but for most common displays the limit is about 28-bit colour. LCD TVs commonly display more than that as the digital processing can introduce colour distortions and the additional levels of colour are needed to ensure true colours.

There are additional aspects to LCD colour and colour management such as white point and gamma correction which basically describe what colour white is and how the other colours are displayed relative to white. LCD televisions also frequently have facial recognition software which recognizes that an image on the screen is a face and both adjust the colour and the focus differently from the rest of the image. These adjustments can have important impact to the consumer but are not easily quantifiable; people like what they like and everyone does not like the same thing. There is no substitute for looking at the LCD you are going to buy before buying it. Portrait film, another form of display, has similar adjustments built in to it. Many years ago, Kodak had to overcome initial rejection of its portrait film in Japan because of these adjustments. In the US, people generally prefer a more colour facial image than is reality (higher colour saturation). In Japan, consumers generally prefer a less saturated image. The film that Kodak initially sent to Japan was biased in exactly the wrong direction for Japanese consumers. TV sets have their built in biases as well.

  • Brightness and Contrast ratio: Contrast ratio is the ratio of the brightness of a full-on pixel to a full-off pixel and, as such, would be directly tied to brightness if not for the invention of the blinking backlight (or burst dimming). The LCD itself is only a light valve, it does not generate light; the light comes from a backlight that is either a florescent tube or a set of LEDs. The blinking backlight was developed to improve the motion performance of LCDs by turning the backlight off while the liquid crystals were in transition from one image to another. However, a side benefit of the blinking backlight was infinite contrast. The contrast reported on most LCDs is what the LCD is qualified at, not its actual performance. In any case, there are two large caveats to contrast ratio as a measure of LCD performance.

The first caveat is that contrast ratios are measured in a completely dark room. In actual use, the room is never completely dark as you will always have the light from the LCD itself. Beyond that, there may be sunlight coming in through a window or other room lights that reflect off of the surface of the LCD and degrade the contrast. As a practical matter, the contrast of an LCD, or any display, is governed by the amount of surface reflections not by the performance of the display.

The second caveat is that the human eye can only image a contrast ratio of a maximum of about 200:1. Black print on a white paper is about 15-20:1. That is why viewing angles are specified to the point where the fall below 10:1. A 10:1 image is not great, but is discernable.

Brightness is usually stated as the maximum output of the LCD. In the CRT era, Trinitron CRTs had a brightness advantage over the competition so brightness was commonly discussed in TV advertising. With current LCD technology, brightness, though important, is usually the same from maker to maker and is consequently not discussed much except for notebook LCDs and other displays that will be viewed in bright sunlight. In general, brighter is better but there is always a trade-off between brightness and battery life in a mobile device.

Military use of LCD monitors

LCD monitors have been adopted by the United States of America military instead of CRT displays because they are smaller, lighter and more efficient, although monochrome plasma displays are also used, notably for their M1 Abrams tanks. For use with night vision imaging systems a US military LCD monitor must be compliant with MIL-L-3009 (formerly MIL-L-85762A). These LCD monitors go through extensive certification so that they pass the standards for the military. These include MIL-STD-901D – High Shock (Sea Vessels), MIL-STD-167B – Vibration (Sea Vessels), MIL-STD-810F – Field Environmental Conditions (Ground Vehicles and Systems), MIL-STD-461E/F – EMI/RFI (Electromagnetic Interference/Radio Frequency Interference), MIL-STD-740B – Airborne/Structureborne Noise, and TEMPEST – Telecommunications Electronics Material Protected from Emanating Spurious Transmissions.[35]

Advantages and disadvantages of LCD

LCD

Further information: Comparison CRT, LCD, Plasma

Pros:

  • Very compact and light.
  • Low power consumption.
  • No geometric distortion.
  • Little or no flicker depending on backlight technology.
  • Not affected by screen burn-in.
  • No high voltage or other hazards present during repair/service.
  • Can be made in almost any size or shape.
  • No theoretical resolution limit.

Cons:

  • Limited viewing angle, causing colour, saturation, contrast and brightness to vary, even within the intended viewing angle, by variations in posture.
  • Bleeding and uneven backlighting in some monitors, causing brightness distortion, especially toward the edges.
  • Smearing and ghosting artifacts caused by slow response times (>8 ms) and “sample and hold” operation.
  • Only one native resolution. Displaying resolutions either requires a video scaler, lowering perceptual quality, or display at 1:1 pixel mapping, in which images will be physically too large or won’t fill the whole screen.
  • Fixed bit depth, many cheaper LCDs are only able to display 262,000 colours. 8-bit S-IPS panels can display 16 million colours and have significantly better black level, but are expensive and have slower response time.
  • Input lag
  • Dead or stuck pixels may occur either during manufacturing or through use.
  • In a constant on situation, thermalization may occur, which is when only part of the screen has overheated and therefore looks discoloured compared to the rest of the screen.
  • Not all LCDs are designed to allow easy replacement of the backlight.
  • Cannot be used with light guns/pens.

See also

  • LCD classification
  • LCD projector
  • List of liquid crystal display manufacturers

Some of the important Liquid Crystal Display (or LCD) manufacturers include Acer; Apple;BenQ;HP;Samsung Electronics; and Viewsonic. An LCD is a thin, flat panel used for electronically displaying information such as text, images, and moving pictures. For a more complete list, see below:

  • Topwaydisplay
  • Moser Baer
  • 3M
  • Acer
  • AOC
  • Apple
  • ASUSTek
  • AU Optronics
  • Bang & Olufsen
  • Barco
  • BenQ
  • Boe Hydis (Formerly Hyundai Displays Korea)
  • Chi Mei Optoelectronics
  • CoolTouch Monitors
  • Corning Inc.
  • Dell
  • Eizo
  • Epson
  • Fujitsu
  • Hansol
  • Hitachi
  • HP
  • iiyama
  • International Display Works
  • JVC
  • Kyocera
  • Lenovo
  • LG Display
  • LXD Incorporated
  • Logic Technologies Ltd[1]
  • Medion
  • NEC Display Solutions
  • Panasonic (formerly Matsushita)
  • Planar Systems
  • Polaroid Corporation
  • ProScan
  • San Technology
  • Samsung Electronics
  • Sharp Corporation
  • S-LCD
  • Sony
  • Toshiba
  • USEI
  • Varitronix Limited
  • Videocon
  • Viewsonic
  • Vizio
  • Wintek
  • Xerox

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